Isbn: 9780081025321 - Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore (woodhead Publishing Series in Electronic and Optical Materials) (9 results)
More imagesLanguage: English
Published by Elsevier Inc, 2019
Series: Book 130 of 203 - Woodhead Publishing Series in Electronic and Optical Materials
- Softcover
Seller: preigu, Osnabrück, Germanypreigu
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Taschenbuch. Condition: Neu. Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore | Hengyu Zhang | Taschenbuch | Englisch | 2019 | Elsevier Inc | EAN 9780081025321 | Verantwortliche Person für die EU: Kolibri 360 GmbH, Ettore-Bugatti-Str. 6-14, 51149 Köln, produktsicherheit[at]kolibri360[dot]de | Anbieter: preigu. …
Language: English
Published by Woodhead Publishing, 2019
Series: Book 130 of 203 - Woodhead Publishing Series in Electronic and Optical Materials
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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Condition: New.
Language: English
Published by Woodhead Publishing, 2019
Series: Book 130 of 203 - Woodhead Publishing Series in Electronic and Optical Materials
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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Condition: New.
Language: English
Published by Woodhead Publishing, 2019
Series: Book 130 of 203 - Woodhead Publishing Series in Electronic and Optical Materials
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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Condition: As New. Unread book in perfect condition.
Language: English
Published by Woodhead Publishing, 2019
Series: Book 130 of 203 - Woodhead Publishing Series in Electronic and Optical Materials
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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Condition: New. In English.
Language: English
Published by Woodhead Publishing, 2019
Series: Book 130 of 203 - Woodhead Publishing Series in Electronic and Optical Materials
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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Condition: As New. Unread book in perfect condition.
Language: English
Published by Elsevier Science, 2019
Series: Book 130 of 203 - Woodhead Publishing Series in Electronic and Optical Materials
- Softcover
Seller: moluna, Greven, Germanymoluna
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Condition: New. Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging Features experimental characterization and qualifications for the analysis and verification of electronic packaging design P.
Language: English
Published by Elsevier Science & Technology, Woodhead Publishing, 2019
Series: Book 130 of 203 - Woodhead Publishing Series in Electronic and Optical Materials
- Softcover
- Print on Demand
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
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Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. Englisch.…
Language: English
Published by Elsevier Inc, 2019
Series: Book 130 of 203 - Woodhead Publishing Series in Electronic and Optical Materials
- Softcover
- Print on Demand
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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£ 199.39
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Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.…
