Microwave Microelectronics Packaging (45 results)
- Softcover
Seller: Chiron Media, Wallingford, United KingdomChiron Media
Contact seller5-star sellerCondition: New
£ 79.07
£ 15.49 shippingShips from United Kingdom to U.S.A.Quantity: 10 available
Paperback. Condition: New.
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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£ 81.52
£ 11.98 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New. In.
- Hardcover
Seller: ThriftBooks-Atlanta, AUSTELL, GA, U.S.A.ThriftBooks-Atlanta
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£ 102.28
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Hardcover. Condition: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less.
- Hardcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
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£ 103.84
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Condition: Brand New. New. Delivery takes 25-30 days. Excellent Customer Service.
- Softcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
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£ 103.84
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Condition: Brand New. New. Delivery takes 25-30 days. Excellent Customer Service.
- Softcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
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£ 116.82
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Condition: Brand New. New. Delivery takes 25-30 days. Excellent Customer Service.
- Hardcover
Seller: Basi6 International, Irving, TX, U.S.A.Basi6 International
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£ 116.82
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Condition: Brand New. New. Delivery takes 25-30 days. Excellent Customer Service.
- Hardcover
Seller: California Books, Miami, FL, U.S.A.California Books
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£ 127.51
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Condition: New.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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£ 117.36
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Condition: New. In.
Rf and Microwave Microelectronics Packaging
Kuang, Ken (EDT); Kim, Franklin (EDT); Cahill, Sean S. (EDT)
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
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£ 144.31
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Condition: New.
Rf and Microwave Microelectronics Packaging
Kuang, Ken (EDT); Kim, Franklin (EDT); Cahill, Sean S. (EDT)
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
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£ 131.82
£ 15.00 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: New.
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
£ 150.55
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Condition: New. pp. 184.
- Hardcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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£ 137.84
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Condition: New. In.
- Softcover
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
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£ 137.84
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Condition: New. In.
- Softcover
Seller: preigu, Osnabrück, Germanypreigu
Contact seller5-star sellerCondition: New
£ 107.57
£ 59.85 shippingShips from Germany to U.S.A.Quantity: 5 available
Taschenbuch. Condition: Neu. RF and Microwave Microelectronics Packaging II | Ken Kuang (u. a.) | Taschenbuch | xii | Englisch | 2018 | Springer | EAN 9783319847191 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
Language: English
Published by Springer International Publishing, Springer International Publishing, 2017
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
£ 122.49
£ 53.24 shippingShips from Germany to U.S.A.Quantity: 1 available
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to 'RF and Microwave Microelectronics Packaging' (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechan…ical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
- Hardcover
Seller: Revaluation Books, Exeter, United KingdomRevaluation Books
Contact seller5-star sellerCondition: New
£ 160.97
£ 12.50 shippingShips from United Kingdom to U.S.A.Quantity: 2 available
Hardcover. Condition: Brand New. 172 pages. 9.25x6.25x0.50 inches. In Stock.
- Softcover
Seller: Books Puddle, New York, NY, U.S.A.Books Puddle
Contact seller4-star sellerCondition: New
£ 181.00
£ 2.96 shippingShips within U.S.A.Quantity: 4 available
Condition: New. pp. 304.
More images- Softcover
Seller: preigu, Osnabrück, Germanypreigu
Contact seller5-star sellerCondition: New
£ 123.37
£ 59.85 shippingShips from Germany to U.S.A.Quantity: 5 available
Taschenbuch. Condition: Neu. RF and Microwave Microelectronics Packaging | Ken Kuang (u. a.) | Taschenbuch | xvi | Englisch | 2014 | Springer | EAN 9781489983244 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.
- Hardcover
Seller: Buchpark, Trebbin, GermanyBuchpark
Contact seller5-star sellerCondition: Used - Fine
£ 108.83
£ 89.77 shippingShips from Germany to U.S.A.Quantity: 1 available
Condition: Sehr gut. Zustand: Sehr gut | Seiten: 285 | Sprache: Englisch | Produktart: Bücher | Keine Beschreibung verfügbar.
- Softcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
£ 148.59
£ 53.28 shippingShips from Germany to U.S.A.Quantity: 1 available
Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic resea…rchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
- Hardcover
Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH
Contact seller5-star sellerCondition: New
£ 148.59
£ 54.02 shippingShips from Germany to U.S.A.Quantity: 2 available
Buch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers…interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
- Softcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: New
£ 186.00
£ 25.00 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Paperback. Condition: New. NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Rf and Microwave Microelectronics Packaging
Kuang, Ken (EDT); Kim, Franklin (EDT); Cahill, Sean S. (EDT)
- Softcover
Seller: GreatBookPricesUK, Woodford Green, United KingdomGreatBookPricesUK
Contact seller5-star sellerCondition: Used - As new
£ 222.99
£ 15.00 shippingShips from United Kingdom to U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
- Softcover
Seller: Mispah books, Redhill, SURRE, United KingdomMispah books
Contact seller4-star sellerCondition: Used - As new
£ 215.00
£ 25.00 shippingShips from United Kingdom to U.S.A.Quantity: 1 available
Paperback. Condition: Like New. LIKE NEW. SHIPS FROM MULTIPLE LOCATIONS. book.
Rf and Microwave Microelectronics Packaging
Kuang, Ken (EDT); Kim, Franklin (EDT); Cahill, Sean S. (EDT)
- Softcover
Seller: GreatBookPrices, Columbia, MD, U.S.A.GreatBookPrices
Contact seller5-star sellerCondition: Used - As new
£ 252.22
£ 1.96 shippingShips within U.S.A.Quantity: Over 20 available
Condition: As New. Unread book in perfect condition.
- Hardcover
Seller: BUCHSERVICE / ANTIQUARIAT Lars Lutzer, Wahlstedt, GermanyBUCHSERVICE / ANTIQUARIAT Lars Lutzer
Contact seller5-star sellerCondition: Used - Very good
£ 325.75
£ 34.16 shippingShips from Germany to U.S.A.Quantity: 1 available
Hardcover. Condition: gut. 2009. RF and Microwave Microelectronics Packaging In englischer Sprache. pages.
- Softcover
- Print on Demand
Seller: Brook Bookstore On Demand, Napoli, NA, ItalyBrook Bookstore On Demand
Contact seller5-star sellerCondition: New
£ 97.10
£ 4.70 shippingShips from Italy to U.S.A.Quantity: Over 20 available
Condition: new. Questo è un articolo print on demand.
- Hardcover
- Print on Demand
Seller: Brook Bookstore On Demand, Napoli, NA, ItalyBrook Bookstore On Demand
Contact seller5-star sellerCondition: New
£ 97.10
£ 5.81 shippingShips from Italy to U.S.A.Quantity: Over 20 available
Condition: new. Questo è un articolo print on demand.
Language: English
Published by Springer International Publishing, Springer Nature Switzerland Jun 2018, 2018
- Softcover
- Print on Demand
Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.
Contact seller5-star sellerCondition: New
£ 122.49
£ 19.66 shippingShips from Germany to U.S.A.Quantity: 2 available
Taschenbuch. Condition: Neu. This item is printed on demand - it takes 3-4 days longer - Neuware -This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to 'RF and Microwave Microelectronics Packaging' (2010) and covers the latest developments in thermal management, elect…rical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics. 188 pp. Englisch.
