Advanced Packaging For Microelectronic and Microsystem Applications : With Emphasis on GaN Technology

Language: English

Published by VDM Verlag Dr. Müller, 2008

3639096762 / 9783639096767

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Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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nach der Bestellung gedruckt Neuware - Printed after ordering - The emergence of GaN-based devices promises arevolution in areas requiring high performanceelectronics, such as high speed earth and space-basedcommunication systems, advanced radar, integratedsensors, high temperature electronics, and utilitypower switching. The properties of this system makeit ideally suited for operation at elevatedtemperatures and at voltage and current levels wellbeyond that accessible by Si. Recent improvements inmaterial quality and device performance are rapidlyopening the door to commercialization, and III-Ntechnologies are demonstrating exciting developmentsof late. Though devices are enteringcommercialization, there are still considerableunknowns, particularly in the reliability field.Recent advances at the University of Florida will bedetailed in this work.

Seller Inventory # 9783639096767

Title
Advanced Packaging For Microelectronic and Microsystem Applications : With Emphasis on GaN Technology
Author
Travis Anderson
Publisher
VDM Verlag Dr. Müller
Publication year
2008
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
3639096762
ISBN 13
9783639096767
Item weight
172 grams
Dimensions
220x150x7 mm

AHA-BUCH GmbH

Einbeck, Germany

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