Schmerbeck Timothy (24 results)

Condition: very_good. Fast Free Shipping â" Very Good condition book with a firm cover and clean pages. Shows normal use and some light wear or limited notes markings. A solid, nice copy to enjoy.

Hardcover. Condition: Like New. Pristine. Fine in every way. Looks unread.

Condition: good. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in Good condition! Any other included accessories are also in Good condition showing use. Use can include some highlighting and writing, page and cover creases as well as other types visible wear.

Condition: New. In English.

Condition: New. In English.

Condition: Gut. Zustand: Gut | Seiten: 280 | Sprache: Englisch | Produktart: Bücher | FOR MIXED-SIGNAL COUPLING IN IC. niquesandsuggestspossiblesolutions.

Condition: New.

Condition: New.

Condition: New. This text addresses two major issues of the mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies some of the problems that will be encountered, gives examples of actual hardware experiences, offers simulation techniques and suggests possible solutions. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 280 pages, biography. BIC Classification: TJFC; TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 235 x 155 x 22. Weight in Grams: 625. . 1994. Hardback. . . . .…

Condition: New. pp. 308 Index.

Gebunden. Condition: New. List of Figures. List of Tables. Preface. 1. Introduction. 2. Sources of Noise and Methods of Coupling. 3. Semiconductor Device Simulation. 4. Simplified Substrate Modeling and Rapid Simulation. 5. Mesh Generation. 6. Substrate Modeling in Heavily-Doped.

Condition: New. pp. xxiii + 280 Index.

Hardcover. Condition: Brand New. 1995 edition. 304 pages. 9.75x6.50x0.75 inches. In Stock.

Condition: New. This text addresses two major issues of the mixed-signal coupling problem - how to simulate it and how to overcome it. It identifies some of the problems that will be encountered, gives examples of actual hardware experiences, offers simulation techniques and suggests possible solutions. Series: The Springer International Series in Engineering and Computer Science. Num Pages: 280 pages, biography. BIC Classification: TJFC; TJFD. Category: (P) Professional & Vocational; (UP) Postgraduate, Research & Scholarly. Dimension: 235 x 155 x 22. Weight in Grams: 625. . 1994. Hardback. . . . . Books ship from the US and Ireland.…

Condition: As New. Unread book in perfect condition.

Paperback. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Hardcover. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Condition: As New. Unread book in perfect condition.

Kluwer, Boston, 1995. XXII, 280 pages with some graphics, hardcover----former library book in good condition- 536 Gramm.

Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. List of Figures. List of Tables. Preface. 1. Introduction. 2. Sources of Noise and Methods of Coupling. 3. Semiconductor Device Simulation. 4. Simplified Substrate Modeling and Rapid Simulation. 5. Mesh Generation. 6. Substrate Modeling in Heavily-Doped.…

Condition: New. Print on Demand pp. 308 Figures, 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.

Condition: New. PRINT ON DEMAND pp. 308.

Condition: New. Print on Demand pp. xxiii + 280 Figures.

Condition: New. PRINT ON DEMAND pp. xxiii + 280.