Isbn: 9780792394419 - Modeling and Simulation of High Speed Vlsi Interconnects: A Special Issue of Analog Integrated Circuits and Signal Processing an International Journal Vol. 5, No. 1 (1994) (15 results)

Hardcover. Condition: Good. No Dust Jacket. Hardcover without jacket. Minor dents on rear upper edge; leading corners are very slightly bent and worn. Spine head a little bumped. A few superficial scores elsewhere on boards. Previous owner's name inked on FEP. Small stain on rear pastedown, imprinted onto BEP. Pages remain sound and clean; text and diagrams clear throughout. Reprinted from a Special Issue of 'Analog Integrated Circuits and Signal Processing: An International Journal', Vol. 5, No. 1 (1994). TS. Used. …

Condition: New.

Condition: New.

Hardcover. Condition: New. HARDCOVER, BRAND NEW COPY, Perfect Shape, No Black Remainder Mark, 517-709Fast Shipping With Online Tracking, International Orders shipped Global Priority Air Mail, All orders handled with care and shipped promptly in secure packaging, we ship Mon-Sat and send shipment confirmation emails. Our customer service is friendly, we answer emails fast, accept returns and work hard to deliver 100% Customer Satisfaction.…

Condition: As New. Unread book in perfect condition.

Condition: New. In English.

Condition: New. Offers insight into some of the issues in the field of Modeling and Simulation of High Speed Vlsi Interconnects. Editor(s): Nakhla, Michel S.; Zhang, Q. J. Num Pages: 108 pages, biography. BIC Classification: TJFC; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 279 x 210 x 7. Weight in Grams: 418. . 1994. Reprinted from ANALOG INTEGRATED CIRCUITS AND SIG. Hardback. . . . . …

Condition: New.

Condition: As New. Unread book in perfect condition.

hardcover. Condition: New. In shrink wrap. Looks like an interesting title.

Condition: New. pp. 112.

Condition: New. Offers insight into some of the issues in the field of Modeling and Simulation of High Speed Vlsi Interconnects. Editor(s): Nakhla, Michel S.; Zhang, Q. J. Num Pages: 108 pages, biography. BIC Classification: TJFC; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 279 x 210 x 7. Weight in Grams: 418. . 1994. Reprinted from ANALOG INTEGRATED CIRCUITS AND SIG. Hardback. . . . . Books ship from the US and Ireland. …

Gebunden. Condition: New. Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area. Modeling and Simulation of High Speed VLSI Interconnec.

Condition: New. Print on Demand pp. 112 68:B&W 7 x 10 in or 254 x 178 mm Case Laminate on White w/Gloss Lam.

Condition: New. PRINT ON DEMAND pp. 112.