Tunga Krishna (12 results)
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Study of SnAgCu Alloy Reliability: Material Microstructural Evolution and Laser Moire Interferometry
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Study of SnAgCu Alloy Reliability: Material Microstructural Evolution and Laser Moire Interferometry
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Taschenbuch. Condition: Neu. Study of SnAgCu Alloy Reliability | Material Microstructural Evolution and Laser Moire Interferometry | Krishna Tunga | Taschenbuch | Englisch | VDM Verlag Dr. Müller | EAN 9783639133271 | Verantwortliche Person für die EU: VDM Verlag Dr. Müller, Brivibas Gatve 197, 1039 RIGA, LETTLAND, customerservi…ce[at]vdm-vsg[dot]de | Anbieter: preigu.
Study of SnAgCu Alloy Reliability: Material Microstructural Evolution and Laser Moire Interferometry
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PAP. Condition: New. New Book. Shipped from UK. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
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PAP. Condition: New. New Book. Delivered from our UK warehouse in 4 to 14 business days. THIS BOOK IS PRINTED ON DEMAND. Established seller since 2000.
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Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - This work aims to understand the reliability ofSnAgCu solder interconnects used in PBGA packagesusing microstructure evolution, laser moiréinterferometry and finite-element modeling. Aparticle coarsening based microstructure evolution of…the solder joint material during thermal excursionswas studied for extended periods of time lasting forseveral months. The microstructure evolution andparticle coarsening was quantified, and accelerationfactors were determined between benign field-useconditions and ATC conditions for PBGA packages withdifferent form factors and for two differentlead-free solder alloys. A new technique using lasermoiré interferometry was developed to assess thedeformation behavior of SnAgCu based solder jointsduring thermal excursions. This technique can used toestimate the fatigue life of solder joints quickly ina matter offew days instead of months. FEA in conjunction withexperimental data from the ATC for differentlead-free PBGA packages was used to develop a fatiguelife model that can be used to predict solder jointfatigue life for any PBGA package.
