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Condition: New.
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Condition: As New. Unread book in perfect condition.
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Interconnects in VLSI Design
Language: English
Published by Kluwer Academic Publishers, Netherlands, 2000
ISBN 10: 0792379977 ISBN 13: 9780792379973
Seller: PsychoBabel & Skoob Books, Didcot, United Kingdom
Seller rating 5 out of 5 stars
First Edition
Hardcover. Condition: Very Good. Dust Jacket Condition: No Dust Jacket. First Edition. Hard cover with printed boards, no jacket; Cover shows hardly noticable storage wear. Previous owner's name on FEP. Contents are otherwise clean, bright and tight. J. Used.
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Carbon Nanotube Based VLSI Interconnects: Analysis and Design (SpringerBriefs in Applied Sciences and Technology)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 49.34
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PF. Condition: New.
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Carbon Nanotube Based Vlsi Interconnects : Analysis and Design
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New.
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Carbon Nanotube Based Vlsi Interconnects : Analysis and Design
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: As New. Unread book in perfect condition.
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Paperback. Condition: Brand New. 2015 edition. 100 pages. 9.00x6.25x0.50 inches. In Stock.
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Carbon Nanotube Based VLSI Interconnects : Analysis and Design
Language: English
Published by Springer India, Springer India, 2014
ISBN 10: 8132220463 ISBN 13: 9788132220466
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.
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Taschenbuch. Condition: Neu. Carbon Nanotube Based VLSI Interconnects | Analysis and Design | Brajesh Kumar Kaushik (u. a.) | Taschenbuch | SpringerBriefs in Applied Sciences and Technology | xi | Englisch | 2014 | Springer | EAN 9788132220466 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Condition: Gut. Zustand: Gut | Sprache: Englisch | Produktart: Bücher | This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua tion and a supplement to the first book "Signal Propagation on Interconnects", Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects.
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Interconnects in VLSI Design
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 137.84
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Interconnects in VLSI Design
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 137.84
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Ships from United Kingdom to U.S.A.Quantity: Over 20 available
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Interconnects in Vlsi Design
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 137.83
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Taschenbuch. Condition: Neu. Interconnects in VLSI Design | Hartmut Grabinski | Taschenbuch | vii | Englisch | 2012 | Humana | EAN 9781461369547 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Condition: New. pp. 248.
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Interconnects in VLSI Design
Language: English
Published by Kluwer Academic Publishers, 2000
ISBN 10: 0792379977 ISBN 13: 9780792379973
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Seller rating 5 out of 5 stars
Condition: New. Presents a selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI). This book addresses the need of developers and researchers in the field of VLSI chip and package design. The papers in it cover a wide area of research directions. Editor(s): Grabinski, Hartmut. Num Pages: 236 pages, biography. BIC Classification: TJFC; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 244 x 170 x 15. Weight in Grams: 526. . 2000. Hardback. . . . .
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua tion and a supplement to the first book 'Signal Propagation on Interconnects', Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects.
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Interconnects in VLSI Design
Language: English
Published by Springer US, Springer US, 2000
ISBN 10: 0792379977 ISBN 13: 9780792379973
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua tion and a supplement to the first book 'Signal Propagation on Interconnects', Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects.
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Interconnects in VLSI Design
Language: English
Published by Kluwer Academic Publishers, 2000
ISBN 10: 0792379977 ISBN 13: 9780792379973
Condition: New. Presents a selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI). This book addresses the need of developers and researchers in the field of VLSI chip and package design. The papers in it cover a wide area of research directions. Editor(s): Grabinski, Hartmut. Num Pages: 236 pages, biography. BIC Classification: TJFC; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 244 x 170 x 15. Weight in Grams: 526. . 2000. Hardback. . . . . Books ship from the US and Ireland.
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Interconnects in Vlsi Design
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 225.99
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
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Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Paperback. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Condition: As New. Unread book in perfect condition.
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Carbon Nanotube Based VLSI Interconnects; Analysis and Design (Publisher series: Springer Briefs in Applied Sciences and Technology.)
Published by Springer 978-81-322-2046-6, New Denhi, 2046
ISBN 10: 8132220463 ISBN 13: 9788132220466
Seller: Burton Lysecki Books, ABAC/ILAB, Winnipeg, MB, Canada
Seller rating 5 out of 5 stars
[978-81-322-2046-6] 2015. (Trade paperback) Fine. 86pp. Illustrations, tables, formulas, references. Publisher series: Springer Briefs in Applied Sciences and Technology. (Science, Engineering, Science).
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Condition: new. Questo è un articolo print on demand.
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Interconnects in VLSI Design
Language: English
Published by Springer US Okt 2000, 2000
ISBN 10: 0792379977 ISBN 13: 9780792379973
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua tion and a supplement to the first book 'Signal Propagation on Interconnects', Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects. 248 pp. Englisch.
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Interconnects in VLSI Design
Language: English
Published by Springer US Okt 2012, 2012
ISBN 10: 1461369541 ISBN 13: 9781461369547
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua tion and a supplement to the first book 'Signal Propagation on Interconnects', Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects. 248 pp. Englisch.
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neusta.
