Seller: -OnTimeBooks-, Phoenix, AZ, U.S.A.
Condition: good. A copy that has been read, remains in good condition. All pages are intact, and the cover is intact. The spine and cover show signs of wear. Pages can include notes and highlighting and show signs of wear, and the copy can include "From the library of" labels or previous owner inscriptions. 100% GUARANTEE! Shipped with delivery confirmation, if you're not satisfied with purchase please return item for full refund. Ships via media mail.
paperback. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
Seller: ThriftBooks-Dallas, Dallas, TX, U.S.A.
Paperback. Condition: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.
Language: English
Published by Pearson Education, Limited, 2000
ISBN 10: 0201618605 ISBN 13: 9780201618600
Seller: Better World Books, Mishawaka, IN, U.S.A.
Condition: Very Good. Pages intact with possible writing/highlighting. Binding strong with minor wear. Dust jackets/supplements may not be included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
Language: English
Published by Pearson Education, Limited, 2000
ISBN 10: 0201618605 ISBN 13: 9780201618600
Seller: Better World Books: West, Reno, NV, U.S.A.
Condition: Good. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
Language: English
Published by Pearson Education, Limited, 2000
ISBN 10: 0201618605 ISBN 13: 9780201618600
Seller: Better World Books, Mishawaka, IN, U.S.A.
Condition: Good. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
Paperback. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
Condition: acceptable. Fairly worn, but readable and intact. If applicable: Dust jacket, disc or access code may not be included.
Language: English
Published by Van Nostrand Reinhold, New York, 1993
ISBN 10: 0442012365 ISBN 13: 9780442012366
Seller: Book Booth, Berea, OH, U.S.A.
Hardcover. Condition: Very Good. Pages clean & bright; binding tight; very minor wear to covers. 875 pages. Illustrated. "Emphasizing MCM fundamentals and reporting real MCM experiences, this book is intended for those who need a broad exposure to the concepts underlying the design, fabrication, packaging, assembly and manufacture of multichip modules." Size: 6" x 9".
Language: English
Published by Pearson/Prentice Hall, 2019
ISBN 10: 0201618605 ISBN 13: 9780201618600
Seller: Reader's Corner, Inc., Raleigh, NC, U.S.A.
First Edition
Hardcover. Condition: Fine. No Jacket. 1st Edition. This is a fine hardcover first edition, first printing copy, no DJ, white/black spine, 314 pages with index.
Language: English
Published by World Scientific Publishing Company, 1996
ISBN 10: 9810223072 ISBN 13: 9789810223076
Seller: La bataille des livres, Pradinas, France
Condition: Très bon. High Performance Design Automation for Multi-Chip Modules and Packages | Cho, Jun-Dong | World Scientific Pub Co Inc, 1996. In-8° cartonné, 254p . Couverture propre . Dos solide. Intérieur frais sans soulignage ou annotation. Exemplaire de bibliothèque : petit code barre en pied de 1re de couv., cotation au dos, rares et discrets petits tampons à l'intérieur de l'ouvrage.Très bon état général pour cet ouvrage. [Ba 52+] Pour les expéditions internationales, nous consulter au préalable pour l ajustement des frais de port qui seront peut-être revus à la baisse/ For international shipments, please contact us in advance to adjust shipping costs. |.
hardcover. Condition: Good. Hardcover ex-library with typical marks shows moderate cover wear. Text is unmarked. Ships FAST!
Seller: Bibliomadness, Worthington, MA, U.S.A.
First Edition
Hardcover. Condition: Good. 1st Edition. Note older edition, copyright 2001. Good condition. Some edgewear. Used and bookstore stickers on spine and rear cover. A handful of pages with some pencil markings. All intact. Good reading or reference copy.
paperback. Condition: As New.
Condition: New. Satisfaction Guaranteed or your money back.
Seller: BennettBooksLtd, Los Angeles, CA, U.S.A.
paperback. Condition: New. In shrink wrap. Looks like an interesting title!
Language: English
Published by World Scientific Pub Co Inc, 1996
ISBN 10: 9810223072 ISBN 13: 9789810223076
Seller: Mispah books, Redhill, SURRE, United Kingdom
Hardcover. Condition: Like New. Like NewLIKE NEW. book.
Language: English
Published by CRC Press 2006-03-23, 2006
ISBN 10: 0849379245 ISBN 13: 9780849379246
Seller: Chiron Media, Wallingford, United Kingdom
Hardcover. Condition: New.
Language: English
Published by World Scientific Publishing Company, 1996
ISBN 10: 9810223072 ISBN 13: 9789810223076
Seller: Aragon Books Canada, OTTAWA, ON, Canada
Hardcover. Condition: New.
Seller: Ria Christie Collections, Uxbridge, United Kingdom
£ 184.30
Quantity: Over 20 available
Add to basketCondition: New. In.
Hardcover. Condition: New. In shrink wrap. Looks like an interesting title!
Gebunden. Condition: New. Far from being the passive containers for semiconductor devices of the past, the packages in today s high performance computers pose numerous challenges in interconnecting, powering, cooling and protecting devices. While semiconductor circuit performance me.
Seller: Mispah books, Redhill, SURRE, United Kingdom
Hardcover. Condition: Like New. Like New. book.