ISBN: 9780792376767 - Foldable Flex and Thinned Silicon Multichip Packaging Technology: 1 (emerging Technology in Advanced Packaging, 1) (9 results)
- Hardcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
Contact seller5-star sellerCondition: New
£ 86.87
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
- Hardcover
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
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£ 88.05
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
- Hardcover
Seller: Buchpark, Trebbin, GermanyBuchpark
Contact seller5-star sellerCondition: Used - Fine
Original price: £ 73.9510% offCurrent price: £ 66.56
£ 87.64 shippingShips from Germany to U.S.A.Quantity: 1 available
Condition: Sehr gut. Zustand: Sehr gut | Seiten: 347 | Sprache: Englisch | Produktart: Bücher | Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.…
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
£ 161.46
£ 1.97 shippingShips within U.S.A.Quantity: 15 available
Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrelandKennys Bookshop and Art Galleries Ltd.
Contact seller5-star sellerCondition: New
£ 174.33
£ 7.93 shippingShips from Ireland to U.S.A.Quantity: 15 available
Condition: New. Presents the methods used to make stacked chip packages in the 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means. Editor(s): Balde, John W. Series: Emerging Technology in Advanced Packaging. Num Pages: 347 pages, 266 black & white illustrations, biography. BIC Classification: TD; TJF. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 235 x 155 x 22. Weight in Grams: 703. . 2003. Hardback. . . . .…
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
£ 185.13
£ 1.97 shippingShips within U.S.A.Quantity: 15 available
Condition: New.
- Hardcover
Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
£ 155.58
£ 40.89 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Gebunden. Condition: New. Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits.
- Hardcover
Seller: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
Contact seller5-star sellerCondition: New
£ 219.22
£ 7.83 shippingShips within U.S.A.Quantity: 15 available
Condition: New. Presents the methods used to make stacked chip packages in the 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means. Editor(s): Balde, John W. Series: Emerging Technology in Advanced Packaging. Num Pages: 347 pages, 266 black & white illustrations, biography. BIC Classification: TD; TJF. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 235 x 155 x 22. Weight in Grams: 703. . 2003. Hardback. . . . . Books ship from the US and Ireland.…
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
£ 208.01
£ 29.21 shippingShips from Germany to U.S.A.Quantity: 2 available
Buch. Condition: Neu. Neuware - Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.…
