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Reliability Yield Problems Wire by Harman George (9 results)
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Reliability and Yield Problems of Wire Bonding in Microelectronics : The Application of Materials and Interface Science
Language: English
Published by International Society for Hybrid Microelectronics, 1989
ISBN 10: 0930815254 ISBN 13: 9780930815257
Condition: Good. Used book that is in clean, average condition without any missing pages.
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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Language: English
Published by Intl Society of Hybrid, 1989
ISBN 10: 0930815254 ISBN 13: 9780930815257
Hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Language: English
Published by Intl Society of Hybrid, 1989
ISBN 10: 0930815254 ISBN 13: 9780930815257
Hardcover. Condition: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.
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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Language: English
Published by Intl Society of Hybrid, 1989
ISBN 10: 0930815254 ISBN 13: 9780930815257
Condition: good.
-
Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Language: English
Published by Reston, Virginia, U.S.A.: Intl Society of Hybrid, 1989
ISBN 10: 0930815254 ISBN 13: 9780930815257
Hardcover. Condition: Fine. hardback book in fine condition.
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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Language: English
Published by Reston, Virginia, U.S.A.: Intl Society of Hybrid, 1989
ISBN 10: 0930815254 ISBN 13: 9780930815257
Hardcover. Condition: Fine. hardback book in fine condition.
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1989 HC Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Language: English
Published by Intl Society of Hybrid, 1989
ISBN 10: 0930815254 ISBN 13: 9780930815257
hardcover. Condition: Very Good. Dust Jacket Condition: DUST JACKET. Pages are crisp and clean, no marking. Cover is verygood. Binding is tight/good.
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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Language: English
Published by Intl Society of Hybrid, 1989
ISBN 10: 0930815254 ISBN 13: 9780930815257
Hardcover.
-
Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Language: English
Published by Intl Society of Hybrid, 1989
ISBN 10: 0930815254 ISBN 13: 9780930815257
Hardcover. Condition: New. In shrink wrap. Looks like an interesting title!
