Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science - Hardcover
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Reliability and Yield Problems of Wire Bonding in Microelectronics : The Application of Materials and Interface Science
Published by
International Society for Hybrid Microelectronics, 1989
ISBN 10: 0930815254
ISBN 13: 9780930815257
Used
Hardcover
Seller: Better World Books, Mishawaka, IN, U.S.A.
Seller rating 5 out of 5 stars
Condition: Good. Used book that is in clean, average condition without any missing pages. Seller Inventory # 5475174-6
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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Seller: HPB-Red, Dallas, TX, U.S.A.
Seller rating 5 out of 5 stars
Hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority! Seller Inventory # S_322936498
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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Seller: ThriftBooks-Dallas, Dallas, TX, U.S.A.
Seller rating 5 out of 5 stars
Hardcover. Condition: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less. Seller Inventory # G0930815254I4N00
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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Seller: savehere619, San Diego, CA, U.S.A.
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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Published by
Reston, Virginia, U.S.A.: Intl Society of Hybrid, 1989
ISBN 10: 0930815254
ISBN 13: 9780930815257
Used
Hardcover
Seller: Bingo Books 2, Vancouver, WA, U.S.A.
Seller rating 5 out of 5 stars
Hardcover. Condition: Fine. hardback book in fine condition. Seller Inventory # 123284
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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Published by
Reston, Virginia, U.S.A.: Intl Society of Hybrid, 1989
ISBN 10: 0930815254
ISBN 13: 9780930815257
Used
Hardcover
Seller: Bingo Books 2, Vancouver, WA, U.S.A.
Seller rating 5 out of 5 stars
Hardcover. Condition: Fine. hardback book in fine condition. Seller Inventory # 122444
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1989 HC Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Seller: Miki Store, San Jose, CA, U.S.A.
Seller rating 5 out of 5 stars
hardcover. Condition: Very Good. Dust Jacket Condition: DUST JACKET. Pages are crisp and clean, no marking. Cover is verygood. Binding is tight/good. Seller Inventory # hb-bs23
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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Seller: The Book Spot, Sioux Falls, MN, U.S.A.
Seller rating 4 out of 5 stars
Hardcover. Seller Inventory # Abebooks229761
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Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Seller: BennettBooksLtd, Los Angeles, CA, U.S.A.
Seller rating 5 out of 5 stars
Hardcover. Condition: New. In shrink wrap. Looks like an interesting title! Seller Inventory # Q-0930815254