Language: English
Published by John Wiley & Sons Inc--Halsted Press, 1972
ISBN 10: 0470138521 ISBN 13: 9780470138526
Seller: Small World Books, Rochester, NY, U.S.A.
First Edition
Hardcover. Condition: Very Good. Dust Jacket Condition: Very Good. 1st American Edition. Dark covers with white lettering on spine. Former owner's name on front cover and thin brown line going down front endpaper probably caused by dust jacket's edge. Silver dust jacket with black lettering.
Condition: Fair. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Clean from markings. In fair condition, suitable as a study copy. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,450grams, ISBN:0333138317.
Hardcover. Condition: Very Good. Dust Jacket Condition: Very Good. hardback book and dust jacket in very good condition.
Soft cover. Condition: Very Good. 2nd Edition. No inscriptions and very little use. A clean, tight copy of xvi. 492pp.
Language: English
Published by John Wiley & Sons, New York, 1986
ISBN 10: 0470206942 ISBN 13: 9780470206942
Seller: Take Five Books, Ashland, OR, U.S.A.
Hardcover. Condition: Very Good. Dust Jacket Condition: Very Good. Second Edition. Expedited or International shipping may cost more.
Seller: ThriftBooks-Dallas, Dallas, TX, U.S.A.
Hardcover. Condition: Good. No Jacket. Former library book; Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Seller: California Books, Miami, FL, U.S.A.
Condition: New.
Condition: Fair. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In fair condition, suitable as a study copy. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,550grams, ISBN:9780333694657.
Condition: Fair. This is an ex-library book and may have the usual library/used-book markings inside.This book has soft covers. In fair condition, suitable as a study copy. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,800grams, ISBN:9780333405871.
Condition: Poor. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. In poor condition, suitable as a reading copy. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,550grams, ISBN:9780333694657.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Seller: Ria Christie Collections, Uxbridge, United Kingdom
£ 30.70
Quantity: Over 20 available
Add to basketCondition: New. In.
Condition: Very Good. Most items will be dispatched the same or the next working day. A copy that has been read, but is in excellent condition. Pages are intact and not marred by notes or highlighting. The spine remains undamaged.
Condition: Good. Most items will be dispatched the same or the next working day. A copy that has been read but remains in clean condition. All of the pages are intact and the cover is intact and the spine may show signs of wear. The book may have minor markings which are not specifically mentioned.
Language: English
Published by Cambridge University Press 2014-05, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Seller: Chiron Media, Wallingford, United Kingdom
PF. Condition: New.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Condition: New.
Language: English
Published by Cambridge University Press CUP, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Seller: Books Puddle, New York, NY, U.S.A.
Condition: New. pp. 422.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Seller: Kennys Bookstore, Olney, MD, U.S.A.
Condition: New.
Condition: Buone. inglese Condizioni dell'esterno: Discrete con difetti, strappi Condizioni dell'interno: Buone.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Seller: AHA-BUCH GmbH, Einbeck, Germany
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects.
Language: English
Published by Cambridge University Press, Cambridge, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Seller: Grand Eagle Retail, Bensenville, IL, U.S.A.
Paperback. Condition: new. Paperback. The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Seller: Revaluation Books, Exeter, United Kingdom
Paperback. Condition: Brand New. 1st edition. 422 pages. 8.90x6.00x1.00 inches. In Stock. This item is printed on demand.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
£ 34.53
Quantity: Over 20 available
Add to basketPaperback / softback. Condition: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Seller: Majestic Books, Hounslow, United Kingdom
Condition: New. Print on Demand pp. 422.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Seller: Biblios, Frankfurt am main, HESSE, Germany
Condition: New. PRINT ON DEMAND pp. 422.
Language: English
Published by Cambridge University Press, Cambridge, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Seller: CitiRetail, Stevenage, United Kingdom
Paperback. Condition: new. Paperback. The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
Language: English
Published by Cambridge University Press, 2012
ISBN 10: 1107409225 ISBN 13: 9781107409224
Seller: moluna, Greven, Germany
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.KlappentextThe MRS Symposium Proceeding series is an internationally recognised reference suitable for research.
Language: English
Published by Cambridge University Press, Cambridge, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
Seller: AussieBookSeller, Truganina, VIC, Australia
Paperback. Condition: new. Paperback. The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This item is printed on demand. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.