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Fundamentals Microelectronics (109 results)
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Hardcover. Condition: Good. No Jacket. Former library book; Missing dust jacket; Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less 0.85.
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Hardcover. Condition: Good. Ex-Library hardcover with dj with the usual markings, attachments, and library wear. Sunned spine. Except for library markings, interior clean and unmarked. Tight binding.
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Fundamentals of Microelectronics
Seller: Goodwill of Silicon Valley, SAN JOSE, CA, U.S.A.
Seller rating 4 out of 5 stars
Condition: acceptable. Supports Goodwill of Silicon Valley job training programs. The cover and pages are in Acceptable condition! Any other included accessories are also in Acceptable condition showing use. Use can include some highlighting and writing, page and cover creases as well as other types visible wear such as cover tears discoloration, staining, marks, scuffs, etc. All pages intact.
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Hardcover. Condition: Very Good. No Jacket. May have limited writing in cover pages. Pages are unmarked. ~ ThriftBooks: Read More, Spend Less 2.
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Thick Film Technology: Fundamentals and Applications in Microelectronics
Published by Hayden Book Co., Rochelle Park, N.J.
ISBN 10: 0810458039 ISBN 13: 9780810458031
Language: English
First Edition
Hardcover. Condition: Good. No Jacket. First Edition. Former library book - else Very Good condition without a dust jacket. The covers are in great shape with some rubbing to the edges. The binding is square and tight. The interior pages are clean and unmarked. The book will be carefully packaged for shipment for protection from the elements. USPS electronic tracking number issued free of charge.
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Condition: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has soft covers. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,800grams, ISBN:9780071007962.
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Fundamentals of Microelectronics Processing
Published by McGraw-Hill Education, 1994
ISBN 10: 0071007962 ISBN 13: 9780071007962
Language: English
Seller: Better World Books Ltd, Dunfermline, United Kingdom
Seller rating 5 out of 5 stars
Condition: Good. International Ed. Ships from the UK. Former library book; may include library markings. Used book that is in clean, average condition without any missing pages.
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Hardcover. Condition: UsedGood. Hardcover; surplus library copy with the usual stampings; fading and edge wear to exterior; corners bumped; otherwise in good condition with clean text, firm binding.
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Soft cover. Condition: New. 3rd Edition. Brand New US Edition textbook. Ship from Multiple Locations, including Asia , Hong Kong ,Taiwan , US or Canada depend on stock location. CD/DVD or access codes may not be included.
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Fundamentals of Microelectronics
Published by John Wiley & Sons, Limited, 2021
ISBN 10: 1119695147 ISBN 13: 9781119695141
Language: English
Condition: Brand New.
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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hardcover. Condition: Good.
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Hardcover. Condition: Good. 2. It's a preowned item in good condition and includes all the pages. It may have some general signs of wear and tear, such as markings, highlighting, slight damage to the cover, minimal wear to the binding, etc., but they will not affect the overall reading experience.
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paperback. Condition: Good. 3rd ed. Ships in a BOX from Central Missouri! May not include working access code. Will not include dust jacket. Has used sticker(s) and some writing or highlighting. UPS shipping for most packages, (Priority Mail for AK/HI/APO/PO Boxes).
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paperback. Condition: New. 3rd ed. Ships in a BOX from Central Missouri! UPS shipping for most packages, (Priority Mail for AK/HI/APO/PO Boxes).
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Condition: very_good. Book is in very good condition. Clean with little to no signs of wear or markings highlights.
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Thick Film Technology: Fundamentals and Applications in Microelectronics
Published by Hasbrouck Heights, New Jersey, U.S.A.: Hayden Book Co, 1973
ISBN 10: 0810458039 ISBN 13: 9780810458031
Language: English
First Edition
Hardcover. Condition: Near Fine. Dust Jacket Condition: Very Good. 1st Edition. hardback book in near fine condition,dust jacket is very good.
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Condition: Poor. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Book contains pencil markings. In poor condition, suitable as a reading copy. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1850grams, ISBN:9780471478461.
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Brand new book. Fast ship. Please provide full street address as we are not able to ship to P O box address.
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Microelectronics: From Fundamentals to Applied Design
Seller: Phatpocket Limited, Waltham Abbey, HERTS, United Kingdom
Seller rating 5 out of 5 stars
Condition: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.
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Hardcover. Condition: Sehr gut. 1. Auflage. Unread book in excellent condition. Language - English. Ships from Berlin. - This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
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hardcover. Condition: Acceptable.
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Condition: New. Supporting Bay Area Friends of the Library since 2010. Well packaged and promptly shipped.
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Condition: New.
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Paperback. Condition: new. Excellent Condition.Excels in customer satisfaction, prompt replies, and quality checks.
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Microelectronics: From Fundamentals to Applied Design
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
Condition: New. In.
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Condition: New.
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Condition: Used.
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