9780442013530 - Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly by Hwang, Jennie (13 results)
- Softcover
- First Edition
Seller: Book Booth, Berea, OH, U.S.A.Book Booth
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Paperback. Condition: Good. First Paperback Edition. minor shelf wear and cover soil, corners lightly bumped, former owners name inside front cover, xxii + 456 pages including appendix and index, covers chemical and physical characteristics, metallurgy, rheology of pastes, soldering methods and application techniques, cleaning,…reliability and quality control, testing and related topics, bw illustrations Size: 6 x 9.
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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- Softcover
Seller: Chiron Media, Wallingford, United KingdomChiron Media
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PF. Condition: New.
- Softcover
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrelandKennys Bookshop and Art Galleries Ltd.
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Condition: New. Aims to provide a working understanding of the latest solder paste principles and applications, enabling engineers to take advantage of current surface mount technology. Coverage includes basic technologies, application techniques, reliability and solutions to specific problems. Num Pages: 480 pages, 77 black & w…hite illustrations, biography. BIC Classification: TGP; THRS; TJFC. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 229 x 152 x 24. Weight in Grams: 703. . 1992. New ed. Paperback. . . . .
- Softcover
Seller: moluna, Greven, Germanymoluna
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Condition: New.
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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Condition: New. pp. 484.
- Softcover
Seller: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
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£ 140.15
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Condition: New. Aims to provide a working understanding of the latest solder paste principles and applications, enabling engineers to take advantage of current surface mount technology. Coverage includes basic technologies, application techniques, reliability and solutions to specific problems. Num Pages: 480 pages, 77 black & w…hite illustrations, biography. BIC Classification: TGP; THRS; TJFC. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 229 x 152 x 24. Weight in Grams: 703. . 1992. New ed. Paperback. . . . . Books ship from the US and Ireland.
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components…onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation ships between these characteristics are clearly explained and pre sented. In this excellent presentation, Dr. Hwang highlights three impor tant areas of solder paste technology.
- Softcover
- Print on Demand
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
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Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices… and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation ships between these characteristics are clearly explained and pre sented. In this excellent presentation, Dr. Hwang highlights three impor tant areas of solder paste technology. 484 pp. Englisch.
- Softcover
- Print on Demand
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
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Condition: New. Print on Demand pp. 484 23:B&W 6 x 9 in or 229 x 152 mm Perfect Bound on White w/Gloss Lam.
- Softcover
- Print on Demand
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
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£ 136.76
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Condition: New. PRINT ON DEMAND pp. 484.
More images- Softcover
- Print on Demand
Seller: preigu, Osnabrück, Germanypreigu
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Taschenbuch. Condition: Neu. Solder Paste in Electronics Packaging | Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly | Jennie Hwang | Taschenbuch | xxiv | Englisch | 1992 | Springer US | EAN 9780442013530 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Hei…delberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
Language: English
Published by Springer US, Springer New York Sep 1992, 1992
- Softcover
- Print on Demand
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germanybuchversandmimpf2000
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£ 94.24
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Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and… components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation ships between these characteristics are clearly explained and pre sented. In this excellent presentation, Dr. Hwang highlights three impor tant areas of solder paste technology.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 484 pp. Englisch.
