Borst Christopher Lyle (21 results)
Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses. Fundamental Mechanisms and Application to IC Interconnect Technology.
Borst, Christopher Lyle, William N. Gill and Ronald J. Gutmann:
Language: English
Published by Springer 2002
- Hardcover
Seller: Antiquariat Thomas Haker GmbH & Co. KG, Berlin, GermanyAntiquariat Thomas Haker GmbH & Co. KG
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Add to basketHardcover. Condition: Sehr gut. 243 S.; Ill. Very good. Shrink wrapped. Sprache: Englisch Gewicht in Gramm: 685.
Chemical-Mechanical Polishing Of Low Dielectric Constant Polymers And Organosilicate Glasses (Hb)
Borst, Christopher Lyle; Gill, William N.; Gutmann, Ronald J.
- Hardcover
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Chemical-Mechanical Polishing Of Low Dielectric Constant Polymers And Organosilicate Glasses (Hb)
Borst, Christopher Lyle; Gill, William N.; Gutmann, Ronald J.
- Hardcover
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Chemical-Mechanical Polishing Of Low Dielectric Constant Polymers And Organosilicate Glasses (Hb)
Borst, Christopher Lyle; Gill, William N.; Gutmann, Ronald J.
- Hardcover
Seller: SMASS Sellers, IRVING, U.S.A.SMASS Sellers
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Chemical-mechanical Polishing Of Low Dielectric Constant Polymers And Organosilicate Glasses: Fundamental Mechanisms And Application To Ic Interconnect Technology
Borst, Christopher Lyle; Gill, William N.; Gutmann, Ronald J.
- Hardcover
Seller: Romtrade Corp., STERLING HEIGHTS, U.S.A.Romtrade Corp.
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Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnect Technology
Borst, Christopher Lyle; Gill, William N.; Gutmann, Ronald J.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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Condition: New. In.
- Softcover
Seller: Books Puddle, New York, U.S.A.Books Puddle
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Condition: New. pp. 248.
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Taschenbuch. Condition: Neu. Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses | Fundamental Mechanisms and Application to IC Interconnect Technology | Christopher Lyle Borst (u. a.) | Taschenbuch | xiv | Englisch | 2014 | Springer US | EAN 9781461354246 | Verantwortliche Person für die… EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
- Softcover
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagatio…n allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials. The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning.
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
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Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allow…ed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials. The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning.
- Softcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
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Paperback. Condition: Brand New. 243 pages. 9.30x6.20x0.55 inches. In Stock.
- Softcover
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Condition: new. Questo è un articolo print on demand.
- Softcover
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Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
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Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster s…ignal propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials. The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning. 248 pp. Englisch.
- Hardcover
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Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
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Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal p…ropagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials. The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning. 252 pp. Englisch.
- Softcover
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower pow…er and faster signal propagation allo.
- Hardcover
- Print on Demand
Seller: moluna, Greven, Germanymoluna
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Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the… lower power and faster signal propagation allo.
More images- Hardcover
- Print on Demand
Seller: preigu, Osnabrück, Germanypreigu
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Buch. Condition: Neu. Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses | Fundamental Mechanisms and Application to IC Interconnect Technology | Christopher Lyle Borst (u. a.) | Buch | xiv | Englisch | 2002 | Springer US | EAN 9781402071935 | Verantwortliche Person für die EU: Springer…Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu Print on Demand.
- Softcover
- Print on Demand
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
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Condition: New. Print on Demand pp. 248 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.
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Seller: buchversandmimpf2000, Emtmannsberg, Germanybuchversandmimpf2000
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Buch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propa…gation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials.The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 252 pp. Englisch.
Language: English
Published by Springer US, Springer New York Feb 2014 2014
- Softcover
- Print on Demand
Seller: buchversandmimpf2000, Emtmannsberg, Germanybuchversandmimpf2000
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£ 143.27
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Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signa…l propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanical planarization (CMP) process used in Damascene patterning. Low-kappa dielectrics tend to be softer and less chemically reactive than silicon dioxide, providing significant challenges to successful removal and planarization of such materials.The focus of this book is to merge the complex CMP models and mechanisms that have evolved in the past decade with recent experimental results with copper and low-kappa CMP to develop a comprehensive mechanism for low- and high-removal-rate processes. The result is a more in-depth look into the fundamental reaction kinetics that alter, selectively consume, and ultimately planarize a multi-material structure during Damascene patterning.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 248 pp. Englisch.
- Softcover
- Print on Demand
Seller: Biblios, frankfurt am main, GermanyBiblios
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Condition: New. PRINT ON DEMAND pp. 248.
