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Fundamentals Microelectronics (112 results)
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Hardcover. Condition: Good. No Jacket. Former library book; Missing dust jacket; Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less 0.85.
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Hardcover. Condition: Good. Ex-Library hardcover with dj with the usual markings, attachments, and library wear. Sunned spine. Except for library markings, interior clean and unmarked. Tight binding.
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hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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Thick Film Technology: Fundamentals and Applications in Microelectronics
Language: English
Published by Hayden Book Co., Rochelle Park, N.J.
ISBN 10: 0810458039 ISBN 13: 9780810458031
First Edition
Hardcover. Condition: Good. No Jacket. First Edition. Former library book - else Very Good condition without a dust jacket. The covers are in great shape with some rubbing to the edges. The binding is square and tight. The interior pages are clean and unmarked. The book will be carefully packaged for shipment for protection from the elements. USPS electronic tracking number issued free of charge.
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Fundamentals of Microelectronics Processing
Language: English
Published by McGraw-Hill Education, 1994
ISBN 10: 0071007962 ISBN 13: 9780071007962
Seller: Better World Books Ltd, Dunfermline, United Kingdom
Seller rating 5 out of 5 stars
Condition: Good. International Ed. Ships from the UK. Former library book; may include library markings. Used book that is in clean, average condition without any missing pages.
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Condition: Good. This is an ex-library book and may have the usual library/used-book markings inside.This book has soft covers. In good all round condition. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,800grams, ISBN:9780071007962.
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Hardcover. Condition: UsedGood. Hardcover; surplus library copy with the usual stampings; fading and edge wear to exterior; corners bumped; otherwise in good condition with clean text, firm binding.
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Hardcover. Condition: Good. Connecting readers with great books since 1972! Used textbooks may not include companion materials such as access codes, etc. May have some wear or writing/highlighting. We ship orders daily and Customer Service is our top priority!
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Condition: good. Book shows general signs of use and handling. May have light wear on the cover or edges and minimal writing or highlighting. Binding remains tight, and pages are clean and readable.
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Fundamentals of Microelectronics
Seller: Sugarhouse Book Works, LLC, Salt Lake City, UT, U.S.A.
Seller rating 5 out of 5 stars
hardcover. Condition: VeryGood. As pictured. Very light edge wear. No marks throughout. Carefully packed and promptly shipped.
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Condition: acceptable. Fairly worn, but readable and intact. If applicable: Dust jacket, disc or access code may not be included.
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hardcover. Condition: Very Good.
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paperback. Condition: Good. 3rd ed. Ships in a BOX from Central Missouri! May not include working access code. Will not include dust jacket. Has used sticker(s) and some writing or highlighting. UPS shipping for most packages, (Priority Mail for AK/HI/APO/PO Boxes).
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paperback. Condition: New. 3rd ed. Ships in a BOX from Central Missouri! UPS shipping for most packages, (Priority Mail for AK/HI/APO/PO Boxes).
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Condition: Brand New. New. US edition. Expediting shipping for all USA and Europe orders excluding PO Box. Excellent Customer Service.
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Condition: New. This is a Brand-new US Edition. This Item may be shipped from US or any other country as we have multiple locations worldwide.
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Thick Film Technology: Fundamentals and Applications in Microelectronics
Language: English
Published by Hasbrouck Heights, New Jersey, U.S.A.: Hayden Book Co, 1973
ISBN 10: 0810458039 ISBN 13: 9780810458031
First Edition
Hardcover. Condition: Near Fine. Dust Jacket Condition: Very Good. 1st Edition. hardback book in near fine condition,dust jacket is very good.
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Fundamentals of Microelectronics
Seller: Phatpocket Limited, Waltham Abbey, HERTS, United Kingdom
Seller rating 5 out of 5 stars
Condition: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.
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Condition: Very Good. Most items will be dispatched the same or the next working day. A copy that has been read, but is in excellent condition. Pages are intact and not marred by notes or highlighting. The spine remains undamaged.
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Condition: Poor. This is an ex-library book and may have the usual library/used-book markings inside.This book has hardback covers. Book contains pencil markings. In poor condition, suitable as a reading copy. No dust jacket. Please note the Image in this listing is a stock photo and may not match the covers of the actual item,1850grams, ISBN:9780471478461.
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Microelectronics: From Fundamentals to Applied Design
Seller: Phatpocket Limited, Waltham Abbey, HERTS, United Kingdom
Seller rating 5 out of 5 stars
Condition: Good. Your purchase helps support Sri Lankan Children's Charity 'The Rainbow Centre'. Ex-library, so some stamps and wear, but in good overall condition. Our donations to The Rainbow Centre have helped provide an education and a safe haven to hundreds of children who live in appalling conditions.
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Hardcover. Condition: Sehr gut. 1. Auflage. Unread book in excellent condition. Language - English. Ships from Berlin. - This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.
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Condition: good. May show signs of wear, highlighting, writing, and previous use. This item may be a former library book with typical markings. No guarantee on products that contain supplements Your satisfaction is 100% guaranteed. Twenty-five year bookseller with shipments to over fifty million happy customers.
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Condition: New. Supporting Bay Area Friends of the Library since 2010. Well packaged and promptly shipped.
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Condition: New.
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Condition: New.
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Paperback. Condition: New. THE BOOK IS IN NEW CONDITION. MAY HAVE MINOR SHELF WEAR.MULTIPLE COPIES AVAILABLE. FAST SHIPPING. WE OFFER FREE TRACKING NUMBER UPON FAST SHIPMENT OF YOUR ORDER. PLEASE LET US KNOW IF YOU HAVE ANY QUESTIONS AND WE WILL GET BACK TO YOU ASAP. Thank you for your interest.
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Microelectronics: From Fundamentals to Applied Design
Seller: Ria Christie Collections, Uxbridge, United Kingdom
Seller rating 5 out of 5 stars
£ 77.99
£ 11.98 shipping
Ships from United Kingdom to U.S.A.Quantity: Over 20 available
Add to basketCondition: New. In.
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Condition: Used.
