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Wafer Bonding Applications Technology (6 results)
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Silicon Wafer Bonding Technology for Vlsi and Mems Applications (Emis Processing Series, 1)
Language: English
Published by Inst of Engineering & Technology, 2002
ISBN 10: 0852960395 ISBN 13: 9780852960394
Seller: Phatpocket Limited, Waltham Abbey, HERTS, United Kingdom
Seller rating 5 out of 5 stars
Condition: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.
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Wafer Bonding: Applications and Technology (Springer Series in Materials Science, 75)
Book 62 of 233: Springer Series in Materials ScienceSeller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 291.44
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Wafer Bonding : Applications and Technology
Book 62 of 233: Springer Series in Materials ScienceLanguage: English
Published by Springer Berlin Heidelberg, Springer Berlin Heidelberg, 2011
ISBN 10: 3642059155 ISBN 13: 9783642059155
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
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Wafer Bonding : Applications and Technology
Book 62 of 233: Springer Series in Materials ScienceLanguage: English
Published by Springer Berlin Heidelberg, Springer Berlin Heidelberg, 2004
ISBN 10: 3540210490 ISBN 13: 9783540210498
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator,photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
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Paperback. Condition: Brand New. 514 pages. 9.00x6.10x1.10 inches. In Stock.
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Hardcover. Condition: Brand New. 1st edition. 499 pages. 9.25x6.25x0.75 inches. In Stock.
