Language: Chinese
Published by Publishing House of Electronics Industry, 1905
ISBN 10: 712112887X ISBN 13: 9787121128875
Seller: liu xing, Nanjing, JS, China
paperback. Condition: New. Paperback. Pub Date: 2011 Jun Pages: 95 Publisher: Electronic Industry Press semiconductor optoelectronic device packaging process (with DVD disc 1) for the entire semiconductor optoelectronic device package with the conditions and process are described. including: optoelectronic devices package specification. the process of expanding crystal mounted process. the lead welding process. device packaging technology. testing and packaging of the product six projects are done on semiconductor opto.