Advanced Packaging Microelectronic Microsystem by Anderson Travis (12 results)
- Softcover
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- Softcover
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- Softcover
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Advanced Packaging For Microelectronic and Microsystem Applications: With Emphasis on GaN Technology
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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Advanced Packaging For Microelectronic and Microsystem Applications: With Emphasis on GaN Technology
- Softcover
Seller: Chiron Media, Wallingford, United KingdomChiron Media
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- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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- Softcover
Seller: preigu, Osnabrück, Germanypreigu
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Taschenbuch. Condition: Neu. Advanced Packaging For Microelectronic and Microsystem Applications | With Emphasis on GaN Technology | Travis Anderson | Taschenbuch | Kartoniert / Broschiert | Englisch | 2008 | VDM Verlag Dr. Müller | EAN 9783639096767 | Verantwortliche Person für die EU: OmniScriptum GmbH & Co. KG, Bahnhofstr. 28, 66111 Saarbrücken, info[at]akademikerverlag[dot]de | Anbieter: preigu.…
- Softcover
Seller: Rarewaves.com UK, London, United KingdomRarewaves.com UK
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- Softcover
- Print on Demand
Seller: PBShop.store US, Wood Dale, IL, U.S.A.PBShop.store US
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PAP. Condition: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
- Softcover
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Seller: PBShop.store UK, Fairford, GLOS, United KingdomPBShop.store UK
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PAP. Condition: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
- Softcover
- Print on Demand
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - The emergence of GaN-based devices promises arevolution in areas requiring high performanceelectronics, such as high speed earth and space-basedcommunication systems, advanced radar, integratedsensors, high temperature electronics, and utilitypower switching. The properties of this system makeit ideally suited for operation at elevatedtemperatures and at voltage and current levels wellbeyond that accessible by Si. Recent improvements inmaterial quality and device performance are rapidlyopening the door to commercialization, and III-Ntechnologies are demonstrating exciting developmentsof late. Though devices are enteringcommercialization, there are still considerableunknowns, particularly in the reliability field.Recent advances at the University of Florida will bedetailed in this work.…
