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Materials for Advanced Packaging.
Seller: Versandantiquariat buch-im-speicher, Berlin, Germany
Association Member: GIAQ
Seller rating 5 out of 5 stars
£ 22.27
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Add to basketCondition: Gut. 719 S. : Mit Abb., graph. Darst.; Sehr sauber und ohne Lesespuren / Very good condition, maybe unread book. Sprache: Englisch Gewicht in Gramm: 1193 24 cm, roter Org.-Pappb. / red hardcover.
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£ 84.31
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Add to basketCondition: Sehr gut. Zustand: Sehr gut | Sprache: Englisch | Produktart: Bücher.
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£ 84.31
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Add to basketCondition: Hervorragend. Zustand: Hervorragend | Sprache: Englisch | Produktart: Bücher.
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£ 98.11
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Add to basketHardcover. Condition: new. New Copy. Customer Service Guaranteed.
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Materials for Advanced Packaging
Seller: Books From California, Simi Valley, CA, U.S.A.
Seller rating 5 out of 5 stars
£ 141.69
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Add to basketpaperback. Condition: Very Good.
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£ 155.15
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Add to basketCondition: New. pp. 985.
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Materials for Advanced Packaging
Seller: Ria Christie Collections, Uxbridge, United Kingdom
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£ 160.02
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Materials for Advanced Packaging
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
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£ 160.01
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£ 161.67
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Materials for Advanced Packaging
Seller: Ria Christie Collections, Uxbridge, United Kingdom
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£ 170.42
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£ 171.07
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£ 179.05
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Condition: New.
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£ 176.53
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Add to basketBuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
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£ 196.15
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£ 182
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Add to basketGebunden. Condition: New. Provides a comprehensive summary of the most recent advances in materials development for advanced packagingCovers emerging technologies such as digital health, bio-medical, and nano-materials / processing, in addition to microelectronic and optoe.
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£ 160.64
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£ 215.67
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Add to basketCondition: New. pp. 452.
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Materials for Advanced Packaging
Published by Springer International Publishing, Springer Nature Switzerland, 2018
ISBN 10: 3319832093 ISBN 13: 9783319832098
Language: English
£ 209.66
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Add to basketTaschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as well as emerging technologies, to provide readers with the most up-to-date developments in advanced packaging. Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field. New chapters have also been added on fast growing and emerging applications such as flexible and printed electronics, materials solutions to enable next generation thinner/lighter/more functional mobile devices, and functional coating for electronic devices such as anti-fingerprint coating, anti-scratch coating, and more. This book is ideal for professionals in semiconductor, digital health, and bio-medical areas as well as graduate students studying materials science and engineering.
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Paperback. Condition: Like New. Like New. book.
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£ 226.22
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£ 230.68
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Add to basketCondition: New. pp. 732.
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Materials for Advanced Packaging
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
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£ 230.99
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Hardcover. Condition: Like New. Like New. book.
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Materials for Advanced Packaging
Published by Springer International Publishing, Springer Nature Switzerland Jun 2018, 2018
ISBN 10: 3319832093 ISBN 13: 9783319832098
Language: English
Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germany
Seller rating 5 out of 5 stars
£ 209.66
Convert currency£ 30.27 shipping from Germany to United KingdomQuantity: 2 available
Add to basketTaschenbuch. Condition: Neu. Neuware -This second edition continues to be the most comprehensive review on the developments in advanced packaging technologies. Experts in the field discuss established techniques, as well as emerging technologies, to provide readers with the most up-to-date developments in advanced packaging. Original chapters on bonding and joining techniques, nanopackaging and biomedical packaging, MEMS and wafer level chip scale packaging, and packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives have all been updated with the latest developments in the field. New chapters have also been added on fast growing and emerging applications such as flexible and printed electronics, materials solutions to enable next generation thinner/lighter/more functional mobile devices, and functional coating for electronic devices such as anti-fingerprint coating, anti-scratch coating, and more. This book is ideal for professionals in semiconductor, digital health, and bio-medical areas as well as graduate students studying materials science and engineering.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 988 pp. Englisch.
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Materials for Advanced Packaging
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 232.81
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Materials for Advanced Packaging
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 232.82
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Hardcover. Condition: Brand New. 437 pages. 9.00x6.00x1.00 inches. In Stock.
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Hardcover. Condition: Brand New. 1st edition. 719 pages. 9.25x6.25x1.25 inches. In Stock.
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£ 256.89
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