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Kada Morihiro (27 results)
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Condition: As New. Unread book in perfect condition.
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Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 96.88
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Three-dimensional Integration of Semiconductors : Processing, Materials, and Applications
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New.
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Condition: New. pp. 507.
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Three-dimensional Integration of Semiconductors : Processing, Materials, and Applications
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 107.92
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
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Hardcover. Condition: Brand New. 430 pages. 9.25x6.10x1.11 inches. In Stock.
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Three-Dimensional Integration of Semiconductors : Processing, Materials, and Applications
Language: English
Published by Springer International Publishing, Springer, 2015
ISBN 10: 3319186744 ISBN 13: 9783319186740
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.
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Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 137.84
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Condition: As New. Unread book in perfect condition.
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Condition: New. pp. 428.
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Taschenbuch. Condition: Neu. Three-Dimensional Integration of Semiconductors | Processing, Materials, and Applications | Kazuo Kondo (u. a.) | Taschenbuch | xix | Englisch | 2019 | Springer | EAN 9783319792552 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Three-Dimensional Integration of Semiconductors : Processing, Materials, and Applications
Language: English
Published by Springer International Publishing, Springer International Publishing, 2019
ISBN 10: 3319792555 ISBN 13: 9783319792552
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.
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Paperback. Condition: Brand New. reprint edition. 428 pages. 9.25x6.10x0.97 inches. In Stock.
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Three-Dimensional Integration of Semiconductors
Language: English
Published by Springer International Publishing, Springer International Publishing Dez 2015, 2015
ISBN 10: 3319186744 ISBN 13: 9783319186740
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects. 428 pp. Englisch.
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Condition: new. Questo è un articolo print on demand.
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Condition: new. Questo è un articolo print on demand.
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Three Dimensional Interconnects
Language: English
Published by Springer International Publishing, 2015
ISBN 10: 3319186744 ISBN 13: 9783319186740
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Gives instruction on how to build three-dimensional interconnectsIntroduces materials and processing for three-dimensional packagingDiscuss many applications of three-dimensional packagingKazuo Kondo is Professor at Depart.
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Condition: New. Print on Demand pp. 507.
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Condition: New. PRINT ON DEMAND pp. 507.
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Three-Dimensional Integration of Semiconductors
Language: English
Published by Springer, Springer Dez 2015, 2015
ISBN 10: 3319186744 ISBN 13: 9783319186740
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Seller rating 5 out of 5 stars
Buch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book starts with backgroundconcerning three-dimensional integration - including theirlow energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations.The book covers numerous applications, includingnext generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 428 pp. Englisch.
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Three-Dimensional Integration of Semiconductors
Language: English
Published by Springer International Publishing Mrz 2019, 2019
ISBN 10: 3319792555 ISBN 13: 9783319792552
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects. 428 pp. Englisch.
-
Three-Dimensional Integration of Semiconductors
Language: English
Published by Springer International Publishing, 2019
ISBN 10: 3319792555 ISBN 13: 9783319792552
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Gives instruction on how to build three-dimensional interconnectsIntroduces materials and processing for three-dimensional packagingDiscuss many applications of three-dimensional packagingKazuo Kondo is Professor at Depart.
-
Condition: New. Print on Demand pp. 428.
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Condition: New. PRINT ON DEMAND pp. 428.
-
Three-Dimensional Integration of Semiconductors
Language: English
Published by Springer, Springer Mär 2019, 2019
ISBN 10: 3319792555 ISBN 13: 9783319792552
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book starts with backgroundconcerning three-dimensional integration - including theirlow energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations.The book covers numerous applications, includingnext generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 428 pp. Englisch.
