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Evans Jillian (66 results)
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Paperback. Condition: Good. No Jacket. Julie Evans. Sarah Schultz (illustrator). Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less.
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Paperback. Condition: Very Good. No Jacket. Julie Evans. Sarah Schultz (illustrator). May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.
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The Fascial Network
Language: English
Published by Meyer & Meyer Sport, Limited, 2015
ISBN 10: 1782550690 ISBN 13: 9781782550693
Condition: Good. Former library copy. Pages intact with minimal writing/highlighting. The binding may be loose and creased. Dust jackets/supplements are not included. Includes library markings. Stock photo provided. Product includes identifying sticker. Better World Books: Buy Books. Do Good.
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Life Lessons Through a Teacher's Eyes
First Edition
paperback. Condition: Like New. Julie Evans. Sarah Schultz (illustrator). First Edition. Ships in a BOX from Central Missouri! Like Brand NEW. No tears, highlighting or writing because it's never been used! May have minor shelf wear. UPS shipping for most packages, (Priority Mail for AK/HI/APO/PO Boxes).
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Condition: As New. Julie Evans. Sarah Schultz (illustrator). Unread book in perfect condition.
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Condition: New. Julie Evans. Sarah Schultz (illustrator).
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paperback. Condition: New. Julie Evans. Sarah Schultz (illustrator).
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Life Lessons Through a Teacher's Eyes
First Edition
paperback. Condition: New. Julie Evans. Sarah Schultz (illustrator). First Edition. Ships in a BOX from Central Missouri! UPS shipping for most packages, (Priority Mail for AK/HI/APO/PO Boxes).
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Life Lessons Through a Teacher's Eyes (Hardcover)
Language: English
Published by Association of Christian Schools International, 2008
ISBN 10: 1583310878 ISBN 13: 9781583310878
Hardcover. Condition: new. Julie Evans. Sarah Schultz (illustrator). Hardcover. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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LIFE LESSONS THROUGH A TEACHER'S EYE
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New. Julie Evans. Sarah Schultz (illustrator).
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Life Lessons Through a Teacher's Eyes (Hardcover)
Language: English
Published by Association of Christian Schools International, 2008
ISBN 10: 1583310878 ISBN 13: 9781583310878
Hardcover. Condition: new. Julie Evans. Sarah Schultz (illustrator). Hardcover. Shipping may be from our Sydney, NSW warehouse or from our UK or US warehouse, depending on stock availability.
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Quality Conformance and Qualification of Microelectronic Packages and Interconnects
Seller: Bay State Book Company, North Smithfield, RI, U.S.A.
Seller rating 5 out of 5 stars
Condition: very_good.
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LIFE LESSONS THROUGH A TEACHER'S EYE
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: As New. Julie Evans. Sarah Schultz (illustrator). Unread book in perfect condition.
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Paperback. Condition: Very Good. Same / next day dispatch (Monday - Friday),
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Condition: As New. Unread book in perfect condition.
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Product Integrity and Reliability in Design
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 96.15
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Condition: New.
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Guide to Lead-free Solders : Physical Metallurgy And Reliability
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New.
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Hardcover Feb 28, 2001. Condition: Used: Like New. Inkl. Rechnung nach §19; Buch stammt aus aufgelà ster Buchsammlung; Label, Stempel und Notizen mà glich.
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Guide to Lead-free Solders : Physical Metallurgy And Reliability
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 106.86
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
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Condition: New. pp. 420.
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Quality Conformance and Qualification of Microelectronic Packages and Interconnects
Seller: PBShop.store UK, Fairford, GLOS, United Kingdom
Seller rating 4 out of 5 stars
PAP. Condition: New. New Book. Shipped from UK. Established seller since 2000.
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Condition: As New. Unread book in perfect condition.
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Quality Conformance and Qualification of Microelectronic Packages and Interconnects
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 127.21
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New.
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Taschenbuch. Condition: Neu. Product Integrity and Reliability in Design | Jillian Y. Evans (u. a.) | Taschenbuch | xiv | Englisch | 2012 | Springer London | EAN 9781447110651 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Quality Conformance and Qualification of Microelectronic Packages and Interconnects (Paperback)
Language: English
Published by John Wiley & Sons Inc, New York, 1995
ISBN 10: 0471594369 ISBN 13: 9780471594369
First Edition
Paperback. Condition: new. Paperback. All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests. This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful. * Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata * Physics-of-failure product reliability assessment methods thatcan be proactively implemented throughout the design andmanufacture of the product * Process controls that decrease variabilities in the end productand reduce end-of-line screening and testing A wide range of microelectronic package and interconnectconfigurations for both single-and multi-chip modules is examined,including chip and wire-bonds, tape-automated (TAB), flip-TAB,flip-chip bonds, high-density interconnects, chip-on-board designs(COB), MCM, 3-D stack, and many more. The remaining packageelements, such as die attachment, case and lid, leads, and lid andlead seals are also discussed in detail. The product of a distinguished team of authors and editors, thisbook's guidelines for avoiding potential high-risk manufacturingand qualification problems, as well as for implementing ongoingquality assurance, are sure to prove invaluable to both studentsand practicing professionals. For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGNGUIDELINES: A Focus on Reliability --Michael Pecht This comprehensive guide features a uniquely organized time-phasedapproach to design, development, qualification, manufacture, andin-service management. It provides step-by-step instructions on howto define realistic system requirements, define the system usageenvironment, identify potential failure modes, characterizematerials and processes by the key control label factors, and useexperiment, step-stress, and accelerated methods to ensure optimumdesign before production begins. Topics covered include: detaileddesign guidelines for substrate.wire and wire, tape automated,and flip-chip bonding.element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions. 1993 (0-471-59446-6)454 pp. All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost--effective products should know that the paradigm has shifted. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
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Quality Conformance and Qualification of Microelectronic Packages and Interconnects
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 137.14
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
