Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
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Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
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Language: English
Published by Cambridge University Press 2014-05, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
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Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
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Language: English
Published by Cambridge University Press CUP, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
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Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
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Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
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Taschenbuch. Condition: Neu. Druck auf Anfrage Neuware - Printed after ordering - The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects.
Language: English
Published by Cambridge University Press, Cambridge, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
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Paperback. Condition: new. Paperback. The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This item is printed on demand. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
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Paperback. Condition: Brand New. 1st edition. 422 pages. 8.90x6.00x1.00 inches. In Stock. This item is printed on demand.
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Published by Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
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Add to basketPaperback / softback. Condition: New. This item is printed on demand. New copy - Usually dispatched within 5-9 working days.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
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Condition: New. Print on Demand pp. 422.
Language: English
Published by Cambridge University Press, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
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Condition: New. PRINT ON DEMAND pp. 422.
Language: English
Published by Cambridge University Press, Cambridge, 2014
ISBN 10: 1107409225 ISBN 13: 9781107409224
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Paperback. Condition: new. Paperback. The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This item is printed on demand. Shipping may be from our UK warehouse or from our Australian or US warehouses, depending on stock availability.
Language: English
Published by Cambridge University Press, 2012
ISBN 10: 1107409225 ISBN 13: 9781107409224
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Condition: New. Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.KlappentextThe MRS Symposium Proceeding series is an internationally recognised reference suitable for research.