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Language: English
Published by Taylor & Francis Ltd, 2021
ISBN 10: 1032095547 ISBN 13: 9781032095547
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Paperback / softback. Condition: New. New copy - Usually dispatched within 4 working days.
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Paperback. Condition: Brand New. 233 pages. 9.21x6.14x0.47 inches. In Stock.
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Language: English
Published by Taylor & Francis Ltd Jun 2021, 2021
ISBN 10: 1032095547 ISBN 13: 9781032095547
Seller: AHA-BUCH GmbH, Einbeck, Germany
Taschenbuch. Condition: Neu. Neuware - The goal of this book is to provide an understanding of the latest challenges and issues in 3D integration. The term 3D integration includes a variety of integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D I.
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Published by CRC Press 2018-04-24, 2018
ISBN 10: 1138710393 ISBN 13: 9781138710399
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Seller: GreatBookPricesUK, Woodford Green, United Kingdom
Condition: As New. Unread book in perfect condition.
Language: English
Published by Taylor & Francis Ltd, 2018
ISBN 10: 1138710393 ISBN 13: 9781138710399
Seller: THE SAINT BOOKSTORE, Southport, United Kingdom
Hardback. Condition: New. New copy - Usually dispatched within 4 working days.
Language: English
Published by Taylor & Francis Ltd Apr 2018, 2018
ISBN 10: 1138710393 ISBN 13: 9781138710399
Seller: AHA-BUCH GmbH, Einbeck, Germany
Buch. Condition: Neu. Neuware.
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