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High Performance Design Automation for Multi-chip Modules (Current Topics in Electronics & Systems): 5 (Selected Topics in Electronics and Systems) - Hardcover
Synopsis
Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.
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High Performance Design Automation for Multi-Chip Modules and Packages
Published by
World Scientific Publishing Company, 1996
ISBN 10: 9810223072
ISBN 13: 9789810223076
Used
Hardcover
Seller: La bataille des livres, Pradinas, France
Seller rating 5 out of 5 stars
Condition: Très bon. High Performance Design Automation for Multi-Chip Modules and Packages | Cho, Jun-Dong | World Scientific Pub Co Inc, 1996. In-8° cartonné, 254p . Couverture propre . Dos solide. Intérieur frais sans soulignage ou annotation. Exemplaire de bibliothèque : petit code barre en pied de 1re de couv., cotation au dos, rares et discrets petits tampons à l'intérieur de l'ouvrage.Très bon état général pour cet ouvrage. [Ba 52+] Pour les expéditions internationales, nous consulter au préalable pour l ajustement des frais de port qui seront peut-être revus à la baisse/ For international shipments, please contact us in advance to adjust shipping costs. |. Seller Inventory # 00-QHTT-IRAJ
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HIGH PERFORMANCE DESIGN AUTOMATION FOR MULTI-CHIP MODULES AND PACKAGES (Selected Topics in Electronics and Systems)
Published by
World Scientific Publishing Company, 1996
ISBN 10: 9810223072
ISBN 13: 9789810223076
New
Hardcover
Seller: Russell Books, Victoria, BC, Canada
Seller rating 5 out of 5 stars
hardcover. Condition: New. Special order direct from the distributor. Seller Inventory # ING9789810223076
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HIGH PERFORMANCE DESIGN AUTOMATION FOR MULTI-CHIP MODULES AND PACKAGES (Hardcover)
Published by
World Scientific Publishing Co Pte Ltd, Singapore, 1996
ISBN 10: 9810223072
ISBN 13: 9789810223076
New
Hardcover
Seller: Grand Eagle Retail, Bensenville, IL, U.S.A.
Seller rating 5 out of 5 stars
Hardcover. Condition: new. Hardcover. Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers in this issue cover: design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems arisen in MCM and other packages. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. Seller Inventory # 9789810223076
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High Performance Design Automation for Multi-Chip Modules and Packages
Published by
WORLD SCIENTIFIC PUB CO INC, 1996
ISBN 10: 9810223072
ISBN 13: 9789810223076
New
Hardcover
Seller: moluna, Greven, Germany
Seller rating 5 out of 5 stars
Condition: New. KlappentextrnrnThe aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partiti. Seller Inventory # 909655129
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High Performance Design Automation for Multi-Chip Modules and Packages (Current Topics in Electronics and Systems, Vol 5)
Published by
World Scientific Pub Co Inc, 1996
ISBN 10: 9810223072
ISBN 13: 9789810223076
Used
Hardcover
Seller: Mispah books, Redhill, SURRE, United Kingdom
Seller rating 4 out of 5 stars
Hardcover. Condition: Like New. Like NewLIKE NEW. book. Seller Inventory # ERICA85498102230723
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HIGH PERFORMANCE DESIGN AUTOMATION FOR MULTI-CHIP MODULES AND PACKAGES (Hardcover)
Published by
World Scientific Publishing Co Pte Ltd, Singapore, 1996
ISBN 10: 9810223072
ISBN 13: 9789810223076
New
Hardcover
Seller: AussieBookSeller, Truganina, VIC, Australia
Seller rating 5 out of 5 stars
Hardcover. Condition: new. Hardcover. Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers in this issue cover: design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems arisen in MCM and other packages. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability. Seller Inventory # 9789810223076
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High Performance Design Automation for Multi-Chip Modules and Packages
Published by
World Scientific Publishing Company Jun 1996, 1996
ISBN 10: 9810223072
ISBN 13: 9789810223076
New
Hardcover
Seller: AHA-BUCH GmbH, Einbeck, Germany
Seller rating 5 out of 5 stars
Buch. Condition: Neu. Neuware - Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages. Seller Inventory # 9789810223076
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High Performance Design Automation For Multi-chip Modules And Packages (Volume 5) Cho, Jun Dong and Franzon, Paul D
Published by
World Scientific Publishing Company, 1996
ISBN 10: 9810223072
ISBN 13: 9789810223076
New
Hardcover
Seller: Aragon Books Canada, OTTAWA, ON, Canada
Seller rating 3 out of 5 stars
Hardcover. Condition: New. Seller Inventory # RCBT--102