Ed S Balde John W (2 results)

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    • Language: English

      Published by Kluwer Academic Publishers, 2003

      0792376765 / 9780792376767

      • Hardcover

      Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrelandKennys Bookshop and Art Galleries Ltd.

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      Condition: New

      £ 178.58

      £ 8.12 shipping 
      Ships from Ireland to U.S.A.

      Quantity: 15 available

      Condition: New. Presents the methods used to make stacked chip packages in the 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than thr

    • Language: English

      Published by Kluwer Academic Publishers, 2003

      0792376765 / 9780792376767

      • Hardcover

      Seller: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore

      5-star seller
      Contact seller

      Condition: New

      £ 217.91

      £ 7.78 shipping 
      Ships within U.S.A.

      Quantity: 15 available

      Condition: New. Presents the methods used to make stacked chip packages in the 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than thr