Semiconductor optoelectronic device packaging process (with DVD disc 1)(Chinese Edition) - Softcover
Synopsis
Paperback. Pub Date: 2011 Jun Pages: 95 Publisher: Electronic Industry Press semiconductor optoelectronic device packaging process (with DVD disc 1) for the entire semiconductor optoelectronic device package with the conditions and process are described. including: optoelectronic devices package specification. the process of expanding crystal mounted process. the lead welding process. device packaging technology. testing and packaging of the product six projects are done on semiconductor optoelectronic device packaging process and technology requirements are described. the content easy to understand and pay attention to the actual operation process and theory with practical ability. Semiconductor optoelectronic device packaging process (with DVD disc 1) suitable for students of secondary vocational schools photoelectric professional use. and can also be used as training mate...
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Semiconductor optoelectronic device packaging process (with DVD disc 1)(Chinese Edition)
Published by
Publishing House of Electronics Industry, 1905
ISBN 10: 712112887X
ISBN 13: 9787121128875
New
paperback
Seller: liu xing, Nanjing, JS, China
Seller rating 5 out of 5 stars
paperback. Condition: New. Paperback. Pub Date: 2011 Jun Pages: 95 Publisher: Electronic Industry Press semiconductor optoelectronic device packaging process (with DVD disc 1) for the entire semiconductor optoelectronic device package with the conditions and process are described. including: optoelectronic devices package specification. the process of expanding crystal mounted process. the lead welding process. device packaging technology. testing and packaging of the product six projects are done on semiconductor opto. Seller Inventory # CC008597