Pak Jun (95 results)
General Education and the Development of Global Citizenship in Hong Kong, Taiwan and Mainland China: Not Merely Icing on the Cake (Routledge Research in Asian Education)
Xing, Jun [Editor]; Ng, Pak-Sheung [Editor]; Cheng, Chloe [Editor];
Language: English
Published by Routledge, 2012
- Hardcover
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Hardcover. Condition: Very Good. Binding firm, cover rubbed, interior clean and unmarked.
- Hardcover
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Hardcover. Condition: Very Good+. Dust Jacket Condition: Very Good+. American First. Minor edge wear; otherwise a solid, clean copy with no marking or underlining; dust jacket is protected by a Brodart sleeve. Book.
Language: English
Published by Routledge, 2018
- Softcover
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- Hardcover
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Hardcover. Condition: NF. Hardback in Near Fine condition with Near Fine dust jacket. . 4to 11" - 13" tall. 511 pages. * Quick Shipping * All Books Mailed in Boxes * Free Tracking Provided *.
Language: English
Published by Routledge, 2018
- Softcover
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Language: English
Published by Routledge, 2018
- Softcover
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
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Language: English
Published by Routledge, 2018
- Softcover
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Language: English
Published by Routledge, 2018
- Softcover
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Language: English
Published by Routledge, 2018
- Softcover
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Condition: New. 1st edition NO-PA16APR2015-KAP.
Language: English
Published by Routledge, 2018
- Softcover
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Language: English
Published by Routledge, 2018
- Softcover
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Language: English
Published by Routledge, 2018
- Softcover
Seller: California Books, Miami, FL, U.S.A.California Books
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- Hardcover
Seller: Hamelyn, Madrid, M, SpainHamelyn
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Condition: Very Good. : Este libro aborda el diseño eléctrico de Through Silicon Via (TSV), un componente esencial en la integración 3D de circuitos electrónicos. Explora las características y desafíos del diseño, ofreciendo información valiosa para ingenieros y estudiantes en el campo de la ingeniería electrónica y el diseño de… circuitos. EAN: 9789401790376 Tipo: Libros Categoría: Tecnología Título: Electrical Design of Through Silicon Via Autor: Manho Lee| Jun So Pak| Joungho Kim Idioma: eng Páginas: 280 Formato: Tapa dura Año de publicación: 2014.
Language: English
Published by Routledge, 2018
- Softcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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Paperback. Condition: Brand New. 256 pages. 9.21x6.14x0.55 inches. In Stock.
Language: English
Published by Routledge, 2018
- Softcover
Seller: Kennys Bookstore, Olney, MD, U.S.A.Kennys Bookstore
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Condition: New. Editor(s): Xing, Jun; Ng, Pak-Sheung; Cheng, Chloe. Num Pages: 256 pages, 11 black & white illustrations, 12 black & white tables. BIC Classification: 1FPCH; 1FPCW; JNAM; JNF; JNM. Category: (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156. . . 2018. 1st Edition. paperback. . . . . Books ship from th…e US and Ireland.
- Hardcover
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- Softcover
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- Softcover
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Language: English
Published by Taylor & Francis, 2018
- Softcover
Seller: moluna, Greven, Germanymoluna
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Condition: New. Jun Xing is Professor and Director of the General Education Centre at Hong Kong Polytechnic University. He received his PhD in American Studies from the University of Minnesota at Twin Cities. Trained as a cultural historian, Professor Xing specializes i.
Language: English
Published by Routledge, 2018
- Softcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
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Paperback. Condition: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
- Softcover
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Condition: New.
- Hardcover
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Condition: New. pp. 292.
Language: English
Published by Routledge, 2018
- Softcover
- First Edition
Seller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, IrelandKennys Bookshop and Art Galleries Ltd.
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Condition: New. Editor(s): Xing, Jun; Ng, Pak-Sheung; Cheng, Chloe. Num Pages: 256 pages, 11 black & white illustrations, 12 black & white tables. BIC Classification: 1FPCH; 1FPCW; JNAM; JNF; JNM. Category: (UP) Postgraduate, Research & Scholarly. Dimension: 234 x 156. . . 2018. 1st Edition. paperback. . . . .
- Hardcover
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Condition: Hervorragend. Zustand: Hervorragend | Seiten: 292 | Sprache: Englisch | Produktart: Bücher | Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quanti…tative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.
- Hardcover
Seller: moluna, Greven, Germanymoluna
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Electrical Design of Through Silicon Via
Lee, Manho (Edited by)/ Pak, Jun So (Edited by)/ Kim, Joungho (Edited by)
- Hardcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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Hardcover. Condition: Brand New. 2014 edition. 390 pages. 9.50x6.50x1.00 inches. In Stock.
More images- Softcover
Seller: preigu, Osnabrück, Germanypreigu
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Taschenbuch. Condition: Neu. Indigenous Culture, Education and Globalization | Critical Perspectives from Asia | Jun Xing (u. a.) | Taschenbuch | xv | Englisch | 2016 | Springer | EAN 9783662517048 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot…]com | Anbieter: preigu.
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - The book explores the growing tension between indigenous education, the teaching and learning of native knowledge, cultural heritage and traditions and the dynamics of globalization from the Asian perspective. It brings together a distinguished and… multidisciplinary group of Asian scholars and practitioners from Nepal, Korea, India, Japan, Thailand, Indonesia, the Philippines, Hong Kong, Taiwan, mainland China, and the United States. After showcasing six in-depth case studies of local cultural traditions from East, South and Southeast Asia, the book examines a variety of pedagogical strategies in the teaching and learning of indigenous knowledge and culture in the region, reflecting both international trends and the distinctive local and regional characteristics resulting from the tremendous diversity within Asian societies.
Language: English
Published by Taylor & Francis Ltd Feb 2018, 2018
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Taschenbuch. Condition: Neu. Neuware - General Education has taken center stage in the greater China area (Hong Kong, Taiwan and mainland China) because of a number of important developments. First, globalization has created both opportunities and challenges for college students. When they graduate and enter the real world, they… must have the cultural sensitivities and social skills, in addition to their professional training, to compete in a knowledge-based global economy. Equally significant for institutions of higher education, pressing global problems challenge traditional disciplines and demand new forms of learning that reshapes the boundaries of knowledge. In response to those rapidly changing dynamics, general education has taken an increasingly important role in undergraduate education.As the first English publication on the subject, this anthology brings together a distinguished group of General Education scholars and teachers from Hong Kong, Taiwan and mainland China.
Language: English
Published by Springer Netherlands, Springer Netherlands, 2014
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give ins…ights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.
