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Advanced Packaging Microelectronic Microsystem by Anderson Travis (12 results)
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Advanced Packaging for Microelectronic and Microsystem Applications
Seller: Rarewaves.com USA, London, LONDO, United Kingdom
Seller rating 5 out of 5 stars
Paperback. Condition: New.
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Advanced Packaging for Microelectronic and Microsystem Applications
Language: English
Published by VDM Verlag Dr. Müller, 2008
ISBN 10: 3639096762 ISBN 13: 9783639096767
Condition: New.
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Advanced Packaging for Microelectronic and Microsystem Applications
Language: English
Published by VDM Verlag Dr. Müller, 2008
ISBN 10: 3639096762 ISBN 13: 9783639096767
Condition: As New. Unread book in perfect condition.
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Advanced Packaging For Microelectronic and Microsystem Applications: With Emphasis on GaN Technology
Language: English
Published by VDM Verlag Dr. Müller, 2008
ISBN 10: 3639096762 ISBN 13: 9783639096767
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 39.71
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Advanced Packaging For Microelectronic and Microsystem Applications: With Emphasis on GaN Technology
Language: English
Published by VDM Verlag Dr. Mïż½ller 2008-11-26, 2008
ISBN 10: 3639096762 ISBN 13: 9783639096767
Paperback. Condition: New.
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Advanced Packaging for Microelectronic and Microsystem Applications
Language: English
Published by VDM Verlag Dr. Müller, 2008
ISBN 10: 3639096762 ISBN 13: 9783639096767
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New.
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Advanced Packaging for Microelectronic and Microsystem Applications
Language: English
Published by VDM Verlag Dr. Müller, 2008
ISBN 10: 3639096762 ISBN 13: 9783639096767
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: As New. Unread book in perfect condition.
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Advanced Packaging For Microelectronic and Microsystem Applications | With Emphasis on GaN Technology
Language: English
Published by VDM Verlag Dr. Müller, 2008
ISBN 10: 3639096762 ISBN 13: 9783639096767
Taschenbuch. Condition: Neu. Advanced Packaging For Microelectronic and Microsystem Applications | With Emphasis on GaN Technology | Travis Anderson | Taschenbuch | Kartoniert / Broschiert | Englisch | 2008 | VDM Verlag Dr. Müller | EAN 9783639096767 | Verantwortliche Person für die EU: OmniScriptum GmbH & Co. KG, Bahnhofstr. 28, 66111 Saarbrücken, info[at]akademikerverlag[dot]de | Anbieter: preigu.
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Advanced Packaging For Microelectronic and Microsystem Applications: With Emphasis on GaN Technology
Language: English
Published by VDM Verlag Dr. Müller, 2008
ISBN 10: 3639096762 ISBN 13: 9783639096767
Book. Condition: New.
-
Advanced Packaging For Microelectronic and Microsystem Applications With Emphasis on GaN Technology
Language: English
Published by VDM Verlag Dr. Müller, 2008
ISBN 10: 3639096762 ISBN 13: 9783639096767
PAP. Condition: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
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Advanced Packaging For Microelectronic and Microsystem Applications With Emphasis on GaN Technology
Language: English
Published by VDM Verlag Dr. Müller, 2008
ISBN 10: 3639096762 ISBN 13: 9783639096767
Seller: PBShop.store UK, Fairford, GLOS, United Kingdom
Seller rating 5 out of 5 stars
£ 41.56
£ 4.16 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketPAP. Condition: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
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Advanced Packaging For Microelectronic and Microsystem Applications : With Emphasis on GaN Technology
Language: English
Published by VDM Verlag Dr. Müller, 2008
ISBN 10: 3639096762 ISBN 13: 9783639096767
Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - The emergence of GaN-based devices promises arevolution in areas requiring high performanceelectronics, such as high speed earth and space-basedcommunication systems, advanced radar, integratedsensors, high temperature electronics, and utilitypower switching. The properties of this system makeit ideally suited for operation at elevatedtemperatures and at voltage and current levels wellbeyond that accessible by Si. Recent improvements inmaterial quality and device performance are rapidlyopening the door to commercialization, and III-Ntechnologies are demonstrating exciting developmentsof late. Though devices are enteringcommercialization, there are still considerableunknowns, particularly in the reliability field.Recent advances at the University of Florida will bedetailed in this work.
