Seller: Zubal-Books, Since 1961, Cleveland, OH, U.S.A.
Condition: Good. *Price HAS BEEN REDUCED by 10% until Tuesday, May 26 (holiday sale item)* 440 pp., hardcover, ex library, else text and binding clean and tight. - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country.
Seller: Phatpocket Limited, Waltham Abbey, HERTS, United Kingdom
Condition: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.
Language: English
Published by Longman Scientific and Technical, 1995
ISBN 10: 0582087821 ISBN 13: 9780582087828
Seller: Anybook.com, Lincoln, United Kingdom
Condition: Poor. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Clean from markings. In poor condition, suitable as a reading copy. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,800grams, ISBN:9780582087828.
Language: English
Published by LAP LAMBERT Academic Publishing, 2016
ISBN 10: 3659833363 ISBN 13: 9783659833366
Seller: Revaluation Books, Exeter, United Kingdom
Paperback. Condition: Brand New. 212 pages. 8.66x5.91x0.48 inches. In Stock.
Language: English
Published by LAP LAMBERT Academic Publishing, 2016
ISBN 10: 3659833363 ISBN 13: 9783659833366
Seller: Books Puddle, New York, NY, U.S.A.
Condition: New.
Language: English
Published by LAP LAMBERT Academic Publishing, 2016
ISBN 10: 3659833363 ISBN 13: 9783659833366
Seller: preigu, Osnabrück, Germany
Taschenbuch. Condition: Neu. Polymer Composites for Microelectronic Applications | Micro-sized Particulate Filled Polymer Composites | Alok Agrawal (u. a.) | Taschenbuch | 212 S. | Englisch | 2016 | LAP LAMBERT Academic Publishing | EAN 9783659833366 | Verantwortliche Person für die EU: BoD - Books on Demand, In de Tarpen 42, 22848 Norderstedt, info[at]bod[dot]de | Anbieter: preigu.
Language: English
Published by Nova Science Publishers, Incorporated, 2010
ISBN 10: 1608769992 ISBN 13: 9781608769995
Seller: Books Puddle, New York, NY, U.S.A.
Condition: New. pp. xvii + 282 Index.
Language: English
Published by Nova Science Publishers, Incorporated, 2010
ISBN 10: 1608769992 ISBN 13: 9781608769995
Seller: Majestic Books, Hounslow, United Kingdom
Condition: New. pp. xvii + 282 Illus.
Language: English
Published by Nova Science Publishers, Incorporated, 2010
ISBN 10: 1608769992 ISBN 13: 9781608769995
Seller: Biblios, Frankfurt am main, HESSE, Germany
Condition: New. pp. xvii + 282.
Language: English
Published by LAP LAMBERT Academic Publishing, 2016
ISBN 10: 3659833363 ISBN 13: 9783659833366
Seller: Majestic Books, Hounslow, United Kingdom
Condition: New. Print on Demand.
Language: English
Published by LAP LAMBERT Academic Publishing, 2016
ISBN 10: 3659833363 ISBN 13: 9783659833366
Seller: Biblios, Frankfurt am main, HESSE, Germany
Condition: New. PRINT ON DEMAND.
Language: English
Published by LAP LAMBERT Academic Publishing, 2016
ISBN 10: 3659833363 ISBN 13: 9783659833366
Seller: AHA-BUCH GmbH, Einbeck, Germany
Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - The objective of the book is to report on the possibility of using ceramic fillers in polymers to make composites suitable for microelectronic applications. The first part of the book is on the development of theoretical heat conduction models for estimation of effective thermal conductivity of such polymer composites with single/hybrid fillers. The second part has provided the description of the materials used, routes adopted to fabricate the various composites and the details of the experiments. The last part has emphasized on the physical, mechanical, thermal and dielectric characteristics of all the epoxy and polypropylene based composites filled with single filler i.e. micro-sized AlN/Al2O3. A comparative evaluation of the effects of premixing of solid glass microspheres with AlN/Al2O3 is also presented. The polymer composites developed with enhanced thermal conductivity, improved glass transition temperature, reduced thermal expansion coefficient and modified dielectric constant are expected to have adequate potential for a wide variety of applications particularly in microelectronic industries like electronic packaging, encapsulations, printed circuit board substrates etc.