Ibrahim M Elfadel (156 results)

XIV, 255 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. IFIP Advances in Information and Communication Technology, Vol. 500. Sprache: Englisch.…

382 p. Hardcover. Versand aus Deutschland / We dispatch from Germany via Air Mail. Einband bestoßen, daher Mängelexemplar gestempelt, sonst sehr guter Zustand. Imperfect copy due to slightly bumped cover, apart from this in very good condition. Stamped. Analog Circuits and Signal Processing Sprache: Englisch. …

Condition: New.

Paperback or Softback. Condition: New. MEMS Accelerometers. Book.

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Condition: As New. Unread book in perfect condition.

Condition: As New. Unread book in perfect condition.

Paperback. Condition: New.

Hardback. Condition: New. 1st ed. 2016. This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size.  The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.…

Condition: New. In.

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Condition: As New. Unread book in perfect condition.

Condition: New. pp. 300.

Condition: New. In.

PF. Condition: New.

Condition: As New. Unread book in perfect condition.

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Condition: New. pp. 257.

Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.…

Hardcover. Condition: Brand New. 9.50x6.50x1.00 inches. In Stock.

Paperback. Condition: Brand New. 272 pages. 9.25x6.10x0.57 inches. In Stock.

Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhabi, United Arab Emirates, in August 2017.The 11 papers included in this book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They addressthe latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design. On the occasion of the silver jubilee of the VLSI-SoC conference series the book also includes a special chapter that presents the history of the VLSI-SoC series of conferences and its relation with VLSI-SoC evolution since the early 80s up to the present.…

Condition: New.

Condition: As New. Unread book in perfect condition.

Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book addresses important aspects of MEMS designs that are well established in engineering practice but rarely discussed in the standard textbooks. One such aspectis the ubiquitous use of tapered beams in the sensing and actuation elements of MEMS designs. As explained in this book, the tapered beam has distinct advantages overthe standard rectangular beam but these advantages are often left unarticulated due to the blind trust in the finite-element models of MEMS devices. In this monograph, the authors take a fundamental, physics-based approach to the modeling of tapered beams in MEMS that is based on a rigorous perturbation analysis of the traditional Euler-Bernoulli beam. The authors demonstrate how perturbation methods combined with symbolic modeling and the tools of computer algebra enable the development of semi-analytical models for tapered-beam MEMS elements. They pay particular attention to the application of these novel models to piezoelectric MEMS energy harvesters with tapered-beam elements, including the development of lumped-parameter circuit models that can be readily used for fast electro-mechanical simulations. Another important aspect of MEMS designs that is extensively addressed in the book is the uncertainty quantification (UQ) of tapered-beam MEMS elements using both Monte Carlo and polynomial chaos expansion methods. These UQ methods are applied to the design of variation-aware piezoelectric energy harvesters.With consistent focus on MEMS devices with tapered beam elements, this up-to-date monograph.…