Lal Roop (31 results)

Condition: Good. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.

Condition: New.

Condition: New.

Condition: New.

Paperback. Condition: Brand New. 412 pages. 9.45x7.09x1.30 inches. In Stock.

Condition: good. Befriedigend/Good: Durchschnittlich erhaltenes Buch bzw. Schutzumschlag mit Gebrauchsspuren, aber vollständigen Seiten. / Describes the average WORN book or dust jacket that has all the pages present.

Paperback. Condition: New. Chiavalon, Antonio (illustrator).

Paperback. Condition: New. Chiavalon, Antonio (illustrator).

Brossura. Condition: new. Illustrazioni di Chiavalon A.Torino, 2024; br., pp. 122, ill., cm 15x21. "Ciò che mi ha portato a scrivere sulla ?arîra Vi?le?a?a è la mia esperienza personale, dato che non sono uno scrittore, semplicemente non voglio che questa conoscenza vada perduta. Ho cercato di dare informazioni quanto più dettagliate possibile, cosa importante, perché la ?arîra Vi?le?a?a non è come la chiromanzia, qui dobbiamo letteralmente toccare con mano la realtà, quando troviamo un organo che funziona male vediamo, anzi, la parola giusta è "sentiamo" che è intossicato o lavora male, percepiamo col tatto se l'organo che troviamo sotto la nostra mano sta creando un problema; confrontando la percezione prima e dopo la guarigione ci baseremmo sull'esperienza diretta. Questo metodo diagnostico indaga il corpo e trova i punti dove si formano ristagni di tossine" (l'autore). Chiavalon, Antonio (illustrator). Libro.…

In-12°, pp. 93, numerose illustrazioni a colori nel testo, brossura editoriale figurata a colori. False (illustrator).

Condition: Buone. italiano Condizioni dell'esterno: Discrete con difetti, segni d'uso Condizioni dell'interno: Buone.

Condition: DISCRETO USATO. IIED. Da revisionare ITALIANO Brossura filo refe, copertina a colori, con tracce da conservazione diffuse, serie sofferenze nel patinato, toni sbiaditi e virati seppia, striature da attrito e densi aloni di polvere, fogli arricchiti da esempi grafici e fotografici, velati da ossidazione avorio, denso pulviscolo ruggine ai tagli. N. pag. 223.…

copertina morbida. Condition: buone. Dust Jacket Condition: buone.

Condition: New.

Condition: Good. Condizioni dettagliate: buone, pieghe sulla copertina, copertina flessibile.

Paperback. Condition: Brand New. 124 pages. 8.66x5.91x0.28 inches. In Stock.

Taschenbuch. Condition: Neu. Banks in Emerging Economic Environment in India | Roop Lal Sharma | Taschenbuch | 124 S. | Englisch | 2018 | LAP LAMBERT Academic Publishing | EAN 9786137348086 | Verantwortliche Person für die EU: preigu GmbH & Co. KG, Lengericher Landstr. 19, 49078 Osnabrück, mail[at]preigu[dot]de | Anbieter: preigu. …

paperback. Condition: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.

Paperback. Condition: New. Chiavalon, Antonio (illustrator).

Paperback. Condition: New. Chiavalon, Antonio (illustrator).

Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -A new text design with more illustration, photos and tables. Coverage of various theoretical perspectives to the study of banking in emerging economic environment. New examples reference and research studies to ensure students are introduced to the latest development in the field. comparison of public and private sector banks made in the book. analyse the role of public &private sector banks in the process of development. 124 pp. Englisch.…

Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -Three-dimensional (3D) Integrated Circuits (ICs) has emerged as a new technology providing noticeable solutions to alleviate problems like greater power consumption, longer interconnects with large delays, etc. In 3D ICs, have multiple layers stacked one above the other. Vertical integration of multiple layers scales up the performance of electronic devices beyond Moore¿s law. It drastically decreases the interconnect length which directly results in increased speed and also combines various technologies (digital, analog, memory, etc.) in a single product, thereby greatly extending the capabilities of System-on-Chip. The objective of this book is to investigate the effects of core utilization on the core and chip area for obtaining the optimal sets of core utilization so that the core and chip area of the 3D ICs can be reduced. Cadence Encounter-to-GDSII has been used for optimization while performing physical designing of the 3D ICs. The literature survey has revealed that majority of the optimization has been performed only at any one of the stages of physical designing while in this book we have done research optimization at three different stages of physical designing. 100 pp. Englisch.…

Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Sharma Roop LalDr.Roop Lal Sharma is working as an Assistant Professor in School of Business at Shri Mata Vaishno Devi University Katra , J & K , India and Ph.D in Economics from University of Jammu. He has published a number of r.…

Condition: New. Print on Demand.

Kartoniert / Broschiert. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Lal RoopDr. Roop Lal is presently working as Assistant Professor in the Mechanical Engineering Department, Delhi Technological University, Delhi. He has 17-years of experience in the aviation sector & over 20 years of teaching experi. …

Condition: New. PRINT ON DEMAND.

Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - A new text design with more illustration, photos and tables. Coverage of various theoretical perspectives to the study of banking in emerging economic environment. New examples reference and research studies to ensure students are introduced to the latest development in the field. comparison of public and private sector banks made in the book. analyse the role of public &private sector banks in the process of development.…

Taschenbuch. Condition: Neu. nach der Bestellung gedruckt Neuware - Printed after ordering - Three-dimensional (3D) Integrated Circuits (ICs) has emerged as a new technology providing noticeable solutions to alleviate problems like greater power consumption, longer interconnects with large delays, etc. In 3D ICs, have multiple layers stacked one above the other. Vertical integration of multiple layers scales up the performance of electronic devices beyond Moore's law. It drastically decreases the interconnect length which directly results in increased speed and also combines various technologies (digital, analog, memory, etc.) in a single product, thereby greatly extending the capabilities of System-on-Chip. The objective of this book is to investigate the effects of core utilization on the core and chip area for obtaining the optimal sets of core utilization so that the core and chip area of the 3D ICs can be reduced. Cadence Encounter-to-GDSII has been used for optimization while performing physical designing of the 3D ICs. The literature survey has revealed that majority of the optimization has been performed only at any one of the stages of physical designing while in this book we have done research optimization at three different stages of physical designing. …

Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -A new text design with more illustration, photos and tables. Coverage of various theoretical perspectives to the study of banking in emerging economic environment. New examples reference and research studies to ensure students are introduced to the latest development in the field. comparison of public and private sector banks made in the book. analyse the role of public &private sector banks in the process of development.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 124 pp. Englisch.…

Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -Three-dimensional (3D) Integrated Circuits (ICs) has emerged as a new technology providing noticeable solutions to alleviate problems like greater power consumption, longer interconnects with large delays, etc. In 3D ICs, have multiple layers stacked one above the other. Vertical integration of multiple layers scales up the performance of electronic devices beyond Moore's law. It drastically decreases the interconnect length which directly results in increased speed and also combines various technologies (digital, analog, memory, etc.) in a single product, thereby greatly extending the capabilities of System-on-Chip. The objective of this book is to investigate the effects of core utilization on the core and chip area for obtaining the optimal sets of core utilization so that the core and chip area of the 3D ICs can be reduced. Cadence Encounter-to-GDSII has been used for optimization while performing physical designing of the 3D ICs. The literature survey has revealed that majority of the optimization has been performed only at any one of the stages of physical designing while in this book we have done research optimization at three different stages of physical designing.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 100 pp. Englisch. …