Solder Paste in Electronics Packaging : Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

Jennie Hwang

ISBN 10: 0442013531 ISBN 13: 9780442013530
Published by Springer US, Springer New York, 1992
Language: English
Condition: New Soft cover

Sold by AHA-BUCH GmbH, Einbeck, Germany

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