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Lead Free Soldering Process Development (17 results)
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Lead-free Soldering Process Development and Reliability
Book 16 of 19: Quality and Reliability EngineeringSeller: PBShop.store UK, Fairford, GLOS, United Kingdom
Seller rating 5 out of 5 stars
HRD. Condition: New. New Book. Shipped from UK. Established seller since 2000.
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Condition: As New. Unread book in perfect condition.
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Lead-Free Soldering Process Development and Reliability
Book 16 of 19: Quality and Reliability EngineeringSeller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New.
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Lead-free Soldering Process Development and Reliability (Hardcover)
Book 16 of 19: Quality and Reliability EngineeringLanguage: English
Published by John Wiley & Sons Inc, New York, 2020
ISBN 10: 1119482038 ISBN 13: 9781119482031
Hardcover. Condition: new. Hardcover. Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: Developments in process engineering (SMT, Wave, Rework, Paste Technology) Low temperature, high temperature and high reliability alloys Intermetallic compounds PCB surface finishes and laminates Underfills, encapsulants and conformal coatings Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the books explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Lead-Free Soldering Process Development and Reliability
Book 16 of 19: Quality and Reliability EngineeringSeller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 105.35
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
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Condition: New. Brand new! Please provide a physical shipping address.
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Lead-free Soldering Process Development and Reliability
Book 16 of 19: Quality and Reliability EngineeringLanguage: English
Published by John Wiley and Sons Ltd, 2020
ISBN 10: 1119482038 ISBN 13: 9781119482031
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
£ 113.21
£ 18.01 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketHardback. Condition: New. New copy - Usually dispatched within 4 working days.
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Lead-free Soldering Process Development and Reliability
Book 16 of 19: Quality and Reliability EngineeringLanguage: English
Published by John Wiley & Sons Inc, 2020
ISBN 10: 1119482038 ISBN 13: 9781119482031
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Seller rating 5 out of 5 stars
First Edition
Condition: New. 2020. 1st Edition. Hardcover. . . . . .
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Lead-free Soldering Process Development and Reliability
Book 16 of 19: Quality and Reliability EngineeringLanguage: English
Published by John Wiley & Sons Inc, 2020
ISBN 10: 1119482038 ISBN 13: 9781119482031
Hardcover. Condition: Brand New. 481 pages. 9.25x6.25x1.00 inches. In Stock.
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Lead-free Soldering Process Development and Reliability (Hardcover)
Book 16 of 19: Quality and Reliability EngineeringLanguage: English
Published by John Wiley & Sons Inc, New York, 2020
ISBN 10: 1119482038 ISBN 13: 9781119482031
Hardcover. Condition: new. Hardcover. Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: Developments in process engineering (SMT, Wave, Rework, Paste Technology) Low temperature, high temperature and high reliability alloys Intermetallic compounds PCB surface finishes and laminates Underfills, encapsulants and conformal coatings Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the books explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
-
Lead-free Soldering Process Development and Reliability
Book 16 of 19: Quality and Reliability EngineeringLanguage: English
Published by John Wiley & Sons Inc, 2020
ISBN 10: 1119482038 ISBN 13: 9781119482031
Condition: New. 2020. 1st Edition. Hardcover. . . . . . Books ship from the US and Ireland.
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Lead-free Soldering Process Development and Reliability (Hardcover)
Book 16 of 19: Quality and Reliability EngineeringLanguage: English
Published by John Wiley & Sons Inc, New York, 2020
ISBN 10: 1119482038 ISBN 13: 9781119482031
Hardcover. Condition: new. Hardcover. Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: Developments in process engineering (SMT, Wave, Rework, Paste Technology) Low temperature, high temperature and high reliability alloys Intermetallic compounds PCB surface finishes and laminates Underfills, encapsulants and conformal coatings Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the books explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
