Borisenko Victor E (91 results)

hardcover. Condition: Very Good. Fast Shipping - Safe and Secure 7 days a week.

Condition: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.…

hardcover. Condition: Very Good. Fast Shipping - Safe and Secure 7 days a week.

hardcover. Condition: Sehr gut. 538 Seiten; 9783527407835.2 Gewicht in Gramm: 500.

Condition: Hervorragend. Zustand: Hervorragend | Seiten: 522 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.

Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

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Condition: New.

Condition: New.

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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.

Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Condition: Sehr gut. Zustand: Sehr gut | Seiten: 376 | Sprache: Englisch | Produktart: Bücher | Rapid thermal processing has contributed to the development of single wafer cluster processing tools and other innovations in integrated circuit manufacturing environments. Borisenko and Hesketh review theoretical and experimental progress in the field, discussing a wide range of materials, processes, and conditions. They thoroughly cover the work of international investigators in the field.…

Condition: New. pp. xxiii + 643.

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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.

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Condition: New. pp. xxiii + 643 Illus.

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Condition: New. In English.

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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - Semiconductors are well known as the main materials of modem solid-state electronics. They have held the attention of researches and engineers since the brilliant invention of the semiconductor transistor by Bardeen, Brattain and v V Shockley in the middle ofthe 20th century. Silicon, germanium, AIIIB and AIIB ) compounds have been widely used in discrete semiconductor devices and microelectronic and nanoelectronic integrated systems. Each ofthese materials has separately met specific physical and technological requirements to provide formation ofsolid-state structures with the best electronic or optical performance. However, attempts to combine them within integrated circuit appear to be ineffective or even technologically impossible. Thus, material and related technological compatibilities are important for further progress, particularly in microelectronics, optoelectronics and nanoelectronics. This stimulates an increasing interest in silicides and silicon-germanium alloys, which provide new prospects for silicon-based integration. Elements from the Periodic Table form more than 180 silicides, which are chemical compounds of silicon with different metals. Most of them, except the silicides of lanthanides and actinides, are shown in Table 1. Along with appropriate compatibility with silicon and easy formation by silicidation in a metal-silicon couple, silicides are characterized by high thermal stability and resistance to oxidation. The majority ofthem are metallic and have low resistivity. Exactly metallic silicides were first employed for interconnections, gates in MOS structures, ohmic contacts, and Schottky barriers in silicon integrated circuits. For a comprehensive overview of their properties and general features of the formation technology the reader may address the books and reviews [1-10]. …

Condition: New. pp. xxii + 607.