Korgaonkar Kunal (26 results)
Language: English
Published by Springer, 2021
Series: Book 275 of 292 - IFIP Advances in Information and Communication Technology
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Vlsi-soc Design Trends : 28th Ifip Wg 10.5/Ieee International Conference on Very Large Scale Integration, Vlsi-soc 2020, Salt Lake City, Ut, USA, October 6?9, 2020, Revised Selected Papers
Calimera, Andrea (EDT); Gaillardon, Pierre-emmanuel (EDT); Korgaonkar, Kunal (EDT); Kvatinsky, Shahar (EDT); Reis, Ricardo (EDT)
Language: English
Published by Springer, 2021
Series: Book 275 of 292 - IFIP Advances in Information and Communication Technology
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Language: English
Published by Springer, 2021
Series: Book 275 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
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Language: English
Published by Springer, 2022
Series: Book 275 of 292 - IFIP Advances in Information and Communication Technology
- Softcover
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Vlsi-soc Design Trends : 28th Ifip Wg 10.5/Ieee International Conference on Very Large Scale Integration, Vlsi-soc 2020, Salt Lake City, Ut, USA, October 6?9, 2020, Revised Selected Papers
Calimera, Andrea (EDT); Gaillardon, Pierre-emmanuel (EDT); Korgaonkar, Kunal (EDT); Kvatinsky, Shahar (EDT); Reis, Ricardo (EDT)
Language: English
Published by Springer, 2021
Series: Book 275 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
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Vlsi-soc Design Trends : 28th Ifip Wg 10.5/Ieee International Conference on Very Large Scale Integration, Vlsi-soc 2020, Salt Lake City, Ut, USA, October 6?9, 2020, Revised Selected Papers
Calimera, Andrea (EDT); Gaillardon, Pierre-emmanuel (EDT); Korgaonkar, Kunal (EDT); Kvatinsky, Shahar (EDT); Reis, Ricardo (EDT)
Language: English
Published by Springer, 2021
Series: Book 275 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
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Vlsi-soc Design Trends : 28th Ifip Wg 10.5/Ieee International Conference on Very Large Scale Integration, Vlsi-soc 2020, Salt Lake City, Ut, USA, October 6?9, 2020, Revised Selected Papers
Calimera, Andrea (EDT); Gaillardon, Pierre-emmanuel (EDT); Korgaonkar, Kunal (EDT); Kvatinsky, Shahar (EDT); Reis, Ricardo (EDT)
Language: English
Published by Springer, 2021
Series: Book 275 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
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Language: English
Published by Springer, 2022
Series: Book 275 of 292 - IFIP Advances in Information and Communication Technology
- Softcover
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Condition: New. 1st ed. 2021 edition NO-PA16APR2015-KAP.
Language: English
Published by Springer, 2021
Series: Book 275 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
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Published by Springer, 2022
Series: Book 275 of 292 - IFIP Advances in Information and Communication Technology
- Softcover
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Taschenbuch. Condition: Neu. VLSI-SoC: Design Trends | 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, Salt Lake City, UT, USA, October 6-9, 2020, Revised and Extended Selected Papers | Andrea Calimera (u. a.) | Taschenbuch | IFIP Advances in Information and Communication Technolog…y | xviii | Englisch | 2022 | Springer | EAN 9783030816438 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Language: English
Published by Springer International Publishing, 2021
Series: Book 275 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
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Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, held in Salt Lake City, UT, USA, in October 2020.\*The 16 full papers incl…uded in this volume were carefully reviewed and selected from the 38 papers (out of 74 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like low-power design of RF, analog and mixed-signal circuits, EDA tools for the synthesis and verification of heterogenous SoCs, accelerators for cryptography and deep learning and on-chip Interconnection system, reliability and testing, and integration of 3D-ICs.\*The conference was held virtually.
Language: English
Published by Springer-Nature New York Inc, 2021
Series: Book 275 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
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Language: English
Published by Springer, 2022
Series: Book 275 of 292 - IFIP Advances in Information and Communication Technology
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, held in Salt Lake City, UT, USA, in October 2020.\*The 16 full pape…rs included in this volume were carefully reviewed and selected from the 38 papers (out of 74 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like low-power design of RF, analog and mixed-signal circuits, EDA tools for the synthesis and verification of heterogenous SoCs, accelerators for cryptography and deep learning and on-chip Interconnection system, reliability and testing, and integration of 3D-ICs.\*The conference was held virtually.
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Jain PrabhatPrabhat Jain received the MS degree in Computer Science from University of Illinois at Urbana-Champaign in 2012. He also holds a bachelor s degree in Computer Science and Engineering from th…e Indian Institute of Technolog.
Language: English
Published by Springer, 2022
Series: Book 275 of 292 - IFIP Advances in Information and Communication Technology
- Softcover
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Language: English
Published by Springer, 2021
Series: Book 275 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
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Language: English
Published by Springer International Publishing Jul 2022, 2022
Series: Book 275 of 292 - IFIP Advances in Information and Communication Technology
- Softcover
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Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book contains extended and revised versions of the best papers presented at the 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, held in Salt Lake City, UT, USA, in October 2020.\*…The 16 full papers included in this volume were carefully reviewed and selected from the 38 papers (out of 74 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like low-power design of RF, analog and mixed-signal circuits, EDA tools for the synthesis and verification of heterogenous SoCs, accelerators for cryptography and deep learning and on-chip Interconnection system, reliability and testing, and integration of 3D-ICs.\*The conference was held virtually. 384 pp. Englisch.
Language: English
Published by Springer International Publishing Jul 2021, 2021
Series: Book 275 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
- Print on Demand
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Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book contains extended and revised versions of the best papers presented at the 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, held in Salt Lake City, UT, USA, in October 2020.\*The 16…full papers included in this volume were carefully reviewed and selected from the 38 papers (out of 74 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like low-power design of RF, analog and mixed-signal circuits, EDA tools for the synthesis and verification of heterogenous SoCs, accelerators for cryptography and deep learning and on-chip Interconnection system, reliability and testing, and integration of 3D-ICs.\*The conference was held virtually. 384 pp. Englisch.
Language: English
Published by Springer, Berlin|Springer International Publishing|Springer, 2022
Series: Book 275 of 292 - IFIP Advances in Information and Communication Technology
- Softcover
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Kartoniert / Broschiert. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book contains extended and revised versions of the best papers presented at the 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, held in Sal…t Lake City, UT, USA, in October 2020.*The 16 full papers incl.
Language: English
Published by Springer, Berlin|Springer International Publishing|Springer, 2021
Series: Book 275 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book contains extended and revised versions of the best papers presented at the 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, held in Salt Lake City, UT, USA, in…October 2020.*The 16 full papers incl.
Language: English
Published by Springer, 2022
Series: Book 275 of 292 - IFIP Advances in Information and Communication Technology
- Softcover
- Print on Demand
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Language: English
Published by Springer, 2021
Series: Book 275 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
- Print on Demand
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Language: English
Published by Springer, Springer Jul 2022, 2022
Series: Book 275 of 292 - IFIP Advances in Information and Communication Technology
- Softcover
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Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book contains extended and revised versions of the best papers presented at the 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, held in Salt Lake City, UT, USA, in October 2020.\*The…16 full papers included in this volume were carefully reviewed and selected from the 38 papers (out of 74 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like low-power design of RF, analog and mixed-signal circuits, EDA tools for the synthesis and verification of heterogenous SoCs, accelerators for cryptography and deep learning and on-chip Interconnection system, reliability and testing, and integration of 3D-ICs.\*The conference was held virtually.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 384 pp. Englisch.
Language: English
Published by Springer, Springer Jul 2021, 2021
Series: Book 275 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
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Buch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book contains extended and revised versions of the best papers presented at the 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, held in Salt Lake City, UT, USA, in October 2020.\*The 16 full… papers included in this volume were carefully reviewed and selected from the 38 papers (out of 74 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like low-power design of RF, analog and mixed-signal circuits, EDA tools for the synthesis and verification of heterogenous SoCs, accelerators for cryptography and deep learning and on-chip Interconnection system, reliability and testing, and integration of 3D-ICs.\*The conference was held virtually.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 384 pp. Englisch.
Language: English
Published by Springer, 2021
Series: Book 275 of 292 - IFIP Advances in Information and Communication Technology
- Hardcover
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Language: English
Published by Springer, 2022
Series: Book 275 of 292 - IFIP Advances in Information and Communication Technology
- Softcover
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