Selberherr Siegfried (110 results)
Published by Springer
- Hardcover
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Hardcover. Condition: New. ISBN: 9783211728604.
2012 Workshop on Innovative Nanoscale Devices and Systems: WINDS - Booklet of Abstracts. Hapuna Beach Pronce Hotel; Kohala Voast, Hawaii, USA / December 2 - 7, 2012
Ishibashi, Koji, Stephen M. Goodnick Siegfried Selberherr a. o.;
Language: English
Published by Wien, Society for Micro- and Nanoelectronics - TU Wien,, 2012
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4°, Original-Broschur. xiii, 84 Seiten. Einband berieben und mit Lagerspuren, innen tadellos. Ein offensichtlich ungelesenes, durchgehend sauberes Exemplar. In englischer Sprache. IS: 9783901578250 ****An unsere Kunden in Deutschland: Versand nach Deutschland einmal in der Woche ab Freilassing mit der Deutschen Post.*** - Sprach…e: Englisch Gewicht in Gramm: 550.
Language: English
Published by Springer, 2012
Series: Computational Microelectronics, Book 1 of 17. Book 1 of 17 - Computational Microelectronics
- Softcover
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- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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- Hardcover
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
- Hardcover
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- Softcover
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Condition: As New. Unread book in perfect condition.
- Hardcover
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Semiconductor Device Modelling
Snowden, Christopher M.; Baets, Roel; Barker, John; Barnard, Joseph A.; Barton, Trevor M.; Clarke, Margaret E.; Cappy, Alain; Howes, Michael J.; Ingham, Derek; Miles, Robert E.; Mobbs, Stephen D.; Al-Mudares, Mustafa; Selberherr, Siegfried and Shur, Michael
- Hardcover
- First Edition
Seller: Westland Books, Wymondham, United KingdomWestland Books
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Good. UK stocked, available immediately. Hardcover, published by Springer in 1989. First edition. Very minor rubbing to the printed board covers, the front endpaper has been clipped. The text is unmarked throughout, a nice copy. Illustrated. Weight (unpacked) is 678 grams.
Language: English
Published by Springer, 2012
Series: Computational Microelectronics, Book 1 of 17. Book 1 of 17 - Computational Microelectronics
- Softcover
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Condition: New. pp. 324.
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- Softcover
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Condition: New. pp. 532.
Language: English
Published by Springer Vienna, 2013
Series: Computational Microelectronics, Book 1 of 17. Book 1 of 17 - Computational Microelectronics
- Softcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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Paperback. Condition: Brand New. 324 pages. 9.61x6.69x0.68 inches. In Stock.
Language: English
Published by Birkhäuser, 2022
Series: Modeling and Simulation in Science, Engineering and Technology, Book 53 of 55. Book 53 of 55 - Modeling and Simulation in Science, Engineering and Technology
- Softcover
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
Language: English
Published by Birkhäuser, 2022
Series: Modeling and Simulation in Science, Engineering and Technology, Book 53 of 55. Book 53 of 55 - Modeling and Simulation in Science, Engineering and Technology
- Softcover
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Simulation of Semiconductor Devices and Processes: Vol.5
Selberherr, Siegfried (Editor)/ Stippel, Hannes (Editor)/ Strasser, Ernst (Editor)
- Softcover
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Paperback. Condition: Brand New. 524 pages. 9.50x6.75x1.00 inches. In Stock.
Language: English
Published by Springer Vienna, 2012
Series: Computational Microelectronics, Book 1 of 17. Book 1 of 17 - Computational Microelectronics
- Softcover
Seller: moluna, Greven, Germanymoluna
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- Hardcover
Seller: La bataille des livres, Pradinas, FranceLa bataille des livres
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Condition: Très bon. Simulation of Semiconductor Devices and Processes: Volume 5 | Selberherr et alii | Springer-Verlag, 1993, in-8 cartonnage éditeur, 504 pages. Couverture propre. Dos solide. Intérieur frais. Exemplaire de bibliothèque : petit code barre en pied de 1re de couv., cotation au dos, rares et discrets petits tampon…s à l'intérieur de l'ouvrage. Bel état ! [BT14+] Pour les expéditions internationales, nous consulter au préalable pour l ajustement des frais de port qui seront peut-être revus à la baisse/ For international shipments, please contact us in advance to adjust shipping costs. |.
- Hardcover
- International Edition
Seller: UK BOOKS STORE, London, LONDO, United KingdomUK BOOKS STORE
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Condition: New. Brand New! Fast Delivery This is an International Edition and ship within 24-48 hours. Deliver by FedEx and Dhl, & Aramex, UPS, & USPS and we do accept APO and PO BOX Addresses. Order can be delivered worldwide within 6-10 days and we do have flat rate for up to 2LB. Extra shipping charges will be requested if th…e Book weight is more than 5 LB. This Item May be shipped from India, United states & United Kingdom. Depending on your location and availability.
Language: English
Published by Birkhäuser, 2022
Series: Modeling and Simulation in Science, Engineering and Technology, Book 53 of 55. Book 53 of 55 - Modeling and Simulation in Science, Engineering and Technology
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
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Condition: New. 1st ed. 2021 edition NO-PA16APR2015-KAP.
- Hardcover
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Language: English
Published by Birkhäuser, 2022
Series: Modeling and Simulation in Science, Engineering and Technology, Book 53 of 55. Book 53 of 55 - Modeling and Simulation in Science, Engineering and Technology
- Softcover
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- Hardcover
Seller: Romtrade Corp., STERLING HEIGHTS, MI, U.S.A.Romtrade Corp.
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
- Hardcover
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Language: English
Published by Birkhäuser, 2022
Series: Modeling and Simulation in Science, Engineering and Technology, Book 53 of 55. Book 53 of 55 - Modeling and Simulation in Science, Engineering and Technology
- Softcover
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
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More imagesLanguage: English
Published by Springer, 2012
Series: Computational Microelectronics, Book 1 of 17. Book 1 of 17 - Computational Microelectronics
- Softcover
Seller: preigu, Osnabrück, Germanypreigu
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Taschenbuch. Condition: Neu. Technology CAD Systems | Franz Fasching (u. a.) | Taschenbuch | viii | Englisch | 2012 | Springer | EAN 9783709193174 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
More images- Softcover
Seller: preigu, Osnabrück, Germanypreigu
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Taschenbuch. Condition: Neu. Simulation of Semiconductor Devices and Processes | Vol.5 | Siegfried Selberherr (u. a.) | Taschenbuch | xx | Englisch | 2012 | Springer | EAN 9783709173725 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbie…ter: preigu.
- Softcover
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Condition: New. In German.
Language: English
Published by Springer, 2012
Series: Computational Microelectronics, Book 1 of 17. Book 1 of 17 - Computational Microelectronics
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - As the cost of developing new semiconductor technology at ever higher bit/gate densities continues to grow, the value of using accurate TCAD simu lation tools for design and development becomes more and more of a necessity to compete in today's bus…iness. The ability to tradeoff wafer starts in an advanced piloting facility for simulation analysis and optimization utilizing a 'virtual fab' S/W tool set is a clear economical asset for any semiconductor development company. Consequently, development of more sophisticated, accurate, physics-based, and easy-to-use device and process modeling tools will receive continuing attention over the coming years. The cost of maintaining and paying for one's own internal modeling tool development effort, however, has caused many semiconductor development companies to consider replacing some or all of their internal tool development effort with the purchase of vendor modeling tools. While some (noteably larger) companies have insisted on maintaining their own internal modeling tool development organization, others have elected to depend totally on the tools offered by the TCAD vendors and have consequently reduced their mod eling staffs to a bare minimal support function. Others are seeking to combine the best of their internally developed tool suite with 'robust', 'proven' tools provided by the vendors, hoping to achieve a certain synergy as well as savings through this approach. In the following sections we describe IBM's internally developed suite of TCAD modeling tools and show several applications of the use of these tools.
- Softcover
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - The 'Fifth International Conference on Simulation of Semiconductor Devices and Processes' (SISDEP 93) continues a series of conferences which was initiated in 1984 by K. Board and D. R. J. Owen at the University College of Wales, Swansea, where it…took place a second time in 1986. Its organization was succeeded by G. Baccarani and M. Rudan at the University of Bologna in 1988, and W. Fichtner and D. Aemmer at the Federal Institute of Technology in Zurich in 1991. This year the conference is held at the Technical University of Vienna, Austria, September 7 - 9, 1993. This conference shall provide an international forum for the presentation of out standing research and development results in the area of numerical process and de vice simulation. The miniaturization of today's semiconductor devices, the usage of new materials and advanced process steps in the development of new semiconduc tor technologies suggests the design of new computer programs. This trend towards more complex structures and increasingly sophisticated processes demands advanced simulators, such as fully three-dimensional tools for almost arbitrarily complicated geometries. With the increasing need for better models and improved understand ing of physical effects, the Conference on Simulation of Semiconductor Devices and Processes brings together the simulation community and the process- and device en gineers who need reliable numerical simulation tools for characterization, prediction, and development.
