ISBN: 9780792394419 - Modeling and Simulation of High Speed Vlsi Interconnects: A Special Issue of Analog Integrated Circuits and Signal Processing an International Journal Vol. 5, No. 1 (1994) (16 results)

Hardcover. Condition: Good. No Dust Jacket. Hardcover without jacket. Minor dents on rear upper edge; leading corners are very slightly bent and worn. Spine head a little bumped. A few superficial scores elsewhere on boards. Previous owner's name inked on FEP. Small stain on rear pastedown, imprinted onto BEP. Pages remain sound and clean; text and diagrams clear throughout. Reprinted from a Special Issue of 'Analog Integrated Circuits and Signal Processing: An International Journal', Vol. 5, No. 1 (1994). TS. Used. …

Condition: New.

Condition: New.

Hardcover. Condition: New. HARDCOVER, BRAND NEW COPY, Perfect Shape, No Black Remainder Mark, 517-709Fast Shipping With Online Tracking, International Orders shipped Global Priority Air Mail, All orders handled with care and shipped promptly in secure packaging, we ship Mon-Sat and send shipment confirmation emails. Our customer service is friendly, we answer emails fast, accept returns and work hard to deliver 100% Customer Satisfaction.…

Condition: As New. Unread book in perfect condition.

Condition: New. In English.

Condition: New. Offers insight into some of the issues in the field of Modeling and Simulation of High Speed Vlsi Interconnects. Editor(s): Nakhla, Michel S.; Zhang, Q. J. Num Pages: 108 pages, biography. BIC Classification: TJFC; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 279 x 210 x 7. Weight in Grams: 418. . 1994. Reprinted from ANALOG INTEGRATED CIRCUITS AND SIG. Hardback. . . . . …

Condition: New.

Condition: As New. Unread book in perfect condition.

hardcover. Condition: New. In shrink wrap. Looks like an interesting title.

Condition: New. pp. 112.

Condition: New. Offers insight into some of the issues in the field of Modeling and Simulation of High Speed Vlsi Interconnects. Editor(s): Nakhla, Michel S.; Zhang, Q. J. Num Pages: 108 pages, biography. BIC Classification: TJFC; UY. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 279 x 210 x 7. Weight in Grams: 418. . 1994. Reprinted from ANALOG INTEGRATED CIRCUITS AND SIG. Hardback. . . . . Books ship from the US and Ireland. …

Gebunden. Condition: New. Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area. Modeling and Simulation of High Speed VLSI Interconnec.

Buch. Condition: Neu. Neuware - Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area. Modeling and Simulation of High Speed VLSI Interconnects serves as an excellent reference, providing insight into some of the most important issues in the field.…

Condition: New. Print on Demand pp. 112 68:B&W 7 x 10 in or 254 x 178 mm Case Laminate on White w/Gloss Lam.

Condition: New. PRINT ON DEMAND pp. 112.