Advances Integrated Circuits Systems by Hao (28 results)
Language: English
Published by WSPC, 2025
- Softcover
Seller: Books in my Basket, New Delhi, IndiaBooks in my Basket
Contact seller5-star sellerSoft cover. Condition: New. ISBN:9798886131307,pp.
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Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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- Softcover
Seller: Books Puddle, Woodside, NY, U.S.A.Books Puddle
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£ 45.48
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Condition: New. pp. 370 1st edition NO-PA16APR2015-KAP.
- Softcover
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
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Condition: New. pp. 370.
- Softcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
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£ 49.78
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
Language: English
Published by World Scientific Publishing Co Pte Ltd, 2015
- Softcover
Seller: PBShop.store US, Wood Dale, IL, U.S.A.PBShop.store US
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PAP. Condition: New. New Book. Shipped from UK. Established seller since 2000.
- Softcover
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
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£ 44.23
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Condition: New. pp. 370.
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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£ 52.03
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Condition: As New. Unread book in perfect condition.
Language: English
Published by World Scientific Publishing Co Pte Ltd, 2015
- Softcover
Seller: PBShop.store UK, Fairford, GLOS, United KingdomPBShop.store UK
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PAP. Condition: New. New Book. Shipped from UK. Established seller since 2000.
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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Condition: New.
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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£ 59.29
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Condition: New. In English.
- Hardcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
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£ 76.30
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- Hardcover
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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£ 61.27
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Condition: As New. Unread book in perfect condition.
- Softcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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£ 71.21
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Paperback. Condition: Brand New. 1st edition. 375 pages. 10.50x7.50x1.00 inches. In Stock.
- Hardcover
Seller: Books Puddle, Woodside, NY, U.S.A.Books Puddle
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£ 102.72
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Condition: Used. pp. 370.
- Hardcover
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
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£ 105.13
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Condition: Used. pp. 370.
- Hardcover
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
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£ 107.77
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Condition: Used. pp. 370.
Language: English
Published by World Scientific Publishing Co Pte Ltd, 2015
- Hardcover
Seller: PBShop.store US, Wood Dale, IL, U.S.A.PBShop.store US
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HRD. Condition: New. New Book. Shipped from UK. Established seller since 2000.
Language: English
Published by World Scientific Publishing Co Pte Ltd, 2015
- Hardcover
Seller: PBShop.store UK, Fairford, GLOS, United KingdomPBShop.store UK
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£ 129.30
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HRD. Condition: New. New Book. Shipped from UK. Established seller since 2000.
- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
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Condition: New.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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£ 146.15
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Condition: New. In English.
- Hardcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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£ 165.23
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Hardcover. Condition: Brand New. 370 pages. 9.40x6.60x1.00 inches. In Stock.
- Softcover
- Print on Demand
Seller: moluna, Greven, Germanymoluna
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£ 49.97
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Kartoniert / Broschiert. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. 3D integration is an emerging technology for the design of many-core microprocessors and memory integration.Klappentextrnrn n3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This bo.…
- Softcover
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Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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£ 68.25
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Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - 3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.…
- Hardcover
- Print on Demand
Seller: moluna, Greven, Germanymoluna
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£ 115.45
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Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. 3D integration is an emerging technology for the design of many-core microprocessors and memory integration.Klappentextrnrn n3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This bo.…
More images- Hardcover
- Print on Demand
Seller: preigu, Osnabrück, Germanypreigu
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£ 119.74
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Buch. Condition: Neu. ADVANCES IN 3D INTEGRATED CIRCUITS AND SYSTEMS | Yu Hao | Buch | Englisch | 2015 | World Scientific | EAN 9789814699006 | Verantwortliche Person für die EU: Libri GmbH, Europaallee 1, 36244 Bad Hersfeld, gpsr[at]libri[dot]de | Anbieter: preigu Print on Demand.
- Hardcover
- Print on Demand
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
£ 155.46
£ 29.46 shippingShips from Germany to U.S.A.Quantity: 2 available
Buch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - 3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.…
