Seller: WeBuyBooks, Rossendale, LANCS, United Kingdom
Condition: Like New. Most items will be dispatched the same or the next working day. An apparently unread copy in perfect condition. Dust cover is intact with no nicks or tears. Spine has no signs of creasing. Pages are clean and not marred by notes or folds of any kind.
Seller: Ria Christie Collections, Uxbridge, United Kingdom
£ 114.30
Quantity: Over 20 available
Add to basketCondition: New. In.
Seller: Ria Christie Collections, Uxbridge, United Kingdom
£ 114.60
Quantity: Over 20 available
Add to basketCondition: New. In.
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Condition: As New. Unread book in perfect condition.
Seller: GreatBookPrices, Columbia, MD, U.S.A.
Condition: New.
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
£ 114.29
Quantity: Over 20 available
Add to basketCondition: New.
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
£ 130.08
Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
Condition: New. 1st ed. 2021 edition NO-PA16APR2015-KAP.
Seller: Books Puddle, New York, NY, U.S.A.
Condition: New. 1st ed. 2021 edition NO-PA16APR2015-KAP.
Language: English
Published by Springer International Publishing, 2022
ISBN 10: 3030816435 ISBN 13: 9783030816438
Seller: AHA-BUCH GmbH, Einbeck, Germany
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, held in Salt Lake City, UT, USA, in October 2020.\*The 16 full papers included in this volume were carefully reviewed and selected from the 38 papers (out of 74 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like low-power design of RF, analog and mixed-signal circuits, EDA tools for the synthesis and verification of heterogenous SoCs, accelerators for cryptography and deep learning and on-chip Interconnection system, reliability and testing, and integration of 3D-ICs.\*The conference was held virtually.
Language: English
Published by Springer International Publishing, 2021
ISBN 10: 3030816400 ISBN 13: 9783030816407
Seller: AHA-BUCH GmbH, Einbeck, Germany
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, held in Salt Lake City, UT, USA, in October 2020.\*The 16 full papers included in this volume were carefully reviewed and selected from the 38 papers (out of 74 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like low-power design of RF, analog and mixed-signal circuits, EDA tools for the synthesis and verification of heterogenous SoCs, accelerators for cryptography and deep learning and on-chip Interconnection system, reliability and testing, and integration of 3D-ICs.\*The conference was held virtually.
Language: English
Published by Springer International Publishing, Springer Nature Switzerland Jul 2022, 2022
ISBN 10: 3030816435 ISBN 13: 9783030816438
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Taschenbuch. Condition: Neu. Neuware -This book contains extended and revised versions of the best papers presented at the 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, held in Salt Lake City, UT, USA, in October 2020.\*The 16 full papers included in this volume were carefully reviewed and selected from the 38 papers (out of 74 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like low-power design of RF, analog and mixed-signal circuits, EDA tools for the synthesis and verification of heterogenous SoCs, accelerators for cryptography and deep learning and on-chip Interconnection system, reliability and testing, and integration of 3D-ICs.\*The conference was held virtually.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 384 pp. Englisch.
Language: English
Published by Springer Nature Switzerland, Springer International Publishing Jul 2021, 2021
ISBN 10: 3030816400 ISBN 13: 9783030816407
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Buch. Condition: Neu. Neuware -This book contains extended and revised versions of the best papers presented at the 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, held in Salt Lake City, UT, USA, in October 2020.\*The 16 full papers included in this volume were carefully reviewed and selected from the 38 papers (out of 74 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like low-power design of RF, analog and mixed-signal circuits, EDA tools for the synthesis and verification of heterogenous SoCs, accelerators for cryptography and deep learning and on-chip Interconnection system, reliability and testing, and integration of 3D-ICs.\*The conference was held virtually.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 384 pp. Englisch.
Language: English
Published by Springer-Nature New York Inc, 2021
ISBN 10: 3030816400 ISBN 13: 9783030816407
Seller: Revaluation Books, Exeter, United Kingdom
Hardcover. Condition: Brand New. 382 pages. 9.25x6.10x9.21 inches. In Stock.
Language: English
Published by LAP LAMBERT Academic Publishing, 2012
ISBN 10: 3847376241 ISBN 13: 9783847376248
Seller: moluna, Greven, Germany
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Autor/Autorin: Jain PrabhatPrabhat Jain received the MS degree in Computer Science from University of Illinois at Urbana-Champaign in 2012. He also holds a bachelor s degree in Computer Science and Engineering from the Indian Institute of Technolog.
Language: English
Published by Springer International Publishing Jul 2022, 2022
ISBN 10: 3030816435 ISBN 13: 9783030816438
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book contains extended and revised versions of the best papers presented at the 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, held in Salt Lake City, UT, USA, in October 2020.\*The 16 full papers included in this volume were carefully reviewed and selected from the 38 papers (out of 74 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like low-power design of RF, analog and mixed-signal circuits, EDA tools for the synthesis and verification of heterogenous SoCs, accelerators for cryptography and deep learning and on-chip Interconnection system, reliability and testing, and integration of 3D-ICs.\*The conference was held virtually. 384 pp. Englisch.
Language: English
Published by Springer International Publishing Jul 2021, 2021
ISBN 10: 3030816400 ISBN 13: 9783030816407
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book contains extended and revised versions of the best papers presented at the 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, held in Salt Lake City, UT, USA, in October 2020.\*The 16 full papers included in this volume were carefully reviewed and selected from the 38 papers (out of 74 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like low-power design of RF, analog and mixed-signal circuits, EDA tools for the synthesis and verification of heterogenous SoCs, accelerators for cryptography and deep learning and on-chip Interconnection system, reliability and testing, and integration of 3D-ICs.\*The conference was held virtually. 384 pp. Englisch.
Language: English
Published by Springer, Berlin|Springer International Publishing|Springer, 2021
ISBN 10: 3030816400 ISBN 13: 9783030816407
Seller: moluna, Greven, Germany
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book contains extended and revised versions of the best papers presented at the 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, held in Salt Lake City, UT, USA, in October 2020.*The 16 full papers incl.
Language: English
Published by Springer, Berlin|Springer International Publishing|Springer, 2022
ISBN 10: 3030816435 ISBN 13: 9783030816438
Seller: moluna, Greven, Germany
Kartoniert / Broschiert. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. This book contains extended and revised versions of the best papers presented at the 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, held in Salt Lake City, UT, USA, in October 2020.*The 16 full papers incl.
Condition: New. Print on Demand.
Seller: Majestic Books, Hounslow, United Kingdom
Condition: New. Print on Demand.
Seller: preigu, Osnabrück, Germany
Taschenbuch. Condition: Neu. VLSI-SoC: Design Trends | 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, Salt Lake City, UT, USA, October 6-9, 2020, Revised and Extended Selected Papers | Andrea Calimera (u. a.) | Taschenbuch | xviii | Englisch | 2022 | Springer | EAN 9783030816438 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
Seller: preigu, Osnabrück, Germany
Buch. Condition: Neu. VLSI-SoC: Design Trends | 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, Salt Lake City, UT, USA, October 6-9, 2020, Revised and Extended Selected Papers | Andrea Calimera (u. a.) | Buch | xviii | Englisch | 2021 | Springer | EAN 9783030816407 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
Seller: Biblios, Frankfurt am main, HESSE, Germany
Condition: New. PRINT ON DEMAND.
Seller: Biblios, Frankfurt am main, HESSE, Germany
Condition: New. PRINT ON DEMAND.