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Materials Processes Reliability Advanced by Gall Martin (26 results)
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Materials, Processes and Reliability for Advanced Interconnects for Micro-and Nanoelectronics, 2009
Published by Cambridge University Press CUP, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Language: English
Condition: New. pp. 204.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156 (MRS Proceedings)
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Language: English
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
Condition: New. In.
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Materials, Processes and Reliability for Advanced Interconnects for Micro and Nanoelectronics - 2009: Volume 1156 (MRS Proceedings)
Published by Cambridge University Press 2014-06-05, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Language: English
Paperback. Condition: New.
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MATERIALS, PROCESSES AND RELIABILITY FOR ADVANCED INTERCONNECTS FOR MICRO- AND NANOELECTRONICS - 2009: VOLUME 1156
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Language: English
Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156 (MRS Proceedings)
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Language: English
Brand new book. Fast ship. Please provide full street address as we are not able to ship to P O box address.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156 (MRS Proceedings)
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Language: English
Condition: New.
-
Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009 : Volume 1156
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Language: English
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ? 2009: Volume 1156 (MRS Proceedings)
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Language: English
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
Condition: New. In.
-
Materials, Processes and Reliability for Advanced Interconnects for Micro-and Nanoelectronics, 2009
Published by Materials Research Society, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Language: English
Condition: New. pp. viii + 189.
-
Hardcover. Condition: Brand New. 189 pages. 9.00x6.25x0.75 inches. In Stock.
-
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics - 2009: Volume 1156 (MRS Proceedings)
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Language: English
Hardcover. Condition: Like New. Like New. book.
-
Materials, Processes and Reliability for Advanced Interconnects for Micro - and Nonelectronics 2009
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Language: English
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009: Volume 1156 (Paperback)
Published by Cambridge University Press, Cambridge, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Language: English
Paperback. Condition: new. Paperback. Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics â" 2009: Volume 1156
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Language: English
Paperback. Condition: Brand New. 1st edition. 204 pages. 9.02x5.98x0.43 inches. In Stock. This item is printed on demand.
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Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics - 2009: Volume 1156
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Language: English
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
Paperback / softback. Condition: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days 280.
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Materials, Processes and Reliability for Advanced Interconnects for Micro-and Nanoelectronics, 2009
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Language: English
Condition: New. Print on Demand pp. 204.
-
Materials, Processes and Reliability for Advanced Interconnects for Micro-and Nanoelectronics, 2009
Published by Cambridge University Press, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Language: English
Condition: New. PRINT ON DEMAND pp. 204.
-
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009: Volume 1156 (Paperback)
Published by Cambridge University Press, Cambridge, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Language: English
Paperback. Condition: new. Paperback. Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
-
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009: Volume 1156 (Paperback)
Published by Cambridge University Press, Cambridge, 2014
ISBN 10: 1107408318 ISBN 13: 9781107408319
Language: English
Paperback. Condition: new. Paperback. Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This item is printed on demand. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
-
Materials, Processes and Reliability for Advanced Interconnects for Micro- And Nanoelectronics 2009
Published by Cambridge University Press, 2012
ISBN 10: 1107408318 ISBN 13: 9781107408319
Language: English
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.InhaltsverzeichnisPart I. Low-k Dielectrics I Part II. Low-k Dielectrics II Part III. Poster Session: Interco.
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Hardcover. Condition: Brand New. 189 pages. 9.00x6.25x0.75 inches. In Stock. This item is printed on demand.
-
Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics - 2009: Volume 1156
Published by Materials Research Society, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Language: English
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
Hardback. Condition: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days 429.
-
Materials, Processes and Reliability for Advanced Interconnects for Micro - and Nonelectronics 2009
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Language: English
Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.InhaltsverzeichnisPart I. Low-k Dielectrics I Part II. Low-k Dielectrics II Part III. Poster Session: Interco.
-
Materials, Processes and Reliability for Advanced Interconnects for Micro-and Nanoelectronics, 2009
Published by Materials Research Society, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Language: English
Condition: New. Print on Demand pp. viii + 189 Illus.
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Materials, Processes and Reliability for Advanced Interconnects for Micro-and Nanoelectronics, 2009
Published by Materials Research Society, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Language: English
Condition: New. PRINT ON DEMAND pp. viii + 189.
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Materials, Processes and Reliability for Advanced Interconnects for Micro - and Nonelectronics 2009
Published by Cambridge University Press, 2009
ISBN 10: 1605111295 ISBN 13: 9781605111292
Language: English
Buch. Condition: Neu. Materials, Processes and Reliability for Advanced Interconnects for Micro - and Nonelectronics 2009 | Martin Gall | Buch | Gebunden | Englisch | 2009 | Cambridge University Press | EAN 9781605111292 | Verantwortliche Person für die EU: Libri GmbH, Europaallee 1, 36244 Bad Hersfeld, gpsr[at]libri[dot]de | Anbieter: preigu Print on Demand.
