Semiconductor Device Physics Simulation by Yuan J S (16 results)

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    • Language: English

      Published by Springer, 1998

      0306457245 / 9780306457241

      • Hardcover

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      hardcover. Condition: New. In shrink wrap. Looks like an interesting title.

    • Language: English

      Published by Springer, 1998

      0306457245 / 9780306457241

      • Hardcover

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      hardcover. Condition: New. In shrink wrap. Looks like an interesting title.

    • Language: English

      Published by Springer, 1998

      0306457245 / 9780306457241

      • Hardcover

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    • Language: English

      Published by Springer, 2013

      1489919066 / 9781489919069

      • Softcover

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    • Language: English

      Published by Springer, 1998

      0306457245 / 9780306457241

      • Hardcover

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      Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - The advent of the microelectronics technology has made ever-increasing numbers of small devices on a same chip. The rapid emergence of ultra-large-scaled-integrated (ULSI) technology has moved device dimension into the sub-quarter-micron regime and put more than 10 million transistors on a single chip. While traditional closed-form analytical models furnish useful intuition into how semiconductor devices behave, they no longer provide consistently accurate results for all modes of operation of these very small devices. The reason is that, in such devices, various physical mechanisms affect the device performance in a complex manner, and the conventional assumptions (i. e. , one-dimensional treatment, low-level injection, quasi-static approximation, etc. ) em ployed in developing analytical models become questionable. Thus, the use of numerical device simulation becomes important in device modeling. Researchers and engineers will rely even more on device simulation for device design and analysis in the future. This book provides comprehensive coverage of device simulation and analysis for various modem semiconductor devices. It will serve as a reference for researchers, engineers, and students who require in-depth, up-to-date information and understanding of semiconductor device physics and characteristics. The materials of the book are limited to conventional and mainstream semiconductor devices; photonic devices such as light emitting and laser diodes are not included, nor does the book cover device modeling, device fabrication, and circuit applications.

    • Language: English

      Published by Springer, 2013

      1489919066 / 9781489919069

      • Softcover

      Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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      Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - The advent of the microelectronics technology has made ever-increasing numbers of small devices on a same chip. The rapid emergence of ultra-large-scaled-integrated (ULSI) technology has moved device dimension into the sub-quarter-micron regime and put more than 10 million transistors on a single chip. While traditional closed-form analytical models furnish useful intuition into how semiconductor devices behave, they no longer provide consistently accurate results for all modes of operation of these very small devices. The reason is that, in such devices, various physical mechanisms affect the device performance in a complex manner, and the conventional assumptions (i. e. , one-dimensional treatment, low-level injection, quasi-static approximation, etc. ) em ployed in developing analytical models become questionable. Thus, the use of numerical device simulation becomes important in device modeling. Researchers and engineers will rely even more on device simulation for device design and analysis in the future. This book provides comprehensive coverage of device simulation and analysis for various modem semiconductor devices. It will serve as a reference for researchers, engineers, and students who require in-depth, up-to-date information and understanding of semiconductor device physics and characteristics. The materials of the book are limited to conventional and mainstream semiconductor devices; photonic devices such as light emitting and laser diodes are not included, nor does the book cover device modeling, device fabrication, and circuit applications.

    • Language: English

      Published by Springer, 2013

      1489919066 / 9781489919069

      • Softcover

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      Taschenbuch. Condition: Neu. Semiconductor Device Physics and Simulation | J. S. Yuan (u. a.) | Taschenbuch | xii | Englisch | 2013 | Springer | EAN 9781489919069 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

    • Language: English

      Published by Springer, 1998

      0306457245 / 9780306457241

      • Hardcover

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    • Language: English

      Published by Springer, 2013

      1489919066 / 9781489919069

      • Softcover

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      Condition: New. pp. 352.

    • Language: English

      Published by Springer Science Business Media, 1998

      0306457245 / 9780306457241

      • Hardcover

      Seller: Mooney's bookstore, Den Helder, NetherlandsMooney's bookstore

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    • Language: English

      Published by Springer, 2013

      1489919066 / 9781489919069

      • Softcover
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      Condition: new. Questo è un articolo print on demand.

    • Language: English

      Published by Springer US, 1998

      0306457245 / 9780306457241

      • Hardcover
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      Gebunden. Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. The advent of the microelectronics technology has made ever-increasing numbers of small devices on a same chip. The rapid emergence of ultra-large-scaled-integrated (ULSI) technology has moved device dimension into the sub-quarter-micron regime and put more.

    • Language: English

      Published by Springer US, 2013

      1489919066 / 9781489919069

      • Softcover
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      Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. The advent of the microelectronics technology has made ever-increasing numbers of small devices on a same chip. The rapid emergence of ultra-large-scaled-integrated (ULSI) technology has moved device dimension into the sub-quarter-micron regime and put more.

    • Language: English

      Published by Springer, Springer Jun 2013, 2013

      1489919066 / 9781489919069

      • Softcover
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      Taschenbuch. Condition: Neu. This item is printed on demand - Print on Demand Titel. Neuware -The advent of the microelectronics technology has made ever-increasing numbers of small devices on a same chip. The rapid emergence of ultra-large-scaled-integrated (ULSI) technology has moved device dimension into the sub-quarter-micron regime and put more than 10 million transistors on a single chip. While traditional closed-form analytical models furnish useful intuition into how semiconductor devices behave, they no longer provide consistently accurate results for all modes of operation of these very small devices. The reason is that, in such devices, various physical mechanisms affect the device performance in a complex manner, and the conventional assumptions (i. e. , one-dimensional treatment, low-level injection, quasi-static approximation, etc. ) em ployed in developing analytical models become questionable. Thus, the use of numerical device simulation becomes important in device modeling. Researchers and engineers will rely even more on device simulation for device design and analysis in the future. This book provides comprehensive coverage of device simulation and analysis for various modem semiconductor devices. It will serve as a reference for researchers, engineers, and students who require in-depth, up-to-date information and understanding of semiconductor device physics and characteristics. The materials of the book are limited to conventional and mainstream semiconductor devices; photonic devices such as light emitting and laser diodes are not included, nor does the book cover device modeling, device fabrication, and circuit applications.Springer-Verlag KG, Sachsenplatz 4-6, 1201 Wien 352 pp. Englisch.

    • Language: English

      Published by Springer, 2013

      1489919066 / 9781489919069

      • Softcover
      • Print on Demand

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      Condition: New. Print on Demand pp. 352 66:B&W 7 x 10 in or 254 x 178 mm Perfect Bound on White w/Gloss Lam.

    • Language: English

      Published by Springer, 2013

      1489919066 / 9781489919069

      • Softcover
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      Condition: New. PRINT ON DEMAND pp. 352.