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9780081025321 - Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore Woodhead Publishing Series in Electronic and Optical Materials by Zhang, Hengyun (14 results)
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Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore
Book 130 of 203: Woodhead Publishing Series in Electronic and Optical MaterialsSeller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 201.37
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
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Taschenbuch. Condition: Neu. Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore | Hengyun Zhang (u. a.) | Taschenbuch | Einband - flex.(Paperback) | Englisch | 2019 | Woodhead Publishing | EAN 9780081025321 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu.
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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials)
Book 130 of 203: Woodhead Publishing Series in Electronic and Optical MaterialsSeller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 216.18
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Condition: As New. Unread book in perfect condition.
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Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore
Book 130 of 203: Woodhead Publishing Series in Electronic and Optical MaterialsSeller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 241.64
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
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Condition: New. Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging Features experimental characterization and qualifications for the analysis and verification of electronic packaging design P.
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Condition: new. Questo è un articolo print on demand.
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Paperback. Condition: Brand New. 425 pages. 8.75x6.00x1.00 inches. In Stock. This item is printed on demand.
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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
Book 130 of 203: Woodhead Publishing Series in Electronic and Optical MaterialsLanguage: English
Published by Elsevier Science & Technology, Woodhead Publishing, 2019
ISBN 10: 0081025327 ISBN 13: 9780081025321
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. Englisch.
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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
Book 130 of 203: Woodhead Publishing Series in Electronic and Optical MaterialsLanguage: English
Published by Elsevier Science & Technology, Woodhead Publishing, 2019
ISBN 10: 0081025327 ISBN 13: 9780081025321
Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.
