Wang Hsu Pin (34 results)

Hardcover. Condition: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.

Hardcover. Condition: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.

Paperback. Condition: Good. No Jacket. Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.

Condition: Good. 3rd Edition. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.…

Condition: Good. Good condition. 2nd edition. A copy that has been read but remains intact. May contain markings such as bookplates, stamps, limited notes and highlighting, or a few light stains.

Hardcover. Condition: Very Good. 2nd. It's a well-cared-for item that has seen limited use. The item may show minor signs of wear. All the text is legible, with all pages included. It may have slight markings and/or highlighting.

Paperback. Condition: Very Good. Book in Very Good condition.

Paperback. Condition: Good. Book in Good condition.

Paperback. Condition: Fair. Book in Fair condition.

Condition: Very Good. 2nd Edition. Former library copy. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good. …

hardcover. Condition: Good. Fast shipping and order satisfaction guaranteed. A portion of your purchase benefits Non-Profit Organizations, First Aid and Fire Stations.

hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority.

Condition: New. pp. 684.

Hardcover. Condition: Near Fine. 2nd Edition. 2nd edition hardback book in near fine condition.

paperback. Condition: New. Language:Chinese.Paperback. Publisher: Tsinghua University.

paperback. Condition: New. Language:Chinese.Paperback. Publisher: Tsinghua University.

Condition: good. May show signs of wear, highlighting, writing, and previous use. This item may be a former library book with typical markings. No guarantee on products that contain supplements Your satisfaction is 100% guaranteed. Twenty-five year bookseller with shipments to over fifty million happy customers.…

Condition: New.

Hardcover. Condition: Good. Good .Ships From Multiple Locations. book.

Condition: good. May show signs of wear, highlighting, writing, and previous use. This item may be a former library book with typical markings. No guarantee on products that contain supplements Your satisfaction is 100% guaranteed. Twenty-five year bookseller with shipments to over fifty million happy customers.…

Condition: As New. Unread book in perfect condition.

Condition: New.

Condition: As New. Unread book in perfect condition.

Condition: New. pp. 360.

Condition: New. This study takes a systematic approach to productive maintenance. The book is an attempt to investigate machine tool maintenance in a life-cycle engineering approach. Editor(s): Lee, J.D.; Wang, Hsu-Pin. Series: Manufacturing Systems Engineering Series. Num Pages: 409 pages, biography. BIC Classification: TBC; TGB. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 235 x 155 x 23. Weight in Grams: 774. . 1999. Hardback. . . . . …

Condition: New. pp. 360 52:B&W 6.14 x 9.21in or 234 x 156mm (Royal 8vo) Case Laminate on White w/Gloss Lam.

Paperback. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Condition: New. This study takes a systematic approach to productive maintenance. The book is an attempt to investigate machine tool maintenance in a life-cycle engineering approach. Editor(s): Lee, J.D.; Wang, Hsu-Pin. Series: Manufacturing Systems Engineering Series. Num Pages: 409 pages, biography. BIC Classification: TBC; TGB. Category: (P) Professional & Vocational; (XV) Technical / Manuals. Dimension: 235 x 155 x 23. Weight in Grams: 774. . 1999. Hardback. . . . . Books ship from the US and Ireland. …

Buch. Condition: Neu. Neuware - Computer-Integrated Manufacturing has gained recognition as a most effective tool in increasing manufacturing competitiveness. This book discusses the fundamental knowledge of Computer-Aided Process Planning, the key to integrated manufacturing.The work provides a rigorous basis for the understanding of process planning and the development of effective and efficient Computer-Aided Process Planning systems. It presents a current overview on the latest issues and directions in this field. Topics covered include Group Technology, process planning algorithms, artificial intelligence, and assembly process planning. Most importantly, in order to provide a solid foundation for discussion and development, basic theories and principles for process planning are comprehensively and thoroughly studied in this book.Written for those who wish to understand the theory of process planning, the book will also prove an indispensable reference source on the approaches, methodologies and tools which can be applied to day-to-day process planning operations.…

Condition: New. Offers an Integrated Product, Process and Enterprise Design (IPPED) initiative that involves the use of simulation and modelling tools and computerised virtual workstations in conjunction with a design environment, allowing researchers, manufacturers and suppliers to work within a comprehensive network of shared knowledge. Editor(s): Wang, Hsu-Pin. Series: Manufacturing Systems Engineering Series. Num Pages: 492 pages, biography. BIC Classification: TBD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly; (UU) Undergraduate. Dimension: 234 x 156 x 28. Weight in Grams: 885. . 1997. Hardback. . . . .…