9789401044721 - Thermal Management of Electronic Systems: Proceedings of Eurotherm Seminar 29, 14–16 June 1993, Delft, the Netherlands (17 results)
Thermal Management of Electronic Systems : Proceedings of Eurotherm Seminar 29, 14?16 June 1993, Delft, the Netherlands
Hoogendoorn, C. J. (EDT); Henkes, R. A. W. M. (EDT); Lasance, C. J. M. (EDT)
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Thermal Management of Electronic Systems : Proceedings of Eurotherm Seminar 29, 14?16 June 1993, Delft, the Netherlands
Hoogendoorn, C. J. (EDT); Henkes, R. A. W. M. (EDT); Lasance, C. J. M. (EDT)
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Thermal Management of Electronic Systems : Proceedings of Eurotherm Seminar 29, 14?16 June 1993, Delft, the Netherlands
Hoogendoorn, C. J. (EDT); Henkes, R. A. W. M. (EDT); Lasance, C. J. M. (EDT)
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Thermal Management of Electronic Systems : Proceedings of Eurotherm Seminar 29, 14?16 June 1993, Delft, the Netherlands
Hoogendoorn, C. J. (EDT); Henkes, R. A. W. M. (EDT); Lasance, C. J. M. (EDT)
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Taschenbuch. Condition: Neu. Thermal Management of Electronic Systems | Proceedings of EUROTHERM Seminar 29, 14-16 June 1993, Delft, The Netherlands | C. J. Hoogendoorn (u. a.) | Taschenbuch | xi | Englisch | 2012 | Springer | EAN 9789401044721 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 H…eidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -The Eurotherm Committee has chosen Thermal Management of Electronic Systems as the subject of its 29th Seminar, at Delft University of Technology, the Netherlands, 14-16 June 1993. This volume constitutes the proceedings of the Semi…nar. Thermal Management is but one of the several critical topics in the design of electronic systems. However, as a result of the combined effects of increasing heat fluxes, miniaturisation and the striving for zero defects, preferably in less time and at a lower cost than before, thermal management has become an increasingly tough challenge. Therefore, it is being increasingly recognised that cooling requirements could eventually hamper the technical progress in miniaturisation. It might be argued that we are on the verge of a revolution in thermal management techniques. Previously, a packaging engineer had no way of predicting the tempera tures of critical electronic parts with the required accuracy. He or she had to rely on full-scale experiments, doubtful design rules, or worst-case estimates. This situation is going to be changed in the foreseeable future. User-friendly software tools, the acquisition and integrity of input and output data, the badly needed training mea sures, the introduction into a concurrent engineering environment: all these items will exert a heavy toll on the flexibility of the electronics industries. Fortunately, this situation is being realised at the appropriate management levels, and the interest in this seminar and the pre-conference tutorials testifies to this assertion. 352 pp. Englisch.
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Proceedings of EUROTHERM Seminar 29, 14--16 June 1993, Delft, the Netherlands The Eurotherm Committee has chosen Thermal Management of Electronic Systems as the subject of its 29th Seminar, at Delft University of Tech…nology, the Netherlands, 14-16 June.
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Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The Eurotherm Committee has chosen Thermal Management of Electronic Systems as the subject of its 29th Seminar, at Delft University of Technology, the Netherlands, 14-16 June 1993. This volume constitutes the proceedings of the Seminar.… Thermal Management is but one of the several critical topics in the design of electronic systems. However, as a result of the combined effects of increasing heat fluxes, miniaturisation and the striving for zero defects, preferably in less time and at a lower cost than before, thermal management has become an increasingly tough challenge. Therefore, it is being increasingly recognised that cooling requirements could eventually hamper the technical progress in miniaturisation. It might be argued that we are on the verge of a revolution in thermal management techniques. Previously, a packaging engineer had no way of predicting the tempera tures of critical electronic parts with the required accuracy. He or she had to rely on full-scale experiments, doubtful design rules, or worst-case estimates. This situation is going to be changed in the foreseeable future. User-friendly software tools, the acquisition and integrity of input and output data, the badly needed training mea sures, the introduction into a concurrent engineering environment: all these items will exert a heavy toll on the flexibility of the electronics industries. Fortunately, this situation is being realised at the appropriate management levels, and the interest in this seminar and the pre-conference tutorials testifies to this assertion.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 352 pp. Englisch.
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Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - The Eurotherm Committee has chosen Thermal Management of Electronic Systems as the subject of its 29th Seminar, at Delft University of Technology, the Netherlands, 14-16 June 1993. This volume constitutes the proceedings of the Seminar.…Thermal Management is but one of the several critical topics in the design of electronic systems. However, as a result of the combined effects of increasing heat fluxes, miniaturisation and the striving for zero defects, preferably in less time and at a lower cost than before, thermal management has become an increasingly tough challenge. Therefore, it is being increasingly recognised that cooling requirements could eventually hamper the technical progress in miniaturisation. It might be argued that we are on the verge of a revolution in thermal management techniques. Previously, a packaging engineer had no way of predicting the tempera tures of critical electronic parts with the required accuracy. He or she had to rely on full-scale experiments, doubtful design rules, or worst-case estimates. This situation is going to be changed in the foreseeable future. User-friendly software tools, the acquisition and integrity of input and output data, the badly needed training mea sures, the introduction into a concurrent engineering environment: all these items will exert a heavy toll on the flexibility of the electronics industries. Fortunately, this situation is being realised at the appropriate management levels, and the interest in this seminar and the pre-conference tutorials testifies to this assertion.
