Introduction Microsystem Packaging Technology by Jin Yufeng (22 results)
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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£ 74.38
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- Softcover
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- Softcover
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
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£ 80.47
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Condition: New. pp. 232.
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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£ 73.71
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- Softcover
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£ 73.93
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- Softcover
Seller: THE SAINT BOOKSTORE, Southport, United KingdomTHE SAINT BOOKSTORE
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£ 73.72
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Paperback / softback. Condition: New. New copy - Usually dispatched within 4 working days.
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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£ 92.56
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Condition: New. pp. 232.
- Softcover
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
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£ 96.06
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Condition: New. pp. 232.
Jin, Y: Introduction to Microsystem Packaging Technology
Yufeng Jin (Peking University)|Zhiping Wang|Jing Chen (Peking University)
- Softcover
Seller: moluna, Greven, Germanymoluna
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£ 80.57
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Kartoniert / Broschiert. Condition: New. Dr. Yufeng Jin received his Ph.D. degree in Electronical Engineering in March 1999 from Southeast University, Nanjing, China. Since then, he has been working as a postdoctoral fellow, an associate professor and a professor in Institute o.
- Softcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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£ 112.15
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Paperback. Condition: Brand New. 232 pages. 10.00x7.00x10.00 inches. In Stock.
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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£ 101.46
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Taschenbuch. Condition: Neu. Neuware.
- Softcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
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£ 132.00
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paperback. Condition: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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- Hardcover
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£ 220.99
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Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
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- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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£ 249.71
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Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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£ 251.78
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Condition: New. pp. xiii + 218.
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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£ 237.10
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Condition: New.
Jin, Y: Introduction to Microsystem Packaging Technology
Yufeng Jin (Peking University)|Zhiping Wang|Jing Chen (Peking University)
- Hardcover
Seller: moluna, Greven, Germanymoluna
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£ 224.92
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Gebunden. Condition: New. Dr. Yufeng Jin received his Ph.D. degree in Electronical Engineering in March 1999 from Southeast University, Nanjing, China. Since then, he has been working as a postdoctoral fellow, an associate professor and a professor in Institute o.
- Hardcover
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
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£ 272.65
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Condition: New. pp. xiii + 218.
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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£ 286.63
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Buch. Condition: Neu. Neuware - Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package development with a decidedly MEMS perspective. It presents various technologies in relation to MSP.…
- Hardcover
- Print on Demand
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
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£ 234.16
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Condition: New. pp. xiii + 218 Illus. This item is printed on demand.
