Wafer Bonding: Applications and Technology: 75 (Springer Series in Materials Science, 75) - Hardcover
Book 57 of 233: Springer Series in Materials Science
Synopsis
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
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During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
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Wafer Bonding
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Wafer Bonding
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Presents the current state of the art in wafer bonding - a technology important to microelectronic device manufacturingPresents the current state of the art in wafer bonding - a technology important to microelectronic device manufacturingInclu. Seller Inventory # 4884987
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Wafer Bonding
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Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator,photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information. 520 pp. Englisch. Seller Inventory # 9783540210498
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Wafer Bonding
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ISBN 10: 3540210490
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Buch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 520 pp. Englisch. Seller Inventory # 9783540210498
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Wafer Bonding : Applications and Technology
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Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator,photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information. Seller Inventory # 9783540210498
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Wafer Bonding: Applications and Technology
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