Kada Morihiro (26 results)
- Hardcover
Seller: Hamelyn, Madrid, M, SpainHamelyn
Contact seller5-star sellerCondition: Used - Near fine
£ 60.41
£ 11.14 shippingShips from Spain to U.S.A.Quantity: 1 available
Condition: Muy bueno. : Este libro trata sobre las interconexiones tridimensionales, centrándose en el procesamiento, los materiales y las aplicaciones avanzadas. Explora en detalle los semiconductores y otros aspectos relacionados con la tecnología de interconexión tridimensional. EAN: 9783319186740 Tipo: Libros Categoría: Tecn…ología Título: Three Dimensional Interconnects Autor: Kenji Takahashi| Kazuo Kondo| Morihiro Kada Idioma: eng Páginas: 408 Formato: Tapa dura Año de publicación: 2015.
Three-dimensional Integration of Semiconductors : Processing, Materials, and Applications
Kondo, Kazuo (EDT); Takahashi, Kenji (EDT); Kada, Morihiro (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
£ 104.86
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Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
£ 96.88
£ 11.98 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
Three-dimensional Integration of Semiconductors : Processing, Materials, and Applications
Kondo, Kazuo (EDT); Takahashi, Kenji (EDT); Kada, Morihiro (EDT)
- Hardcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: New
£ 113.54
£ 1.94 shippingShips within U.S.A.Quantity: Over 20 available
Condition: New.
Three-dimensional Integration of Semiconductors : Processing, Materials, and Applications
Kondo, Kazuo (EDT); Takahashi, Kenji (EDT); Kada, Morihiro (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: New
£ 96.87
£ 15.00 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New.
- Hardcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
£ 120.30
£ 2.93 shippingShips within U.S.A.Quantity: 4 available
Condition: New. pp. 507.
Three-dimensional Integration of Semiconductors : Processing, Materials, and Applications
Kondo, Kazuo (EDT); Takahashi, Kenji (EDT); Kada, Morihiro (EDT)
- Hardcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
£ 107.41
£ 15.00 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications
Kondo, Kazuo (Edited by)/ Kada, Morihiro (Edited by)/ Takahashi, Kenji (Edited by)
- Hardcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
Contact seller5-star sellerCondition: New
£ 129.41
£ 12.50 shippingShips from United Kingdom to U.S.A.Quantity: 2 available
Hardcover. Condition: Brand New. 430 pages. 9.25x6.10x1.11 inches. In Stock.
Language: English
Published by Springer International Publishing, Springer, 2015
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
£ 94.47
£ 54.89 shippingShips from Germany to U.S.A.Quantity: 1 available
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book c…overs numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
Contact seller5-star sellerCondition: New
£ 137.84
£ 11.98 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
£ 168.63
£ 2.93 shippingShips within U.S.A.Quantity: 4 available
Condition: New. pp. 428.
More images- Softcover
Seller: preigu, Osnabrück, Germanypreigu
Contact seller5-star sellerCondition: New
£ 123.70
£ 60.01 shippingShips from Germany to U.S.A.Quantity: 5 available
Taschenbuch. Condition: Neu. Three-Dimensional Integration of Semiconductors | Processing, Materials, and Applications | Kazuo Kondo (u. a.) | Taschenbuch | xix | Englisch | 2019 | Springer | EAN 9783319792552 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]…springer[dot]com | Anbieter: preigu.
Language: English
Published by Springer International Publishing, Springer International Publishing, 2019
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
£ 141.70
£ 54.20 shippingShips from Germany to U.S.A.Quantity: 1 available
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The… book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.
Three-dimensional Integration of Semiconductors: Processing, Materials, and Applications
Kondo, Kazuo (Editor)/ Kada, Morihiro (Editor)/ Takahashi, Kenji (Editor)
- Softcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
Contact seller5-star sellerCondition: New
£ 194.30
£ 12.50 shippingShips from United Kingdom to U.S.A.Quantity: 2 available
Paperback. Condition: Brand New. reprint edition. 428 pages. 9.25x6.10x0.97 inches. In Stock.
Language: English
Published by Springer International Publishing, Springer International Publishing Dez 2015, 2015
- Hardcover
- Print on Demand
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
Contact seller5-star sellerCondition: New
£ 94.47
£ 19.72 shippingShips from Germany to U.S.A.Quantity: 1 available
Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situat…ions. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects. 428 pp. Englisch.
- Hardcover
- Print on Demand
Seller: Brook Bookstore On Demand, Napoli, NA, ItalyBrook Bookstore On Demand
Contact seller5-star sellerCondition: New
£ 76.15
£ 39.43 shippingShips from Italy to U.S.A.Quantity: Over 20 available
Condition: new. Questo è un articolo print on demand.
- Softcover
- Print on Demand
Seller: Brook Bookstore On Demand, Napoli, NA, ItalyBrook Bookstore On Demand
Contact seller5-star sellerCondition: New
£ 111.48
£ 5.83 shippingShips from Italy to U.S.A.Quantity: Over 20 available
Condition: new. Questo è un articolo print on demand.
- Hardcover
- Print on Demand
Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
£ 79.46
£ 42.00 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Gives instruction on how to build three-dimensional interconnectsIntroduces materials and processing for three-dimensional packagingDiscuss many applications of three-dimensional packagingKazuo Kondo is Professor at D…epart.
- Hardcover
- Print on Demand
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
Contact seller4-star sellerCondition: New
£ 123.69
£ 6.50 shippingShips from United Kingdom to U.S.A.Quantity: 4 available
Condition: New. Print on Demand pp. 507.
- Hardcover
- Print on Demand
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
Contact seller4-star sellerCondition: New
£ 130.22
£ 8.53 shippingShips from Germany to U.S.A.Quantity: 4 available
Condition: New. PRINT ON DEMAND pp. 507.
- Hardcover
- Print on Demand
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germanybuchversandmimpf2000
Contact seller5-star sellerCondition: New
£ 94.47
£ 51.43 shippingShips from Germany to U.S.A.Quantity: 1 available
Buch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book starts with backgroundconcerning three-dimensional integration - including theirlow energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations.T…he book covers numerous applications, includingnext generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 428 pp. Englisch.
- Softcover
- Print on Demand
Seller: moluna, Greven, Germanymoluna
Contact seller5-star sellerCondition: New
£ 117.21
£ 42.00 shippingShips from Germany to U.S.A.Quantity: Over 20 available
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Gives instruction on how to build three-dimensional interconnectsIntroduces materials and processing for three-dimensional packagingDiscuss many applications of three-dimensional packagingKazuo Kondo is Professor at D…epart.
Language: English
Published by Springer International Publishing Mrz 2019, 2019
- Softcover
- Print on Demand
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
Contact seller5-star sellerCondition: New
£ 141.70
£ 19.72 shippingShips from Germany to U.S.A.Quantity: 2 available
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular… situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects. 428 pp. Englisch.
- Softcover
- Print on Demand
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
Contact seller4-star sellerCondition: New
£ 175.88
£ 6.50 shippingShips from United Kingdom to U.S.A.Quantity: 4 available
Condition: New. Print on Demand pp. 428.
- Softcover
- Print on Demand
Seller: Biblios, frankfurt am main, HESSE, GermanyBiblios
Contact seller4-star sellerCondition: New
£ 185.69
£ 8.53 shippingShips from Germany to U.S.A.Quantity: 4 available
Condition: New. PRINT ON DEMAND pp. 428.
- Softcover
- Print on Demand
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germanybuchversandmimpf2000
Contact seller5-star sellerCondition: New
£ 141.70
£ 51.43 shippingShips from Germany to U.S.A.Quantity: 1 available
Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -This book starts with backgroundconcerning three-dimensional integration - including theirlow energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situa…tions.The book covers numerous applications, includingnext generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 428 pp. Englisch.
