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Practical Guide Packaging Electronics (42 results)
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Practical Guide to the Packaging of Electronics, Second Edition: Thermal and Mechanical Design and Analysis (Dekker Mechanical Engineering)
Seller: World of Books (was SecondSale), Montgomery, IL, U.S.A.
Seller rating 5 out of 5 stars
Condition: Very Good. Item in very good condition! Textbooks may not include supplemental items i.e. CDs, access codes etc.
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Practical Guide to the Packaging of Electronics, Second Edition: Thermal and Mechanical Design and Analysis (Dekker Mechanical Engineering)
Seller: World of Books (was SecondSale), Montgomery, IL, U.S.A.
Seller rating 5 out of 5 stars
Condition: Good. Item in good condition and has highlighting/writing on text. Used texts may not contain supplemental items such as CDs, info-trac etc.
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Condition: As New. Unread book in perfect condition.
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Condition: New.
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Condition: New.
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Practical Guide to the Packaging of Electronics
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
Condition: New. In.
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition
Published by Taylor & Francis Ltd, 2021
ISBN 10: 1032097825 ISBN 13: 9781032097824
Language: English
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
Paperback / softback. Condition: New. New copy - Usually dispatched within 4 working days. 185.
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Practical Guide to the Packaging of Electronics : Thermal and Mechanical Design and Analysis
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: New.
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Practical Guide to the Packaging of Electronics : Thermal and Mechanical Design and Analysis
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
Condition: As New. Unread book in perfect condition.
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Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis (Mechanical Engineering)
Published by Crc Press, 2002
ISBN 10: 1840647175 ISBN 13: 9781840647174
Condition: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Clean from markings. With owner's name inside cover. In good all round condition. Dust jacket in good condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,850grams, ISBN:9781840647174.
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Paperback. Condition: Brand New. 3rd new edition. 374 pages. 9.21x6.14x0.98 inches. In Stock.
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Condition: New.
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Hardcover. Condition: new. Excellent Condition.Excels in customer satisfaction, prompt replies, and quality checks.
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Condition: New. 4th edition NO-PA16APR2015-KAP.
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Practical Guide for the Reliable Packaging of Electronics: Thermal and Mechanical Design and Analysis
Published by Taylor & Francis Ltd, 2025
ISBN 10: 1032881143 ISBN 13: 9781032881140
Language: English
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
Hardback. Condition: New. New copy - Usually dispatched within 4 working days. 770.
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Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition
Published by Taylor & Francis Group, 2016
ISBN 10: 1498753957 ISBN 13: 9781498753951
Language: English
Condition: New. pp. 280.
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Practical Guide for the Reliable Packaging of Electronics (Hardcover)
Published by Taylor & Francis Ltd, London, 2025
ISBN 10: 1032881143 ISBN 13: 9781032881140
Language: English
Hardcover. Condition: new. Hardcover. A definitive guide for both newcomers to the field and those in need of a refresher, the fourth edition of Practical Guide to the Reliable Packaging of Electronics provides a comprehensive understanding of the thermal and mechanical aspects of electromechanical system design, along with insights into potential failures. This edition equips design engineers with the tools to assess their work in the early stages of development, helping them identify and address weak points before they lead to system failures.As the demand for integrating more electronic capabilities into smaller packages continues to rise, product developers and manufacturers must carefully consider how module placement and component selection impact performance. This updated edition features expanded content, including advancements in cooling technologies and materials, guidance on vibration isolation and design challenges, deeper insights into system and subsystem reliability, robust test method development, and a newly added section on applying Six Sigma DMAIC methodology for thermal and mechanical failure analysis.By consulting this essential resource, engineers, program managers, and quality assurance professionals involved in electromechanical systems will gain a solid foundation in electronics packaging. Readers will learn to establish design guidelines, recognize potential reliability issues, and perform more thorough analyses, ultimately leading to more reliable and efficient system designs. The fourth edition of Practical Guide to the Reliable Packaging of Electronics provides a comprehensive understanding of the thermal and mechanical aspects of electromechanical system design, along with insights into potential failures. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
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Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition
Published by Taylor & Francis Inc, 2016
ISBN 10: 1498753957 ISBN 13: 9781498753951
Language: English
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Seller rating 5 out of 5 stars
Hardback. Condition: New. New copy - Usually dispatched within 4 working days.
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Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition
Published by Taylor & Francis Group, 2016
ISBN 10: 1498753957 ISBN 13: 9781498753951
Language: English
Condition: New. pp. 280.
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Hardcover. Condition: Brand New. 4th edition. 352 pages. 9.18x6.12x9.45 inches. In Stock.
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Hardcover. Condition: Brand New. 3rd revised edition. 280 pages. 9.25x6.14x1.02 inches. In Stock.
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Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition
Published by Taylor & Francis Group, 2016
ISBN 10: 1498753957 ISBN 13: 9781498753951
Language: English
Condition: New. pp. 280.
