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Optoelectronic Packaging (25 results)
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Optoelectronic Packaging
Seller: 3Brothers Bookstore, Egg harbor township, NJ, U.S.A.
Seller rating 5 out of 5 stars
Condition: very_good. Cover may have light wear, pages in very good condition and binding is sturdy; may have other light shelf wear or creases. May have notes or highlighting.
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Optoelectronic Packaging (Wile
Seller: World of Books (was SecondSale), Montgomery, IL, U.S.A.
Seller rating 5 out of 5 stars
Condition: Good. Item in good condition. Textbooks may not include supplemental items i.e. CDs, access codes etc.
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hardcover. Condition: Very Good. Very Good condition.Crisp pages. Clean cover and pages. Book shows minimal shelf wear. No highlighting/marking. Not Satisfied? Contact us to get a refund.
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Hardcover. Condition: Fair. No Jacket. Readable copy. Pages may have considerable notes/highlighting. ~ ThriftBooks: Read More, Spend Less.
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Optoelectronic Packaging
Seller: Goodwill of Silicon Valley, SAN JOSE, CA, U.S.A.
Seller rating 5 out of 5 stars
Condition: very_good. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in very good condition! The cover and any other included accessories are also in very good condition showing some minor use. The spine is straight, there are no rips tears or creases on the cover or the pages.
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Materials in Microelectronic and Optoelectronic Packaging. Ceramic Transactions Volume 33
Language: English
Published by Columbus: The American Ceramic Society, 1993
ISBN 10: 0944904637 ISBN 13: 9780944904633
Seller: Zubal-Books, Since 1961, Cleveland, OH, U.S.A.
Seller rating 5 out of 5 stars
Condition: Fine. *Price HAS BEEN REDUCED by 10% until Monday, May 18 (weekend SALE item)* 471 pp., hardcover, THIS IS A BRAND NEW, NEVER-OPENED BOOK!! - If you are reading this, this item is actually (physically) in our stock and ready for shipment once ordered. We are not bookjackers. Buyer is responsible for any additional duties, taxes, or fees required by recipient's country.
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Optoelectronic packaging: 1-2 February 1996, San Jose, California (Proceedings / SPIE--the International Society for Optical Engineering) - Volume 2691
Published by The International Society of Optical Engineering (SPIE), 1996
Soft cover. Condition: Very Good. Has former owner's name on front cover. Otherwise, pristine. Volume 2691. February 1-2, 1996 in San Jose, California. Michael R. Feldman and Yung-Cheng Lee (Chairs/Editors). (BR) Box 63.
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Optoelectronic packaging : optische Netze - Komponenten - Aufbautechniken - Faser-Chip-Kopplung.
Language: German
Published by Berlin ; Offenbach : VDE-Verl., 2002
ISBN 10: 380072572X ISBN 13: 9783800725724
Seller: Wissenschaftliches Antiquariat Köln Dr. Sebastian Peters UG, Köln, Germany
Seller rating 5 out of 5 stars
Condition: sehr gut. 313 S., Abb., 21 cm. Sprache: Deutsch.
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Hardcover. Ehem. Bibliotheksexemplar mit Bib.-Signatur und Stempel in GUTEM Zustand. Kaum Gebrauchsspuren. Sprache: Englisch Gewicht in Gramm: 550.
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Optoelectronic Packaging
Language: English
Published by JOHN WILEY & SONS INC, 1997
ISBN 10: 0471111880 ISBN 13: 9780471111887
Condition: Sehr gut. Zustand: Sehr gut | Seiten: 280 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.
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Hardcover. Condition: New.
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Condition: New. pp. 280.
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Hardcover. Condition: New.
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Semiconductor optoelectronic device packaging process (with DVD disc 1)(Chinese Edition)
Language: Chinese
Published by Publishing House of Electronics Industry, 1905
ISBN 10: 712112887X ISBN 13: 9787121128875
paperback. Condition: New. Paperback. Pub Date: 2011 Jun Pages: 95 Publisher: Electronic Industry Press semiconductor optoelectronic device packaging process (with DVD disc 1) for the entire semiconductor optoelectronic device package with the conditions and process are described. including: optoelectronic devices package specification. the process of expanding crystal mounted process. the lead welding process. device packaging technology. testing and packaging of the product six projects are done on semiconductor opto.
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LED packaging technology base and job tasks to resolve technical and vocational education . second five curriculum reform planning materials Optoelectronic Technology ( Information ) category(Chinese Edition)
Language: Chinese
Published by Huazhong University of Science and Technology Press, 2013
ISBN 10: 7560990673 ISBN 13: 9787560990675
paperback. Condition: New. Ship out in 2 business day, And Fast shipping, Free Tracking number will be provided after the shipment.Paperback. Pub Date :2013-08-01 Pages: 216 Language: Chinese Publisher: Huazhong University of Science and Technology Publishing House LED packaging technology base and job tasks to resolve technical and vocational education . second five curriculum reform planning materials Optoelectronic Technology ( Information ) class contains two parts: the first part introduces the basic concepts of the various aspects of LED industry chain and basic knowledge of the specific content including the LED s.Four Satisfaction guaranteed,or money back.
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International EditionMICRO AND OPTOELECTRONIC MATERIALS AND STRUCTURES: PHYSICS, MECHANICS, DESIGN, RELIABILITY, PACKAGING, VOLUMES 1
Published by SPRINGER, 2007
Hardcover. Condition: New. Brand New ! Fast Delivery "International Edition " and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 4-6 Working days .and we do have flat rate for up to 2LB. Extra shipping charges will be requested This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability.
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Hardcover. Condition: New. Hardcover Pages Number: 433 Language: Chinese. Semiconductor Science and Technology Series: Optoelectronic devices microwave packaging and testing (2nd Edition) summary of years of work experience and recent research results. the system introduces high-speed optoelectronic devices test a total of 12 chapters. and practical techniques for microwave packaging design. advanced. academic and practical both the book and includes a semiconductor laser light modulation device and a photodetector thr.
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paperback. Condition: New. Language:Chinese.Paperback. Publisher: Science out.
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Condition: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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Condition: New. Brand New Original US Edition. Customer service! Satisfaction Guaranteed.
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Micro And Optoelectronic Materials And Structures: Physics, Mechanics, Design, Reliability, Packaging, Volumes 1
Published by Springer
ISBN 10: 0387279008 ISBN 13: 9780387279008
Condition: New.
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Micro And Optoelectronic Materials And Structures: Physics, Mechanics, Design, Reliability, Packaging, Volumes 1
Published by Springer
ISBN 10: 0387279008 ISBN 13: 9780387279008
Condition: New.
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Micro And Optoelectronic Materials And Structures: Physics, Mechanics, Design, Reliability, Packaging, Volumes 1
Published by Springer
ISBN 10: 0387279008 ISBN 13: 9780387279008
Condition: New.
