Singh Dr Harjinder (15 results)
- Hardcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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£ 15.58
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- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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£ 15.75
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Condition: New.
- Hardcover
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
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£ 13.78
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Condition: New.
- Hardcover
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
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£ 14.68
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Condition: New.
Stress Induced Voiding & Electromigration Analysis of Cu-Cu bonds
Singh, Dr. Harjinder; Sappal, Dr. Amandeep Singh; Sharma, Manvinder
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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£ 50.30
£ 2.96 shippingShips within U.S.A.Quantity: 4 available
Condition: New.
- Softcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
Contact seller5-star sellerCondition: New
£ 40.99
£ 12.50 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Paperback. Condition: Brand New. second edition edition. 368 pages. 9.00x6.00x0.83 inches. In Stock.
- Softcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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£ 43.53
£ 12.50 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Paperback. Condition: Brand New. 228 pages. 11.00x8.50x0.52 inches. In Stock.
- Softcover
- Print on Demand
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
Contact seller4-star sellerCondition: New
£ 11.11
£ 6.50 shippingShips from United Kingdom to U.S.A.Quantity: 4 available
Condition: New. Print on Demand.
- Softcover
- Print on Demand
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
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£ 11.81
£ 8.51 shippingShips from Germany to U.S.A.Quantity: 4 available
Condition: New. PRINT ON DEMAND.
Stress Induced Voiding & Electromigration Analysis of Cu-Cu bonds
Singh, Dr. Harjinder, Sappal, Dr. Amandeep Singh, Sharma, Ma
- Softcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: New
£ 81.00
£ 25.00 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
paperback. Condition: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
- Softcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
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£ 103.00
£ 25.00 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
paperback. Condition: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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- Hardcover
- First Edition
Seller: Bücher bei den 7 Bergen, Sibbesse, GermanyBücher bei den 7 Bergen
Contact seller5-star sellerCondition: Used - Very good
£ 136.62
£ 76.16 shippingShips from Germany to U.S.A.Quantity: 1 available
Condition: Gut. 1. Aufl. 719 S., gr. 8° Gebrauchsspuren am Schutzumschlag, etwas lichtrandig, Einband etwas bestoßen, das Buch riecht nach Räucherstäbchen, sonst ordentlicher Zustand. AS1792 Sprache: Englisch Gewicht in Gramm: 1440 Gebunden. Fester Pappeinband mit Schutzumschlag.
Stress Induced Voiding & Electromigration Analysis of Cu-Cu bonds
Singh, Dr. Harjinder; Sappal, Dr. Amandeep Singh; Sharma, Manvinder
- Softcover
- Print on Demand
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
Contact seller4-star sellerCondition: New
£ 49.83
£ 6.50 shippingShips from United Kingdom to U.S.A.Quantity: 4 available
Condition: New. Print on Demand.
Stress Induced Voiding & Electromigration Analysis of Cu-Cu bonds
Singh, Dr. Harjinder; Sappal, Dr. Amandeep Singh; Sharma, Manvinder
- Softcover
- Print on Demand
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
Contact seller4-star sellerCondition: New
£ 52.29
£ 8.51 shippingShips from Germany to U.S.A.Quantity: 4 available
Condition: New. PRINT ON DEMAND.
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Stress Induced Voiding & Electromigration Analysis of Cu-Cu bonds
Dr. Harjinder Singh|Dr. Amandeep Singh Sappal|Manvinder Sharma
- Softcover
- Print on Demand
Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
£ 27.56
£ 41.92 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Singh Dr. HarjinderDr. Harjinder Singh is Assistant Professor in department of electronics and communication at Punjabi University Patiala.Face to Face Stacking on Wafer to Wafer (WoW) can be done for t…he Cu-Cu direct bonding int.
