ISBN: 9780849396243 - Guidebook for Managing Silicon Chip Reliability: 5 (electronic Packaging) (28 results)

Hardcover. Condition: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.

Hardcover. Condition: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.

Hardcover. Condition: Wie neu. 224 S.; Ill. Like new. Shrink wrapped. Sprache: Englisch Gewicht in Gramm: 655.

Hardcover. Condition: Very Good. No Dust Jacket. 1st Edition. Name of previous owner in ink inside front board. Otherwise copy is clean and unmarked in very good condition. 214 pages.

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Hardcover. Condition: New. In shrink wrap. Looks like an interesting title.

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Condition: Used. pp. 224 1st Edition.

Condition: Used. pp. 224.

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Condition: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.

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Hardback. Condition: New. New copy - Usually dispatched within 4 working days.

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Condition: New. In English.

Hardcover. Condition: Brand New. 1st edition. 224 pages. 10.00x6.50x0.75 inches. In Stock.

Gebundene Ausgabe. Condition: Neu. Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. This book examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. It provides a framework for how to model the mechanism, test for defects, and avoid and manage damage. The authors focus on device failure and causes, outlines how to establish the specifications defining chip performance, cost, quality, and reliability, and they include an extensive table detailing the types of mechanism failures. Sprache: Englisch Gewicht in Gramm: 458.…

Condition: Used. pp. 224 6 equations This item is printed on demand.

Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Pecht, Michael Radojcic, Riko Rao, GopalAchieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook. …

Buch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. This book examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. It provides a framework for how to model the mechanism, test for defects, and avoid and manage damage. The authors focus on device failure and causes, outlines how to establish the specifications defining chip performance, cost, quality, and reliability, and they include an extensive table detailing the types of mechanism failures.…

Buch. Condition: Neu. Guidebook for Managing Silicon Chip Reliability | Michael Pecht (u. a.) | Buch | Einband - fest (Hardcover) | Englisch | 1998 | CRC Press | EAN 9780849396243 | Verantwortliche Person für die EU: Libri GmbH, Europaallee 1, 36244 Bad Hersfeld, gpsr[at]libri[dot]de | Anbieter: preigu Print on Demand. …