Silver Metallization Stability Reliability by Adams Daniel (17 results)
Language: English
Published by Springer, 2007
Series: Engineering Materials and Processes, Book 7 of 29. Book 7 of 29 - Engineering Materials and Processes
- Hardcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
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Language: English
Published by Springer, 2007
Series: Engineering Materials and Processes, Book 7 of 29. Book 7 of 29 - Engineering Materials and Processes
- Hardcover
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Language: English
Published by Springer, 2007
Series: Engineering Materials and Processes, Book 7 of 29. Book 7 of 29 - Engineering Materials and Processes
- Hardcover
Seller: SMASS Sellers, IRVING, TX, U.S.A.SMASS Sellers
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Language: English
Published by Springer, 2007
Series: Engineering Materials and Processes, Book 7 of 29. Book 7 of 29 - Engineering Materials and Processes
- Hardcover
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Language: English
Published by Springer, 2007
Series: Engineering Materials and Processes, Book 7 of 29. Book 7 of 29 - Engineering Materials and Processes
- Hardcover
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Language: English
Published by Springer, 2012
Series: Engineering Materials and Processes, Book 7 of 29. Book 7 of 29 - Engineering Materials and Processes
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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Language: English
Published by Springer, 2012
Series: Engineering Materials and Processes, Book 7 of 29. Book 7 of 29 - Engineering Materials and Processes
- Softcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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Paperback. Condition: Brand New. 135 pages. 8.90x6.00x0.30 inches. In Stock.
Language: English
Published by Springer Verlag, 2008
Series: Engineering Materials and Processes, Book 7 of 29. Book 7 of 29 - Engineering Materials and Processes
- Hardcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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Hardcover. Condition: Brand New. 1st edition. 123 pages. 9.25x6.25x0.50 inches. In Stock.
Language: English
Published by Springer, 2007
Series: Engineering Materials and Processes, Book 7 of 29. Book 7 of 29 - Engineering Materials and Processes
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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Language: English
Published by Springer, 2012
Series: Engineering Materials and Processes, Book 7 of 29. Book 7 of 29 - Engineering Materials and Processes
- Softcover
Seller: preigu, Osnabrück, Germanypreigu
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Taschenbuch. Condition: Neu. Silver Metallization | Stability and Reliability | Daniel Adams (u. a.) | Taschenbuch | Engineering Materials and Processes | xii | Englisch | 2012 | Springer | EAN 9781849967051 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]sp…ringer[dot]com | Anbieter: preigu.
Language: English
Published by Springer, 2012
Series: Engineering Materials and Processes, Book 7 of 29. Book 7 of 29 - Engineering Materials and Processes
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Silver has the lowest resistivity of all metals, which makes it an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to a…ddress the thermal and electrical stability, as well as processing issues which, to date, have prevented the implementation of silver as an interconnect metal. Silver Metallization: Stability and Reliability is the first book to discuss current knowledge of silver metallization and its potential as a favorable candidate for implementation as a future interconnect material for integrated circuit technology.Silver Metallization: Stability and Reliability provides detailed information on a wide range of experimental, characterization and analysis techniques. It also presents the novel approaches used to overcome the thermal and electrical stability issues associated with silver metallization. Readers will learn about the: - preparation and characterization of elemental silver thin films and silver-metal alloys; - formation of diffusion barriers and adhesion promoters; - evaluation of the thermal stability of silver under different annealing conditions; - evaluation of the electrical properties of silver thin films under various processing conditions; - methods of dry etching of silver lines and the integration of silver with low-k dielectric materials. As a valuable resource in this emerging field; Silver Metallization: Stability and Reliability will be very useful to students, scientists, engineers and technologists in the fields of integrated circuits and microelectronics research and development.
Language: English
Published by Springer London, 2007
Series: Engineering Materials and Processes, Book 7 of 29. Book 7 of 29 - Engineering Materials and Processes
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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£ 99.10
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Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Silver has the lowest resistivity of all metals, which makes it an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address…the thermal and electrical stability, as well as processing issues which, to date, have prevented the implementation of silver as an interconnect metal. Silver Metallization: Stability and Reliability is the first book to discuss current knowledge of silver metallization and its potential as a favorable candidate for implementation as a future interconnect material for integrated circuit technology.Silver Metallization: Stability and Reliability provides detailed information on a wide range of experimental, characterization and analysis techniques. It also presents the novel approaches used to overcome the thermal and electrical stability issues associated with silver metallization. Readers will learn about the: - preparation and characterization of elemental silver thin films and silver-metal alloys; - formation of diffusion barriers and adhesion promoters; - evaluation of the thermal stability of silver under different annealing conditions; - evaluation of the electrical properties of silver thin films under various processing conditions; - methods of dry etching of silver lines and the integration of silver with low-k dielectric materials. As a valuable resource in this emerging field; Silver Metallization: Stability and Reliability will be very useful to students, scientists, engineers and technologists in the fields of integrated circuits and microelectronics research and development.
Language: English
Published by Springer, 2011
Series: Engineering Materials and Processes, Book 7 of 29. Book 7 of 29 - Engineering Materials and Processes
- Softcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
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£ 152.00
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Paperback. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Language: English
Published by Springer, 2007
Series: Engineering Materials and Processes, Book 7 of 29. Book 7 of 29 - Engineering Materials and Processes
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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£ 177.99
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Condition: As New. Unread book in perfect condition.
Language: English
Published by Springer, 2007
Series: Engineering Materials and Processes, Book 7 of 29. Book 7 of 29 - Engineering Materials and Processes
- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
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£ 170.00
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Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Language: English
Published by Springer, 2007
Series: Engineering Materials and Processes, Book 7 of 29. Book 7 of 29 - Engineering Materials and Processes
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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£ 204.11
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Condition: As New. Unread book in perfect condition.
Language: English
Published by Springer London, 2007
Series: Engineering Materials and Processes, Book 7 of 29. Book 7 of 29 - Engineering Materials and Processes
- Hardcover
- Print on Demand
Seller: moluna, Greven, Germanymoluna
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£ 81.73
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Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. First book to discuss current knowledge of silver metallization and its potential as a favourable candidate for implementation as a future interconnect material for integrated circuit technologyValuable reso…urce in this emerging fieldProvid.
