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Microwave Microelectronics Packaging (40 results)
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RF and Microwave Microelectronics Packaging II
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 81.52
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Paperback. Condition: New.
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Condition: New.
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RF and Microwave Microelectronics Packaging II
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 117.36
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Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Condition: New.
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RF and Microwave Microelectronics Packaging
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 137.84
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Ships from United Kingdom to U.S.A.Quantity: Over 20 available
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RF and Microwave Microelectronics Packaging
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 137.84
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Rf and Microwave Microelectronics Packaging
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 137.83
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Condition: New. pp. 184.
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Taschenbuch. Condition: Neu. RF and Microwave Microelectronics Packaging II | Ken Kuang (u. a.) | Taschenbuch | xii | Englisch | 2018 | Springer | EAN 9783319847191 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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RF and Microwave Microelectronics Packaging II
Language: English
Published by Springer International Publishing, Springer International Publishing, 2017
ISBN 10: 3319516965 ISBN 13: 9783319516967
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to 'RF and Microwave Microelectronics Packaging' (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
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Hardcover. Condition: Brand New. 172 pages. 9.25x6.25x0.50 inches. In Stock.
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Taschenbuch. Condition: Neu. RF and Microwave Microelectronics Packaging | Ken Kuang (u. a.) | Taschenbuch | xvi | Englisch | 2014 | Springer | EAN 9781489983244 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
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Condition: New. pp. 304.
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Condition: Sehr gut. Zustand: Sehr gut | Seiten: 285 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.
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RF and Microwave Microelectronics Packaging
Language: English
Published by Springer New York, Springer US, 2014
ISBN 10: 1489983244 ISBN 13: 9781489983244
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
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Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
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Paperback. Condition: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
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Rf and Microwave Microelectronics Packaging
Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Seller rating 5 out of 5 stars
£ 198.99
£ 15 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: As New. Unread book in perfect condition.
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Paperback. Condition: Like New. Like New. book.
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Condition: As New. Unread book in perfect condition.
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RF and Microwave Microelectronics Packaging
Seller: BUCHSERVICE / ANTIQUARIAT Lars Lutzer, Wahlstedt, Germany
Seller rating 5 out of 5 stars
Hardcover. Condition: gut. 2009. RF and Microwave Microelectronics Packaging In deutscher Sprache. pages.
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Condition: new. Questo è un articolo print on demand.
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Condition: new. Questo è un articolo print on demand.
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RF and Microwave Microelectronics Packaging II
Language: English
Published by Springer International Publishing, Springer Nature Switzerland Jun 2018, 2018
ISBN 10: 3319847198 ISBN 13: 9783319847191
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to 'RF and Microwave Microelectronics Packaging' (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics. 188 pp. Englisch.
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RF and Microwave Microelectronics Packaging
Language: English
Published by Springer US Sep 2014, 2014
ISBN 10: 1489983244 ISBN 13: 9781489983244
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. 304 pp. Englisch.
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RF and Microwave Microelectronics Packaging II
Language: English
Published by Springer International Publishing, Springer Nature Switzerland Mär 2017, 2017
ISBN 10: 3319516965 ISBN 13: 9783319516967
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to 'RF and Microwave Microelectronics Packaging' (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics. 188 pp. Englisch.
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RF and Microwave Microelectronics Packaging II
Language: English
Published by Springer International Publishing, 2018
ISBN 10: 3319847198 ISBN 13: 9783319847191
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Ken Kuang is President of Torrey Hills Technologies, LLC, a leader in the supply of quality microelectronics packaging components. From 2004-2013, Kuang led Torrey Hills to rank #188 in INC500 Fast Growing Private Companies in America and rank #2 in Sa.
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RF and Microwave Microelectronics Packaging II
Language: English
Published by Springer International Publishing, 2017
ISBN 10: 3319516965 ISBN 13: 9783319516967
Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysisBridges the gap between low cost commercial and hi-res RF/Microwave packaging technologiesEngages in an in-depth discussion of challenges in .
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RF and Microwave Microelectronics Packaging
Language: English
Published by SPRINGER US Nov 2009, 2009
ISBN 10: 1441909834 ISBN 13: 9781441909831
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, Germany
Seller rating 5 out of 5 stars
Buch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields. 285 pp. Englisch.
