Order Total (1 Item Items):
Shipping Destination:
Elfadel Ibrahim (146 results)
Skip to main search results
Search filters
Product Type
- All Product Types
- Books (146)
- Magazines & Periodicals (No further results match this refinement)
- Comics (No further results match this refinement)
- Sheet Music (No further results match this refinement)
- Art, Prints & Posters (No further results match this refinement)
- Photographs (No further results match this refinement)
- Maps (No further results match this refinement)
- Manuscripts & Paper Collectibles (No further results match this refinement)
Condition Learn more
- New (131)
- As New, Fine or Near Fine (9)
- Very Good or Good (1)
- Fair or Poor (No further results match this refinement)
- As Described (5)
Binding
Collectible Attributes
- First Edition (1)
- Signed (No further results match this refinement)
- Dust Jacket (No further results match this refinement)
- Seller-Supplied Images (67)
- Not Print on Demand (81)
Language (1)
Free Shipping
Seller Location
Seller Rating
-
VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things. 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23-25, 2017, Revised and Extended Selected Papers.
Book 212 of 292: IFIP Advances in Information and Communication TechnologySeller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 4 out of 5 stars
XIV, 255 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. IFIP Advances in Information and Communication Technology, Vol. 500. Sprache: Englisch.
-
The IoT Physical Layer. Design and Implementation.
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 4 out of 5 stars
382 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Analog Circuits and Signal Processing Sprache: Englisch.
-
3D Stacked Chips. From Emerging Processes to Heterogeneous Systems.
Language: English
Published by Cham, Springer International Publishing., 2015
ISBN 10: 3319204807 ISBN 13: 9783319204802
Seller: Universitätsbuchhandlung Herta Hold GmbH, Berlin, Germany
Association Member: GIAQ ILAB VDA
Seller rating 4 out of 5 stars
Aufl. 2016. 235 mm x 155 mm, 0 g. XXIII, 339 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Sprache: Englisch.
-
Condition: New.
-
Paperback or Softback. Condition: New. MEMS Accelerometers. Book.
-
Condition: Very Good. Most items will be dispatched the same or the next working day. A copy that has been read, but is in excellent condition. Pages are intact and not marred by notes or highlighting. The spine remains undamaged.
-
-
Condition: As New. Unread book in perfect condition.
-
Condition: As New. Unread book in perfect condition.
-
MEMS Accelerometers
Seller: Rarewaves.com USA, London, LONDO, United Kingdom
Seller rating 5 out of 5 stars
Paperback. Condition: New.
-
3D Stacked Chips
Language: English
Published by Springer International Publishing AG, CH, 2016
ISBN 10: 3319204807 ISBN 13: 9783319204802
Seller: Rarewaves.com USA, London, LONDO, United Kingdom
Seller rating 5 out of 5 stars
Hardback. Condition: New. 1st ed. 2016.
-
MEMS Accelerometers
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New.
-
MEMS Accelerometers
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 47.54
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
-
3D Stacked Chips: From Emerging Processes to Heterogeneous Systems
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 50.43
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
-
3D Stacked Chips: From Emerging Processes to Heterogeneous Systems
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 50.43
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
-
3d Stacked Chips : From Emerging Processes to Heterogeneous Systems
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New.
-
MEMS Accelerometers
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: As New. Unread book in perfect condition.
-
VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things (IFIP Advances in Information and Communication Technology)
Book 212 of 292: IFIP Advances in Information and Communication TechnologySeller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 55.51
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
-
-
Condition: New. pp. 300.
-
3d Stacked Chips : From Emerging Processes to Heterogeneous Systems
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: As New. Unread book in perfect condition.
-
Vlsi-soc: Opportunities And Challenges B
Book 212 of 292: IFIP Advances in Information and Communication TechnologySeller: Kennys Bookshop and Art Galleries Ltd., Galway, GY, Ireland
Seller rating 5 out of 5 stars
Condition: New.
-
-
Hardcover. Condition: Brand New. 9.50x6.50x1.00 inches. In Stock.
-
Vlsi-soc - Opportunities and Challenges Beyond the Internet of Things: 25th Ifip Wg 10.5/Ieee International Conference on Very Large Scale Integration, Vlsi-soc 2017, Abu Dhabi, United Arab Emirates, October 2325, 2017,
Book 212 of 292: IFIP Advances in Information and Communication TechnologyLanguage: English
Published by Springer-Nature New York Inc, 2020
ISBN 10: 3030156656 ISBN 13: 9783030156657
Paperback. Condition: Brand New. 272 pages. 9.25x6.10x0.57 inches. In Stock.
-
-
Condition: As New. Unread book in perfect condition.
-
Condition: As New. Unread book in perfect condition.
-
VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence: 31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, ... and Communication Technology, 680)
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 75.83
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
-
Secure, Low-Power IoT Communication Using Edge-Coded Signaling
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 75.83
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
