Polymer Composites for Microelectronic Applications : Micro-sized Particulate Filled Polymer Composites

Language: English

Published by LAP LAMBERT Academic Publishing, 2016

3659833363 / 9783659833366

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Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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nach der Bestellung gedruckt Neuware - Printed after ordering - The objective of the book is to report on the possibility of using ceramic fillers in polymers to make composites suitable for microelectronic applications. The first part of the book is on the development of theoretical heat conduction models for estimation of effective thermal conductivity of such polymer composites with single/hybrid fillers. The second part has provided the description of the materials used, routes adopted to fabricate the various composites and the details of the experiments. The last part has emphasized on the physical, mechanical, thermal and dielectric characteristics of all the epoxy and polypropylene based composites filled with single filler i.e. micro-sized AlN/Al2O3. A comparative evaluation of the effects of premixing of solid glass microspheres with AlN/Al2O3 is also presented. The polymer composites developed with enhanced thermal conductivity, improved glass transition temperature, reduced thermal expansion coefficient and modified dielectric constant are expected to have adequate potential for a wide variety of applications particularly in microelectronic industries like electronic packaging, encapsulations, printed circuit board substrates etc.

Seller Inventory # 9783659833366

Title
Polymer Composites for Microelectronic Applications : Micro-sized Particulate Filled Polymer Composites
Author
Alok Agrawal
Publisher
LAP LAMBERT Academic Publishing
Publication year
2016
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
3659833363
ISBN 13
9783659833366
Item weight
334 grams
Dimensions
220x150x13 mm

AHA-BUCH GmbH

Einbeck, Germany

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AbeBooks seller since August 14, 2006

Shipping rates from Germany to U.S.A.

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