Wafer Bonding Applications Technology (7 results)

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    • Language: English

      Published by Inst of Engineering & Technology, 2002

      0852960395 / 9780852960394

      • Hardcover

      Seller: Phatpocket Limited, Waltham Abbey, HERTS, United KingdomPhatpocket Limited

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      Condition: Used - Good

      £ 88.95

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      Quantity: 1 available

      Condition: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.

    • Language: English

      Published by Springer, 2011

      3642059155 / 9783642059155

      Series: Book 62 of 233 - Springer Series in Materials Science

      • Softcover

      Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections

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      Condition: New

      £ 291.44

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      Condition: New. In.

    • Language: English

      Published by J.B. Metzler, 2011

      3642059155 / 9783642059155

      Series: Book 62 of 233 - Springer Series in Materials Science

      • Softcover

      Seller: Buchpark, Trebbin, GermanyBuchpark

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      Condition: Used

      £ 257.61

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      Condition: Hervorragend. Zustand: Hervorragend | Seiten: 524 | Sprache: Englisch | Produktart: Bücher | During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from

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      Language: English

      Published by Springer, 2004

      3540210490 / 9783540210498

      Series: Book 62 of 233 - Springer Series in Materials Science

      • Hardcover

      Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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      Condition: New

      £ 341.45

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      Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The to

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      Language: English

      Published by Springer, 2011

      3642059155 / 9783642059155

      Series: Book 62 of 233 - Springer Series in Materials Science

      • Softcover

      Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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      Condition: New

      £ 339.77

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      Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia.

    • Language: English

      Published by Springer Verlag, 2004

      3540210490 / 9783540210498

      Series: Book 62 of 233 - Springer Series in Materials Science

      • Hardcover

      Seller: Revaluation Books, Exeter, United KingdomRevaluation Books

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      Condition: New

      £ 439.68

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      Hardcover. Condition: Brand New. 1st edition. 499 pages. 9.25x6.25x0.75 inches. In Stock.

    • Language: English

      Published by Springer, 2012

      3642059155 / 9783642059155

      Series: Book 62 of 233 - Springer Series in Materials Science

      • Softcover

      Seller: Revaluation Books, Exeter, United KingdomRevaluation Books

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      Condition: New

      £ 438.57

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      Paperback. Condition: Brand New. 514 pages. 9.00x6.10x1.10 inches. In Stock.